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IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-10, Vol.12 (10), p.1-1
2022
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2022 IEEE 67th Holm Conference on Electrical Contacts (HLM), 2022, p.1-8
2022
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Semiconductor science and technology, 2016-10, Vol.31 (10), p.103002
2016
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Nanotechnology, 2016-08, Vol.27 (32), p.325403
2016
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Applied physics letters, 2010-12, Vol.97 (26), p.263503-263503-3
2010
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Journal of physics. Conference series, 2016-11, Vol.773 (1), p.12010
2016
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Composites. Part B, Engineering, 2011-12, Vol.42 (8), p.2098-2104
2011
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Applied physics letters, 2009-06, Vol.94 (23), p.233101-233101-3
2009
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2017 IEEE Holm Conference on Electrical Contacts, 2017, p.205-208
2017
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2019 IEEE Holm Conference on Electrical Contacts, 2019, p.350-358
2019
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Applied physics letters, 1996-09, Vol.69 (13), p.1975-1977
1996
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IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.358-364
2009
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Sensing and Imaging: An International Journal, 2015-12, Vol.16 (1), Article 21
2015
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IEEE transactions on applied superconductivity, 2003-06, Vol.13 (2), p.2721-2724
2003
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Journal of applied physics, 2009-09, Vol.106 (5), p.054301-054301-7
2009
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Diamond and related materials, 2007-04, Vol.16 (4), p.1074-1077
2007
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Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts, 2007, p.160-166
2007
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Thin solid films, 2001-02, Vol.383 (1-2), p.57-60
2001
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Carbon (New York), 2001-01, Vol.39 (2), p.314-318
2001
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2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm), 2016, p.72-78
2016
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Diamond and related materials, 2006-04, Vol.15 (4), p.618-621
2006
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2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, p.1-7
2010
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Journal of physics. Condensed matter, 1991-06, Vol.3 (25), p.4655-4675, Article 4655
1991
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Journal of the American Chemical Society, 2001-11, Vol.123 (46), p.11486-11487
2001
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IEEE transactions on components and packaging technologies, 1999-03, Vol.22 (1), p.79-84
1999
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