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CT-Guided Fiducial Marker Implantation with Ultra-fine 25-Gauge Needle Prior to Proton Therapy for Liver Malignancies

Cardiovascular and interventional radiology, 2024-09, Vol.47 (9), p.1287-1293

2024

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A Case of Solitary Pulmonary Capillary Hemangioma: Contrast Enhanced Computed Tomography-Pathological Correlation

Journal of thoracic imaging, 2023-11, Vol.38 (6), p.W79-W82

2023

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Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1175-1180

2023

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Pre-applied Inter Chip Fill Material and Process for Advanced 3D Chip Stack

MRS proceedings, 2009, Vol.1195 (1), p.301-306, Article 1195-B13-05

2009

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Implementation challenges for scalable neuromorphic computing

2017 Symposium on VLSI Technology, 2017, p.T182-T183

2017

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Core Technologies for Breaking into Cognitive Computing Era

Journal of The Japan Institute of Electronics Packaging, 2014, Vol.17 (3), p.156-162

2014

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Solder-filled Through Silicon Via with Organic Insulator

Journal of Smart Processing, 2016, Vol.5 (4), p.239-243

2016

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Solder-filled Through Silicon Via with Organic Insulator

Journal of Smart Processing, 2016, Vol.5(4), pp.239-243

2016

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PERSPECTIVE ON REQUIRED PACKAGING TECHNOLOGIES FOR NEUROMORPHIC DEVICES

International Symposium on Microelectronics, 2015-10, Vol.2015 (1), p.561-566

2015

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Scaling challenges of packaging in the Era of Big Data

2013 Symposium on VLSI Technology, 2013, p.T40-T41

2013

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CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1050-1056

2021

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Thermomechanical Design for Fine Pitch 3D-IC Packages

International Symposium on Microelectronics, 2012-01, Vol.2012 (1), p.1001-1009

2012

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Scaling Challenges of Semiconductor Packaging in the Era of Big Data

International Symposium on Microelectronics, 2013-01, Vol.2013 (1), p.402-407

2013

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有機絶縁膜を用いたはんだ充填シリコン貫通ビア

スマートプロセス学会誌, 2016, Vol.5(4), pp.239-243

2016

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Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.586-590

2022

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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.269-273

2024

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Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.631-634

2022

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Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1053-1059

2023

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Vertical Interconnect Technology for Enlarging Capacity on Micro Solid Thin Film Rechargeable Battery

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1921-1925

2019

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Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.625-630

2022

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Low Cost and High Density Packaging Technologies for Ultra Small IoT Computing Systems

2019 Electron Devices Technology and Manufacturing Conference (EDTM), 2019, p.206-208

2019

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High-bandwidth, high-numerical aperture graded-index polymer optical fiber

Journal of lightwave technology, 1995-08, Vol.13 (8), p.1686-1691

1995

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Implementation challenges for scalable neuromorphic computing

2017 Symposium on VLSI Circuits, 2017, p.T182-T183

2017

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Advanced interconnect technologies in the era of cognitive computing

2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016, p.1-6

2016

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Fine-pitch solder joining for high density interconnection

2014 International Conference on Electronics Packaging (ICEP), 2014, p.600-603

2014

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CT-Guided Fiducial Marker Implantation with Ultra-fine 25-Gauge Needle Prior to Proton Therapy for Liver Malignancies

A Case of Solitary Pulmonary Capillary Hemangioma: Contrast Enhanced Computed Tomography-Pathological Correlation

Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

Pre-applied Inter Chip Fill Material and Process for Advanced 3D Chip Stack

Implementation challenges for scalable neuromorphic computing

Core Technologies for Breaking into Cognitive Computing Era

Solder-filled Through Silicon Via with Organic Insulator

Solder-filled Through Silicon Via with Organic Insulator

PERSPECTIVE ON REQUIRED PACKAGING TECHNOLOGIES FOR NEUROMORPHIC DEVICES

Scaling challenges of packaging in the Era of Big Data

CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration

Thermomechanical Design for Fine Pitch 3D-IC Packages

Scaling Challenges of Semiconductor Packaging in the Era of Big Data

有機絶縁膜を用いたはんだ充填シリコン貫通ビア

Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints

Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages

Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling

Vertical Interconnect Technology for Enlarging Capacity on Micro Solid Thin Film Rechargeable Battery

Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package

Low Cost and High Density Packaging Technologies for Ultra Small IoT Computing Systems

High-bandwidth, high-numerical aperture graded-index polymer optical fiber

Implementation challenges for scalable neuromorphic computing

Advanced interconnect technologies in the era of cognitive computing

Fine-pitch solder joining for high density interconnection

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