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Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon

Journal of electronic materials, 2021-08, Vol.50 (8), p.4272-4288

2021

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The impact of residual stress on resonating piezoelectric devices

Materials & design, 2020-11, Vol.196, p.109126, Article 109126

2020

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Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system

Philosophical magazine (Abingdon, England), 2016-01, Vol.96 (1), p.15-30

2016

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Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Journal of alloys and compounds, 2009-07, Vol.481 (1), p.503-508

2009

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Improved methods for development of high reliability electronics

2014 IEEE Aerospace Conference, 2014, p.1-13

2014

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Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Journal of electronic materials, 2016-10, Vol.45 (10), p.5478-5486

2016

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Demonstrating 170 °C Low-Temperature Cu-In-Sn Wafer-Level Solid Liquid Interdiffusion Bonding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-03, Vol.12 (3), p.446-453

2022

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Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Journal of alloys and compounds, 2016-12, Vol.688, p.388-398

2016

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The effect of platinum contact metallization on Cu/Sn bonding

Journal of materials science. Materials in electronics, 2018-09, Vol.29 (17), p.15212-15222

2018

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Microstructural Evolution and Mechanical Properties in (AuSn)^sub eut^-Cu Interconnections

Journal of electronic materials, 2016-10, Vol.45 (10), p.5478

2016

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Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

Proceedings of the Royal Society. A, Mathematical, physical, and engineering sciences, 2014-01, Vol.470 (2161), p.20130464-20130464

2014

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Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

Proceedings of the Royal Society. A, Mathematical, physical, and engineering sciences, 2014-01, Vol.470 (2161), p.1-19

2014

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Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, p.1-5

2020

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Multidecadal variability of dust activity in Gobi desert and its connection with the pacific decadal oscillation

Environmental Research Communications, 2023-09, Vol.5 (9), p.95013

2023

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“Listing author contribution” does not alter the author inflation in the publications in basic research in four major gastroenterology journals in 10 years

Scientometrics, 2016-06, Vol.107 (3), p.1501-1507

2016

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KLF4 upregulation is involved in alternative macrophage activation during secondary Echinococcus granulosus infection

Parasite immunology, 2019-10, Vol.41 (10), p.e12666-n/a

2019

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Internal biliary drainage superior to external biliary drainage in improving gut mucosa barrier because of goblet cells and mucin-2 up-regulation

Bioscience reports, 2018-06, Vol.38 (3)

2018

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Investigation into the Cutting Technology of the Ineterior Helical Surface of Metallic Screw Pump Stator

Advanced materials research, 2011, Vol.201-203, p.1327-1334

2011

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Calculation of Phase Diagrams and First-Principles Study of Germanium Impacts on Phosphorus Distribution in Czochralski Silicon

The impact of residual stress on resonating piezoelectric devices

Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Improved methods for development of high reliability electronics

Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Demonstrating 170 °C Low-Temperature Cu-In-Sn Wafer-Level Solid Liquid Interdiffusion Bonding

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

The effect of platinum contact metallization on Cu/Sn bonding

Microstructural Evolution and Mechanical Properties in (AuSn)^sub eut^-Cu Interconnections

Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Multidecadal variability of dust activity in Gobi desert and its connection with the pacific decadal oscillation

“Listing author contribution” does not alter the author inflation in the publications in basic research in four major gastroenterology journals in 10 years

KLF4 upregulation is involved in alternative macrophage activation during secondary Echinococcus granulosus infection

Internal biliary drainage superior to external biliary drainage in improving gut mucosa barrier because of goblet cells and mucin-2 up-regulation

Investigation into the Cutting Technology of the Ineterior Helical Surface of Metallic Screw Pump Stator

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