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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Micromachines (Basel), 2019-05, Vol.10 (5), p.342

2019

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Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications

Advanced engineering materials, 2022-09, Vol.24 (9), p.n/a

2022

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Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations

Journal of membrane science, 2013-02, Vol.428, p.523-532

2013

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Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals

Journal of materials science, 2016-02, Vol.51 (3), p.1217-1233

2016

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CO2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Macromolecules, 2006-12, Vol.39 (26), p.9590-9604

2006

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Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Mechatronics (Oxford), 2016-12, Vol.40, p.270-280

2016

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Multiscale perspectives of interface delamination in microelectronic packaging applications

Molecular simulation, 2011-07, Vol.37 (8), p.710-717

2011

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Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers

Journal of polymer science. Part B, Polymer physics, 2008-01, Vol.46 (1), p.59-71

2008

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A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages

Journal of microelectronics and electronic packaging, 2019-01, Vol.16 (1), p.39-44

2019

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Mechanics of CNT-palladium Interfaces for Sensor Applications Simulated with Molecular Dynamics

Procedia materials science, 2014, Vol.3, p.454-460

2014

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Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)

Journal of polymer science. Part B, Polymer physics, 2006-07, Vol.44 (13), p.1874-1897

2006

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Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes

IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)

2024

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In-situ infrared spectroscopy for chemical analysis in electronic packaging processes

2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.336-342

2022

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Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1332-1338

2023

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Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation

Desalination, 2006-11, Vol.200 (1), p.166-168

2006

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A Closer Look to Fan-out Panel Level Packaging

2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2023, p.1-3

2023

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Warpage of Fan-Out Panel Level Packaging - Experimental and Numerical Study of Geometry and Process Influence

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-6

2023

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Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers

Desalination, 2006-11, Vol.199 (1-3), p.443-444

2006

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Panel Level Packaging - Where are the Technology Limits?

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.807-818

2022

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Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2009-2015

2021

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Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.861-867

2019

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COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

International Symposium on Microelectronics, 2019-10, Vol.2019 (1), p.568-572

2019

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A numerical study on mitigation of flying dies in compression molding of microelectronic packages

International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.355-360

2018

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Recent Developments in Panel Level Packaging

2018 International Wafer Level Packaging Conference (IWLPC), 2018, p.1-7

2018

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Characterization of anodic bondable LTCC for wafer-level packaging

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.501-505

2016

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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications

Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations

Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals

CO2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Multiscale perspectives of interface delamination in microelectronic packaging applications

Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers

A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages

Mechanics of CNT-palladium Interfaces for Sensor Applications Simulated with Molecular Dynamics

Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)

Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes

In-situ infrared spectroscopy for chemical analysis in electronic packaging processes

Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation

A Closer Look to Fan-out Panel Level Packaging

Warpage of Fan-Out Panel Level Packaging - Experimental and Numerical Study of Geometry and Process Influence

Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers

Panel Level Packaging - Where are the Technology Limits?

Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging

COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELING

A numerical study on mitigation of flying dies in compression molding of microelectronic packages

Recent Developments in Panel Level Packaging

Characterization of anodic bondable LTCC for wafer-level packaging

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