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Microelectronics and reliability, 2012-07, Vol.52 (7), p.1285-1290
2012
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Microelectronics and reliability, 2010-07, Vol.50 (7), p.900-909
2010
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Microelectronics and reliability, 2022-11, Vol.138, p.114641, Article 114641
2022
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Procedia engineering, 2012, Vol.44, p.719-720
2012
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Journal of applied physics, 2014-04, Vol.115 (14)
2014
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Microelectronics and reliability, 2011-06, Vol.51 (6), p.1027-1034
2011
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Microelectronics and reliability, 2011-06, Vol.51 (6), p.1027-1034
2011
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Microelectronics and reliability, 2013-08, Vol.53 (8), p.1111-1116
2013
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.70-78
2018
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2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018, p.247-251
2018
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1-7
2017
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2019 IEEE CPMT Symposium Japan (ICSJ), 2019, p.85-87
2019
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2019 International Wafer Level Packaging Conference (IWLPC), 2019, p.1-6
2019
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2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019, p.9-9
2019
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1134-1142
2014
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.438-447
2015
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-6
2013
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1703-1708
2013
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-5
2013
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2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1079-1085
2011
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2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.625-630
2014
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2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.372-382
2013
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-8
2014
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-13
2013
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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.135-143
2010
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