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Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull
2009
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2008 58th Electronic Components and Technology Conference, 2008, p.1181-1186
2008
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EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006, p.1-6
2006
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EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-6
2008
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2007 8th International Conference on Electronic Packaging Technology, 2007, p.1-6
2007
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Trends in genetics, 2000-12, Vol.16 (12), p.565-572
2000
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BioEssays, 1996-04, Vol.18 (4), p.317-323
1996
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Trends in genetics, 1995-05, Vol.11 (5), p.195-200
1995
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Theoretical and applied genetics, 1992-04, Vol.83 (6-7), p.821-826
1992
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Roux's archives of developmental biology, 1990-05, Vol.199 (5), p.251-280
1990
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