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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

Polymers, 2021-03, Vol.13 (6), p.957

2021

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Fast diffusion supercapacitors via an ultra-high pore volume of crumpled 3D structure reduced graphene oxide activation

RSC advances, 2015, Vol.5 (75), p.60914-60919

2015

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A Simple and Highly Efficient Method for Surface Treatment of Ti Substrates for Use in Dye-Sensitized Solar Cells

Advanced energy materials, 2011-05, Vol.1 (3), p.337-342

2011

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Effect of increased surface area of stainless steel substrates on the efficiency of dye-sensitized solar cells

Applied physics letters, 2008-09, Vol.93 (13), p.133311-133311-3

2008

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ZnO nanosphere fabrication using the functionalized polystyrene nanoparticles for dye-sensitized solar cells

Electrochimica acta, 2010-09, Vol.55 (22), p.6563-6569

2010

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Fabrication of an Efficient Dye-Sensitized Solar Cell with Stainless Steel Substrate

Journal of the Electrochemical Society, 2008, Vol.155 (7), p.F145

2008

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Widely frequency-tunable amplified feedback lasers for 10-GHz optical pulsation

IEEE photonics technology letters, 2005-06, Vol.17 (6), p.1151-1153

2005

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Tuned Optical Reflection Characteristics of Chemically‐Treated Ti Substrates

ETRI Journal, 2012, 34(6), , pp.954-957

2012

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Promising efficiency enhancement in cobalt redox couple-based back-illuminated dye-sensitized solar cells with titanium foil substrate

Journal of power sources, 2015-01, Vol.278, p.32-37

2015

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59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display

SID International Symposium Digest of technical papers, 2021-05, Vol.52 (1), p.841-844

2021

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Cost-effective dye-sensitized solar cells consisting of two metal foils instead of transparent conductive oxide glass

Physical chemistry chemical physics : PCCP, 2012-05, Vol.14 (18), p.6448-6451

2012

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Improved performance of metal foil-based dye-sensitized solar cells with low porosity and short length of TiO2 nanotube underlayer

Electrochimica acta, 2014-07, Vol.133, p.610-614

2014

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Electrochemical analysis of transparent oxide-less photovoltaic cell with perforation patterned metal substrate

Applied physics letters, 2013-05, Vol.102 (18)

2013

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Novel Ionic Iodide-Siloxane Hybrid Electrolyte for Dye-Sensitized Solar Cells

ACS applied materials & interfaces, 2011-02, Vol.3 (2), p.293-298

2011

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A quasi-solid-state dye-sensitized solar cell based on sol–gel derived in situ gelation of a siloxane hybrid electrolyte

RSC advances, 2012-07, Vol.2 (13), p.5524

2012

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Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1385-1389

2023

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Right‐Angle‐Bent CPW for the Application of the Driver‐Amplifier‐Integrated 40 Gbps TW‐EML Module

ETRI Journal, 2006, 28(5), , pp.648-651

2006

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Influence of a self-assembled monolayer on indium-zinc-oxide semiconductor thin-film transistors

Journal of the Korean Physical Society, 2014, 65(10), , pp.1555-1558

2014

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Widely Tunable Grating Cavity Lasers

ETRI Journal, 2006, 28(5), , pp.545-554

2006

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Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.943-948

2024

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40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Lasers Fabricated Using Selective Area Growth

ETRI Journal, 2009, 31(6), , pp.765-769

2009

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Highly thermally conductive Ag/SiO2 superhydrophobic coating for accelerated dropwise condensation

Ceramics international, 2021-09, Vol.47 (18), p.26528-26538

2021

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Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.198-203

2022

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Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1607-1613

2021

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Experimental study on the performance of miniature heat pipes with woven-wire wick

IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.591-595

2001

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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

Fast diffusion supercapacitors via an ultra-high pore volume of crumpled 3D structure reduced graphene oxide activation

A Simple and Highly Efficient Method for Surface Treatment of Ti Substrates for Use in Dye-Sensitized Solar Cells

Effect of increased surface area of stainless steel substrates on the efficiency of dye-sensitized solar cells

ZnO nanosphere fabrication using the functionalized polystyrene nanoparticles for dye-sensitized solar cells

Fabrication of an Efficient Dye-Sensitized Solar Cell with Stainless Steel Substrate

Widely frequency-tunable amplified feedback lasers for 10-GHz optical pulsation

Tuned Optical Reflection Characteristics of Chemically‐Treated Ti Substrates

Promising efficiency enhancement in cobalt redox couple-based back-illuminated dye-sensitized solar cells with titanium foil substrate

59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display

Cost-effective dye-sensitized solar cells consisting of two metal foils instead of transparent conductive oxide glass

Improved performance of metal foil-based dye-sensitized solar cells with low porosity and short length of TiO2 nanotube underlayer

Electrochemical analysis of transparent oxide-less photovoltaic cell with perforation patterned metal substrate

Novel Ionic Iodide-Siloxane Hybrid Electrolyte for Dye-Sensitized Solar Cells

A quasi-solid-state dye-sensitized solar cell based on sol–gel derived in situ gelation of a siloxane hybrid electrolyte

Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration

Right‐Angle‐Bent CPW for the Application of the Driver‐Amplifier‐Integrated 40 Gbps TW‐EML Module

Influence of a self-assembled monolayer on indium-zinc-oxide semiconductor thin-film transistors

Widely Tunable Grating Cavity Lasers

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20 μm Pitch

40 Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Lasers Fabricated Using Selective Area Growth

Highly thermally conductive Ag/SiO2 superhydrophobic coating for accelerated dropwise condensation

Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era

Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive

Experimental study on the performance of miniature heat pipes with woven-wire wick

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