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Plasma processing of low-k dielectrics

Journal of applied physics, 2013-01, Vol.113 (4)

2013

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Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

MRS bulletin, 2015-03, Vol.40 (3), p.248-256

2015

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Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Journal of applied physics, 2012-03, Vol.111 (6), p.063513-063513-8

2012

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Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Applied physics letters, 2012-01, Vol.100 (4), p.041901-041901-4

2012

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Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

Applied physics letters, 2013-11, Vol.103 (21)

2013

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Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Microelectronics and reliability, 2013-01, Vol.53 (1), p.53-62

2013

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Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Journal of materials research, 2012-04, Vol.27 (8), p.1131-1141

2012

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An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-09, Vol.11 (9), p.1435-1441

2021

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Role of ions, photons, and radicals in inducing plasma damage to ultra low- k dielectrics

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2012-01, Vol.30 (1)

2012

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Effect of contact metallization on electromigration reliability of Pb-free solder joints

Journal of applied physics, 2006-05, Vol.99 (9), p.094906-094906-6

2006

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Advanced Interconnects for ULSI Technology

2, 2012

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Effect of supporting layer on growth of carbon nanotubes by thermal chemical vapor deposition

Applied physics letters, 2006-10, Vol.89 (18), p.183113-183113-3

2006

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Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Journal of electronic materials, 2010-04, Vol.39 (4), p.419-425

2010

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Effect of passivation on stress relaxation in electroplated copper films

Journal of materials research, 2006-06, Vol.21 (6), p.1512-1518

2006

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A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer

Journal of Mechanical Science and Technology, 2014, 28(1), , pp.255-261

2014

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Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Journal of applied physics, 2005-05, Vol.97 (10), p.103532-103532-9

2005

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Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Microelectronics and reliability, 2002, Vol.42 (1), p.27-34

2002

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A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions

Computational materials science, 2016-07, Vol.120, p.29-35

2016

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Electromigration behavior of 60 nm dual damascene Cu interconnects

Journal of applied physics, 2007-11, Vol.102 (9), p.093516-093516-5

2007

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Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Applied physics letters, 2013-04, Vol.102 (13)

2013

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Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

Applied physics letters, 2012-09, Vol.101 (10)

2012

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Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Journal of applied physics, 2006-10, Vol.100 (8)

2006

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Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

Journal of materials research, 2011-11, Vol.26 (21), p.2757-2760

2011

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Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Microelectronics and reliability, 2009-03, Vol.49 (3), p.253-263

2009

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Buckling of Single-Crystal Silicon Nanolines under Indentation

Journal of nanomaterials, 2008-01, Vol.2008, p.1-11

2008

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Plasma processing of low-k dielectrics

Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design

Role of ions, photons, and radicals in inducing plasma damage to ultra low- k dielectrics

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Advanced Interconnects for ULSI Technology

Effect of supporting layer on growth of carbon nanotubes by thermal chemical vapor deposition

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Effect of passivation on stress relaxation in electroplated copper films

A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer

Isothermal stress relaxation in electroplated Cu films. II. Kinetic modeling

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions

Electromigration behavior of 60 nm dual damascene Cu interconnects

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Size effect on the electron wind force for electromigration at the top metal-dielectric interface in nanoscale interconnects

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Grain structure effect on electromigration reliability of Cu interconnects with CoWP capping

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Buckling of Single-Crystal Silicon Nanolines under Indentation

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