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Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.155-174

2007

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Interaction between synaptic inhibition and glial-potassium dynamics leads to diverse seizure transition modes in biophysical models of human focal seizures

Journal of computational neuroscience, 2016-10, Vol.41 (2), p.225-244

2016

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Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Journal of electronic materials, 2002-06, Vol.31 (6), p.584-590

2002

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Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

Journal of materials research, 2002-02, Vol.17 (2), p.263-266

2002

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Effects of limited Cu supply on soldering reactions between SnAgCu and Ni

Journal of electronic materials, 2006-05, Vol.35 (5), p.1017-1024

2006

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Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

Journal of electronic materials, 2010-11, Vol.39 (11), p.2387-2396

2010

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Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System

Journal of electronic materials, 2012-01, Vol.41 (1), p.2-10

2012

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Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system

Surface & coatings technology, 2014-11, Vol.259, p.244-251

2014

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Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2005-04, Vol.396 (1), p.385-391

2005

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Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

Journal of electronic materials, 2012, Vol.41 (1), p.11-21

2012

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Electromigration in thin-film solder joints

Surface & coatings technology, 2014-11, Vol.259, p.257-261

2014

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Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni(P) tri-layer structure

Journal of alloys and compounds, 2010-03, Vol.493 (1), p.431-437

2010

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Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints

Journal of electronic materials, 2009-10, Vol.38 (10), p.2184-2193

2009

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Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process: Butterfly deposition mode

Surface & coatings technology, 2014-11, Vol.259, p.262-267

2014

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Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering

Thin solid films, 2013-02, Vol.529, p.364-368

2013

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Selective Interfacial Reaction between Ni and Eutectic BiSn Lead-Free Solder

Chemistry of materials, 2001-03, Vol.13 (3), p.1051-1056

2001

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Field-emission transmission electron microscopy study of the reaction sequence between Sn–Ag–Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging

Thin solid films, 2013-02, Vol.529, p.369-373

2013

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Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Journal of electronic materials, 2006-01, Vol.35 (1), p.65-71

2006

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Design of solder joints for fundamental studies on the effects of electromigration

Journal of materials science. Materials in electronics, 2007-06, Vol.18 (6), p.569-574

2007

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Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples

Journal of electronic materials, 2006-02, Vol.35 (2), p.366-371

2006

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Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer

Surface & coatings technology, 2020-08, Vol.395, p.125879, Article 125879

2020

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The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples

Journal of electronic materials, 2009-12, Vol.38 (12), p.2563-2572

2009

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Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

Journal of electronic materials, 2001-09, Vol.30 (9), p.1152-1156

2001

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Facial nerve outcomes in functional vestibular schwannoma surgery: less than total tumour excision significantly improves results

Journal of laryngology and otology, 2012-02, Vol.126 (2), p.120-124

2012

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Reactions between Sn-Ag-Cu lead-free solders and the Au Ni surface finish in advanced electronic packages

Soldering & surface mount technology, 2002-01, Vol.14 (3), p.25-29

2002

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