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A 40 Gb/s Multi-Data-Rate CMOS Transmitter and Receiver Chipset With SFI-5 Interface for Optical Transmission Systems

IEEE journal of solid-state circuits, 2009-12, Vol.44 (12), p.3568-3579

2009

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Robust porous SiOCH/Cu interconnects with ultrathin sidewall protection liners

IEEE transactions on electron devices, 2006-05, Vol.53 (5), p.1169-1179

2006

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Ocular Behçet's disease is less complicated with allergic disorders. A nationwide survey in Japan

Clinical and experimental rheumatology, 2016-09, Vol.34 (6 Suppl 102), p.111

2016

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A 5.5Gb/s 5mm contactless interface containing a 50Mb/s bidirectional sub-channel employing common-mode OOK signaling

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers, 2013, p.406-407

2013

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Interleukin-18 regulates pathological intraocular neovascularization

Journal of leukocyte biology, 2007-04, Vol.81 (4), p.1012-1021

2007

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Investigation of the role of CD1d-restricted invariant NKT cells in experimental choroidal neovascularization

Biochemical and biophysical research communications, 2008-09, Vol.374 (1), p.38-43

2008

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Antiangiogenic immunotherapy targeting Flk-1, DNA vaccine and adoptive T cell transfer, inhibits ocular neovascularization

Biochemical and biophysical research communications, 2009-04, Vol.381 (4), p.471-476

2009

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Induction of the nuclear I mu B protein I mu B- direct sum upon stimulation of B cell antigen receptor

Biochemical and biophysical research communications, 2007-05, Vol.356 (2), p.476-480

2007

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A low-power, small area quadrature LC-VCO using miniature 3D solenoid shaped inductor

2009 IEEE Radio Frequency Integrated Circuits Symposium, 2009, p.263-266

2009

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Crosstalk Analysis Method of 3-D Solenoid On-chip Inductors for High-speed CMOS SoCs

2008 International Interconnect Technology Conference, 2008, p.186-188

2008

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Mechanical Property Control of Low-k Dielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects

Japanese Journal of Applied Physics, 2004-04, Vol.43 (4S), p.1807

2004

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A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems

2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, 2009, p.358-359,359a

2009

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Coulomb blockade related to mutual Coulomb interaction in an external environment in an array of single tunnel junctions connected to Ni nanowires

Physical review. B, Condensed matter, 2000-09, Vol.62 (12), p.8420-8429

2000

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Influence of phase fluctuation in external environment on Coulomb blockade in an array system of single tunnel junctions/Ni nanowires

Applied physics letters, 2000-03, Vol.76 (13), p.1698-1700

2000

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A novel cylinder-type MIM capacitor in porous low-k film (CAPL) for embedded DRAM with advanced CMOS logics

2010 International Electron Devices Meeting, 2010, p.33.3.1-33.3.4

2010

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A Novel Monitoring Method of RF Characteristics Variations for Sub-0.1μm MOSFETs with Precise Gate-resistance Model

IEEE Custom Integrated Circuits Conference 2006, 2006, p.725-728

2006

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Novel molecular-structure design for PECVD porous SiOCH films toward 45nm node, ASICs with k=2.3

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.225-227

2004

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A 5-20GHz tunable LC-VCO using variable bridge inductor

2010 Symposium on VLSI Circuits, 2010, p.47-48

2010

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Low-loss LSI Interconnects on Novel "Partially Low-k Plugged Si Substrate" (PLP-Sub) for RF/ubiquitous Applications

2006 International Interconnect Technology Conference, 2006, p.60-62

2006

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RF performance upgrading of low-power 40nm-node CMOS devices by extremely low-resistance partially-thickened local (PTL)-interconnects

2009 IEEE International Electron Devices Meeting (IEDM), 2009, p.1-4

2009

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High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond

2008 IEEE International Electron Devices Meeting, 2008, p.1-4

2008

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Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.12-14

2002

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The human imperative of stabilizing global climate change at 1.5°C

Science (American Association for the Advancement of Science), 2019-09, Vol.365 (6459), p.1263-+

2019

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RF performance boosting for 40nm-node CMOS device by low-k/Cu dual damascene contact

2008 IEEE International Electron Devices Meeting, 2008, p.1-4

2008

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A global water scarcity assessment under Shared Socio-economic Pathways – Part 2: Water availability and scarcity

Hydrology and earth system sciences, 2013-07, Vol.17 (7), p.2393-2413

2013

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A 40 Gb/s Multi-Data-Rate CMOS Transmitter and Receiver Chipset With SFI-5 Interface for Optical Transmission Systems

Robust porous SiOCH/Cu interconnects with ultrathin sidewall protection liners

Ocular Behçet's disease is less complicated with allergic disorders. A nationwide survey in Japan

A 5.5Gb/s 5mm contactless interface containing a 50Mb/s bidirectional sub-channel employing common-mode OOK signaling

Interleukin-18 regulates pathological intraocular neovascularization

Investigation of the role of CD1d-restricted invariant NKT cells in experimental choroidal neovascularization

Antiangiogenic immunotherapy targeting Flk-1, DNA vaccine and adoptive T cell transfer, inhibits ocular neovascularization

Induction of the nuclear I mu B protein I mu B- direct sum upon stimulation of B cell antigen receptor

A low-power, small area quadrature LC-VCO using miniature 3D solenoid shaped inductor

Crosstalk Analysis Method of 3-D Solenoid On-chip Inductors for High-speed CMOS SoCs

Mechanical Property Control of Low-k Dielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects

A 40Gb/s multi-data-rate CMOS transceiver chipset with SFI-5 interface for optical transmission systems

Coulomb blockade related to mutual Coulomb interaction in an external environment in an array of single tunnel junctions connected to Ni nanowires

Influence of phase fluctuation in external environment on Coulomb blockade in an array system of single tunnel junctions/Ni nanowires

A novel cylinder-type MIM capacitor in porous low-k film (CAPL) for embedded DRAM with advanced CMOS logics

A Novel Monitoring Method of RF Characteristics Variations for Sub-0.1μm MOSFETs with Precise Gate-resistance Model

Novel molecular-structure design for PECVD porous SiOCH films toward 45nm node, ASICs with k=2.3

A 5-20GHz tunable LC-VCO using variable bridge inductor

Low-loss LSI Interconnects on Novel "Partially Low-k Plugged Si Substrate" (PLP-Sub) for RF/ubiquitous Applications

RF performance upgrading of low-power 40nm-node CMOS devices by extremely low-resistance partially-thickened local (PTL)-interconnects

High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

The human imperative of stabilizing global climate change at 1.5°C

RF performance boosting for 40nm-node CMOS device by low-k/Cu dual damascene contact

A global water scarcity assessment under Shared Socio-economic Pathways – Part 2: Water availability and scarcity

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