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Embedded Trench Redistribution Layers at 2– 5~\mu \text Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– 40~\mu \text I/O Pitch Interposers

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-06, Vol.7 (6), p.838-845

2017

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Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.865-870

2024

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Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.732-737

2024

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Novel Process of RDL Formation for Advanced Packaging by Excimer Laser Ablation

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1733-1739

2016

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Embedded RDL Enabled by Excimer Laser Ablation

IMAPS other content, 2016-01, Vol.2016 (DPC), p.367-396

Hichri, Habib

2016

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Thin-Film Substrate-Based mmWave Antennas for Automotive Radar Applications

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 2024, p.1-6

2024

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Optical Run-Out Correction for Improved Lithography Overlay Accuracy for Fowlp Applications

2018 International Wafer Level Packaging Conference (IWLPC), 2018, p.1-7

2018

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Optical Run-Out Correction for Improved Lithography Overlay Accuracy for FOWLP Applications

International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.217-223

2018

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UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu Pillars

IMAPS other content, 2019-03, Vol.2019 (DPC), p.314-337

2019

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Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.58-63

2018

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Enabling Heterogeneous Integration for Next Generation Fan-Out Applications Using Full-Field Projection Scanning

2019 International Wafer Level Packaging Conference (IWLPC), 2019, p.1-5

2019

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Die Placement Error management for Fan out Applications using Projection Lithography

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.497-501

2017

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Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging

2018 International Wafer Level Packaging Conference (IWLPC), 2018, p.1-6

2018

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Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1005-1009

2018

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Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.113-119

2017

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Innovative laser enabled dual damascene process for ultra-fine line multi-layer routing for advanced packaging

2017 International Conference on Electronics Packaging (ICEP), 2017, p.76-81

2017

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Integration Solutions for 65 nm Back End of Line Defect Reduction and Manufacturability

ECS transactions, 2007, Vol.11 (6), p.265-275

2007

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Excimer Laser Ablation for the Patterning of Ultra‐fine Routings

Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies, 2019, p.441-456

2019

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A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Process

International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.140-145

2018

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An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging

2019 International Wafer Level Packaging Conference (IWLPC), 2019, p.1-7

2019

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Ablative Laser Patterning of Polymeric Dielectric Materials

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.300-303

2017

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Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.120-125

2017

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Embedded RDL formation in Non-Photo Polymers using Excimer Laser Ablation

International Symposium on Microelectronics, 2016-10, Vol.2016 (1), p.25-31

2016

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Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.872-877

2017

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Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.884-889

2017

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Surface Treatment
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Embedded Trench Redistribution Layers at 2– 5~\mu \text Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– 40~\mu \text I/O Pitch Interposers

Temperature dependent Dielectric Characterization of Low Loss Thin Film Polymer up to sub-THz bands

Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications

Novel Process of RDL Formation for Advanced Packaging by Excimer Laser Ablation

Embedded RDL Enabled by Excimer Laser Ablation

Thin-Film Substrate-Based mmWave Antennas for Automotive Radar Applications

Optical Run-Out Correction for Improved Lithography Overlay Accuracy for Fowlp Applications

Optical Run-Out Correction for Improved Lithography Overlay Accuracy for FOWLP Applications

UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu Pillars

Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes

Enabling Heterogeneous Integration for Next Generation Fan-Out Applications Using Full-Field Projection Scanning

Die Placement Error management for Fan out Applications using Projection Lithography

Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging

Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL

Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser Ablation

Innovative laser enabled dual damascene process for ultra-fine line multi-layer routing for advanced packaging

Integration Solutions for 65 nm Back End of Line Defect Reduction and Manufacturability

Excimer Laser Ablation for the Patterning of Ultra‐fine Routings

A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene Process

An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging

Ablative Laser Patterning of Polymeric Dielectric Materials

Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process

Embedded RDL formation in Non-Photo Polymers using Excimer Laser Ablation

Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging

Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes

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