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Fast and Precise High-Speed Channel Modeling and Optimization Technique Based on Machine Learning

IEEE transactions on electromagnetic compatibility, 2018-12, Vol.60 (6), p.2049-2052

2018

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Cooperative tumour cell membrane targeted phototherapy

Nature communications, 2017-06, Vol.8 (1), p.15880-15880, Article 15880

2017

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Depth-Based Detection of Standing-Pigs in Moving Noise Environments

Sensors (Basel, Switzerland), 2017-11, Vol.17 (12), p.2757

2017

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Enhanced Photodynamic Cancer Treatment by Mitochondria‐Targeting and Brominated Near‐Infrared Fluorophores

Advanced science, 2018-03, Vol.5 (3), p.1700481-n/a

2018

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Automated Detection of Rice Bakanae Disease via Drone Imagery

Sensors (Basel, Switzerland), 2022-12, Vol.23 (1), p.32

2022

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.181-195

2011

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Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1658-1671

2018

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EnsemblePigDet: Ensemble Deep Learning for Accurate Pig Detection

Applied sciences, 2021-06, Vol.11 (12), p.5577

2021

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Antitumor Efficacy of Focused Ultrasound-MFL Nanoparticles Combination Therapy in Mouse Breast Cancer Xenografts

Materials, 2020-03, Vol.13 (5), p.1099

2020

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A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

IEEE transactions on electromagnetic compatibility, 2018-10, Vol.60 (5), p.1510-1519

2018

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30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

IEEE microwave and wireless components letters, 2014-11, Vol.24 (11), p.814-816

2014

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Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.138-152

2017

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Coimmunomodulation of tumor and tumor-draining lymph nodes during in situ vaccination promotes antitumor immunity

JCI insight, 2022-06, Vol.7 (12)

2022

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An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

IEEE transactions on electromagnetic compatibility, 2017-06, Vol.59 (3), p.927-939

2017

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Cyclodextrin polymer improves atherosclerosis therapy and reduces ototoxicity

Journal of controlled release, 2020-03, Vol.319, p.77-86

2020

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Coil design for 100 KHz and 6.78 MHz WPT system :Litz and solid wires and winding methods

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.803-806

2017

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Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1891-1906

2013

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Investigation of statistical eye-diagram estimation method for HBM including ISI, X-talk, and power noise

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.411-415

2017

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Measurement and Analysis of a High-Speed TSV Channel

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1672-1685

2012

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Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5D Terabtye/s bandwidth system

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.96-99

2016

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Energy efficient image/video data transmission on commercial multi-core processors

Sensors (Basel, Switzerland), 2012-11, Vol.12 (11), p.14647-14670

2012

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Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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Affinity-Driven Design of Cargo-Switching Nanoparticles to Leverage a Cholesterol-Rich Microenvironment for Atherosclerosis Therapy

ACS nano, 2020-06, Vol.14 (6), p.6519-6531

2020

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Multispectral interaction convolutional neural network for pedestrian detection

Computer vision and image understanding, 2022-10, Vol.223, p.103554, Article 103554

2022

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A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-01, Vol.5 (1), p.28-39

2015

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Fast and Precise High-Speed Channel Modeling and Optimization Technique Based on Machine Learning

Cooperative tumour cell membrane targeted phototherapy

Depth-Based Detection of Standing-Pigs in Moving Noise Environments

Enhanced Photodynamic Cancer Treatment by Mitochondria‐Targeting and Brominated Near‐Infrared Fluorophores

Automated Detection of Rice Bakanae Disease via Drone Imagery

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

EnsemblePigDet: Ensemble Deep Learning for Accurate Pig Detection

Antitumor Efficacy of Focused Ultrasound-MFL Nanoparticles Combination Therapy in Mouse Breast Cancer Xenografts

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Coimmunomodulation of tumor and tumor-draining lymph nodes during in situ vaccination promotes antitumor immunity

An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Cyclodextrin polymer improves atherosclerosis therapy and reduces ototoxicity

Coil design for 100 KHz and 6.78 MHz WPT system :Litz and solid wires and winding methods

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Investigation of statistical eye-diagram estimation method for HBM including ISI, X-talk, and power noise

Measurement and Analysis of a High-Speed TSV Channel

Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5D Terabtye/s bandwidth system

Energy efficient image/video data transmission on commercial multi-core processors

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Affinity-Driven Design of Cargo-Switching Nanoparticles to Leverage a Cholesterol-Rich Microenvironment for Atherosclerosis Therapy

Multispectral interaction convolutional neural network for pedestrian detection

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

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