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Efficient Energy Funneling in Quasi‐2D Perovskites: From Light Emission to Lasing

Advanced materials (Weinheim), 2020-04, Vol.32 (16), p.e1906571-n/a

2020

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Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Journal of materials science. Materials in electronics, 2020-09, Vol.31 (17), p.14635-14644

2020

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Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2021-02, Vol.804, p.140785, Article 140785

2021

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Polarization‐Induced Exciton–Polaron Quenching in Organic Light‐Emitting Devices and Its Control by Dipolar Doping

Advanced optical materials, 2022-12, Vol.10 (23), p.n/a

2022

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Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Materials, 2022-03, Vol.15 (6), p.2232

2022

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Application of Hot Isostatic Pressing in Nickel-Based Single Crystal Superalloys

Crystals (Basel), 2022-06, Vol.12 (6), p.805

2022

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Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Journal of materials science, 2020-03, Vol.55 (7), p.3107-3117

2020

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Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Scientific reports, 2019-03, Vol.9 (1), p.3658-3658, Article 3658

2019

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Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Scientific reports, 2020-07, Vol.10 (1), p.12229-12229, Article 12229

2020

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Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Materials, 2024-02, Vol.17 (5), p.1055

2024

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Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (23), p.21711-21722

2020

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Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions

Journal of materials science. Materials in electronics, 2021-08, Vol.32 (15), p.20461-20473

2021

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Effect of coating-substrate microstructure on nucleation and growth of surface microcracks in a PtAl-coated Ni-based SX superalloy with sheet specimens during HCF at 900 °C

Journal of materials research and technology, 2024-09, Vol.32, p.3708-3716

2024

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Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing

Journal of materials research and technology, 2023-07, Vol.25, p.6111-6122

2023

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Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere

Materials, 2023-03, Vol.16 (6), p.2389

2023

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The elemental uphill diffusion with micropores reduction during HIP treatment for a solution-treated nickel-based superalloy

Journal of materials research and technology, 2024-03, Vol.29, p.1862-1871

2024

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Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

Scripta materialia, 2016-01, Vol.110, p.101-104

2016

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Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Journal of materials research and technology, 2022-11, Vol.21, p.2352-2361

2022

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Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic Acid Atmosphere

溶接学会論文集, 2017, Vol.35(2), pp.127s-131s

2017

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Transition from Screw-Type to Edge-Type Misfit Dislocations at InGaN/GaN Heterointerfaces

Crystals (Basel), 2023-07, Vol.13 (7), p.1027

2023

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Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

Journal of advanced joining processes, 2022-11, Vol.6, p.100118, Article 100118

2022

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Failure quantitative assessment approach to MOSFET power device by detecting parasitic parameters

Frontiers in physics, 2022-10, Vol.10

2022

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Fabrication and Physical Properties of Gelatin/Sodium Alginate/Hyaluronic Acid Composite Wound Dressing Hydrogel

Journal of macromolecular science. Part A, Pure and applied chemistry, 2014-04, Vol.51 (4), p.318-325

2014

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Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

Scripta materialia, 2016-01, Vol.110, p.101-104

2016

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Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

Journal of alloys and compounds, 2017-02, Vol.695, p.2165-2172

2017

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Efficient Energy Funneling in Quasi‐2D Perovskites: From Light Emission to Lasing

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Polarization‐Induced Exciton–Polaron Quenching in Organic Light‐Emitting Devices and Its Control by Dipolar Doping

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Application of Hot Isostatic Pressing in Nickel-Based Single Crystal Superalloys

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Author Correction: Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Large-area and low-cost Cu–Cu bonding with cold spray deposition, oxidation, and reduction processes under low-temperature conditions

Effect of coating-substrate microstructure on nucleation and growth of surface microcracks in a PtAl-coated Ni-based SX superalloy with sheet specimens during HCF at 900 °C

Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere

The elemental uphill diffusion with micropores reduction during HIP treatment for a solution-treated nickel-based superalloy

Thermally stable Cu 3 Sn/Cu composite joint for high-temperature power device

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic Acid Atmosphere

Transition from Screw-Type to Edge-Type Misfit Dislocations at InGaN/GaN Heterointerfaces

Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere

Failure quantitative assessment approach to MOSFET power device by detecting parasitic parameters

Fabrication and Physical Properties of Gelatin/Sodium Alginate/Hyaluronic Acid Composite Wound Dressing Hydrogel

Thermally stable Cu3Sn/Cu composite joint for high-temperature power device

Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach

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