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Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Applied physics letters, 2013-04, Vol.102 (13)

2013

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Large-scale statistical analysis of early failures in Cu electromigration,Part I: Dominating mechanisms

Journal of applied physics, 2010-07, Vol.108 (1), p.013523-013523-10

2010

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In situ study on low- k interconnect time-dependent-dielectric-breakdown mechanisms

Journal of applied physics, 2014-03, Vol.115 (12)

2014

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Large-scale statistical analysis of early failures in Cu electromigration,Part II: Scaling behavior and short-length effects

Journal of applied physics, 2010-07, Vol.108 (1), p.013524-013524-6

2010

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Advanced metallization concepts and impact on reliability

Japanese Journal of Applied Physics, 2014-05, Vol.53 (5S2), p.5-1-05GA11-9

2014

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Scaling effects on microstructure and electromigration reliability for Cu and Cu(Mn) interconnects

2014 IEEE International Reliability Physics Symposium, 2014, p.5A.5.1-5A.5.5

2014

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Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5), p.05EA01-05EA01-6

2011

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Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

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Scaling of Statistical and Physical Electromigration Characteristics in Cu Interconnects

MRS proceedings, 2006, Vol.914, Article 0914-F06-01

2006

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In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Microelectronic engineering, 2015-04, Vol.137, p.47-53

2015

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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Journal of visualized experiments, 2015-06 (100)

2015

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Large-Scale Electromigration Statistics for Cu Interconnects

MRS proceedings, 2009, Vol.1156 (1), Article 1156-D06-06

2009

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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Journal of visualized experiments, 2015-06 (100), p.e52447-e52447

2015

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Scaling effects on microstructure and reliability for Cu interconnects

International journal of materials research, 2010-02, Vol.101 (2), p.216-227

2010

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An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.2F.1.1-2F.1.5

2013

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Statistical analysis of electromigration lifetimes and void evolution in copper interconnects

Hauschildt, Meike

2005

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Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers

MRS proceedings, 2001, Vol.695, Article L1.11.1

2001

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Effects of Grain Structure on Electromigration of Cu Interconnects

Meeting abstracts (Electrochemical Society), 2008-08, Vol.MA2008-02 (28), p.2070-2070

2008

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Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

Advanced Interconnects for ULSI Technology, 2012, p.291-337

2012

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Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation

IEEE transactions on device and materials reliability, 2009-03, Vol.9 (1), p.20-30

2009

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Essential control of early B-cell development by Mef2 transcription factors

Blood, 2016-02, Vol.127 (5), p.572-581

2016

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Late Mortality After COVID-19 Infection Among US Veterans vs Risk-Matched Comparators: A 2-Year Cohort Analysis

JAMA internal medicine, 2023-10, Vol.183 (10), p.1111

2023

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Regional variation in financial hardship among US veterans during the COVID-19 pandemic

Health affairs scholar, 2024-06, Vol.2 (6), p.qxae075

2024

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Self-Reported Everyday Functioning After COVID-19 Infection

JAMA network open, 2024-03, Vol.7 (3), p.e240869

2024

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Reliability
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Engineering, Electrical & Electronic
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General Physics And Astronomy
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Microstructure
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Copper
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Dielectric Breakdown
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Science & Technology - Other Topics
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Time-Dependent Dielectric Breakdown
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Transmission Electron Microscopy
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Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Large-scale statistical analysis of early failures in Cu electromigration,Part I: Dominating mechanisms

In situ study on low- k interconnect time-dependent-dielectric-breakdown mechanisms

Large-scale statistical analysis of early failures in Cu electromigration,Part II: Scaling behavior and short-length effects

Advanced metallization concepts and impact on reliability

Scaling effects on microstructure and electromigration reliability for Cu and Cu(Mn) interconnects

Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Scaling of Statistical and Physical Electromigration Characteristics in Cu Interconnects

In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Large-Scale Electromigration Statistics for Cu Interconnects

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Scaling effects on microstructure and reliability for Cu interconnects

An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures

Statistical analysis of electromigration lifetimes and void evolution in copper interconnects

Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers

Effects of Grain Structure on Electromigration of Cu Interconnects

Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation

Essential control of early B-cell development by Mef2 transcription factors

Late Mortality After COVID-19 Infection Among US Veterans vs Risk-Matched Comparators: A 2-Year Cohort Analysis

Regional variation in financial hardship among US veterans during the COVID-19 pandemic

Self-Reported Everyday Functioning After COVID-19 Infection

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