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Co-precipitation of MnO and Cu in an ionic liquid as a first step toward self-formed barrier layers

New journal of chemistry, 2020, Vol.44 (1), p.265-272

2020

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Nucleation and Growth of Metals: From Thin Films to Nanoparticles

Haumesser, Paul-Henri

1, 2016

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Ruthenium Nanoparticles in Ionic Liquids – A Saga

Current organic chemistry, 2013-02, Vol.17 (4), p.414-429

2013

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Electrochemistry: general discussion

Faraday discussions, 2018-01, Vol.26, p.45-426

2018

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An Efficient, Versatile, and Safe Access to Supported Metallic Nanoparticles on Porous Silicon with Ionic Liquids

International journal of molecular sciences, 2016-06, Vol.17 (6), p.876-876

2016

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Effect of Surface Chemistry on the Electrical Double Layer in a Long-Chain Ionic Liquid

Langmuir, 2023-11, Vol.39 (47), p.16785-16796

2023

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Bimetallic Ru–Cu Nanoparticles Synthesized in Ionic Liquids: Kinetically Controlled Size and Structure

Topics in catalysis, 2013, Vol.56 (13-14), p.1192-1198

2013

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Magnetic, Structural, and Chemical Properties of Cobalt Nanoparticles Synthesized in Ionic Liquids

Langmuir, 2018-06, Vol.34 (24), p.7086-7095

2018

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Electrochemical atomic layer deposition of copper nanofilms on ruthenium

Journal of crystal growth, 2010-04, Vol.312 (8), p.1271-1276

2010

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Czochralski growth of six Yb-doped double borate and silicate laser materials

Journal of crystal growth, 2001-11, Vol.233 (1), p.233-242

2001

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Impact of Surface Chemistry on Copper Deposition in Mesoporous Silicon

Langmuir, 2016-08, Vol.32 (30), p.7452-7458

2016

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Determination of laser parameters of ytterbium-doped oxide crystalline materials

Journal of the Optical Society of America. B, Optical physics, 2002-10, Vol.19 (10), p.2365

2002

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Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells

AIP Conference Proceedings, 2021, Vol.2367 (1)

2021

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E-ALD of Cu Nanofilms on Ru/Ta Wafers Using Surface Limited Redox Replacement

Journal of the Electrochemical Society, 2010, Vol.157 (8), p.D466

2010

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Spectroscopic and crystal-field analysis of new Yb-doped laser materials

Journal of physics. Condensed matter, 2001-06, Vol.13 (23), p.5427-5447

2001

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III-V multi-junction solar cell using metal wrap through contacts

AIP Conference Proceedings, 2016, Vol.1766 (1)

2016

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High-temperature contactless viscosity measurements by the gas–film levitation technique: Application to oxide and metallic glasses

Review of scientific instruments, 2002-09, Vol.73 (9), p.3275-3285

2002

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Alkoxysilane Layers Compatible with Copper Deposition for Advanced Semiconductor Device Applications

Langmuir, 2010-06, Vol.26 (11), p.8981-8987

2010

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Inhomogeneous nucleation and growth of palladium and alloyed cobalt during self-aligned capping of advanced copper interconnects

Thin solid films, 2010-06, Vol.518 (17), p.4773-4778

2010

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Energy-filtered PEEM imaging of polycrystalline Cu surfaces with work function contrast and high lateral resolution

e-Journal of Surface Science and Nanotechnology, 2006, Vol.4, pp.431-434

2006

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On the Reactivity of Silicon Nitride during the Electroless NiP Deposition for the Front Side Metallization of Crystalline Silicon Solar Cells

ECS solid state letters, 2012-08, Vol.1 (3), p.P51-P53

2012

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Electrochemical Behavior of Copper in Post-Via-Etch Cleaning Solutions

ECS transactions, 2007, Vol.11 (2), p.395-402

2007

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Advanced Substrates for GaN-Based Power Devices

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.168-174

2019

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Synthesis of Copper and Copper-Ruthenium Nanoparticles in Ionic Liquids for the Metallization of Advanced Interconnect Structures

ECS transactions, 2011, Vol.35 (10), p.11-16

2011

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Electroless deposition of CoWP: Material characterization and process optimization on 300 mm wafers

Microelectronic engineering, 2006-11, Vol.83 (11), p.2082-2087

2006

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Co-precipitation of MnO and Cu in an ionic liquid as a first step toward self-formed barrier layers

Nucleation and Growth of Metals: From Thin Films to Nanoparticles

Ruthenium Nanoparticles in Ionic Liquids – A Saga

Electrochemistry: general discussion

An Efficient, Versatile, and Safe Access to Supported Metallic Nanoparticles on Porous Silicon with Ionic Liquids

Effect of Surface Chemistry on the Electrical Double Layer in a Long-Chain Ionic Liquid

Bimetallic Ru–Cu Nanoparticles Synthesized in Ionic Liquids: Kinetically Controlled Size and Structure

Magnetic, Structural, and Chemical Properties of Cobalt Nanoparticles Synthesized in Ionic Liquids

Electrochemical atomic layer deposition of copper nanofilms on ruthenium

Czochralski growth of six Yb-doped double borate and silicate laser materials

Impact of Surface Chemistry on Copper Deposition in Mesoporous Silicon

Determination of laser parameters of ytterbium-doped oxide crystalline materials

Project ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells

E-ALD of Cu Nanofilms on Ru/Ta Wafers Using Surface Limited Redox Replacement

Spectroscopic and crystal-field analysis of new Yb-doped laser materials

III-V multi-junction solar cell using metal wrap through contacts

High-temperature contactless viscosity measurements by the gas–film levitation technique: Application to oxide and metallic glasses

Alkoxysilane Layers Compatible with Copper Deposition for Advanced Semiconductor Device Applications

Inhomogeneous nucleation and growth of palladium and alloyed cobalt during self-aligned capping of advanced copper interconnects

Energy-filtered PEEM imaging of polycrystalline Cu surfaces with work function contrast and high lateral resolution

On the Reactivity of Silicon Nitride during the Electroless NiP Deposition for the Front Side Metallization of Crystalline Silicon Solar Cells

Electrochemical Behavior of Copper in Post-Via-Etch Cleaning Solutions

Advanced Substrates for GaN-Based Power Devices

Synthesis of Copper and Copper-Ruthenium Nanoparticles in Ionic Liquids for the Metallization of Advanced Interconnect Structures

Electroless deposition of CoWP: Material characterization and process optimization on 300 mm wafers

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