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Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Journal of electronic materials, 2004-12, Vol.33 (12), p.1485-1496

2004

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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Journal of electronic materials, 2006-01, Vol.35 (1), p.94-106

2006

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A new class of ultra-hard materials based on AlMgB14

Scripta materialia, 2000-02, Vol.42 (6), p.597-602

2000

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Nature of the cubic to rhombohedral structural transformation in ( Ag Sb Te 2 ) 15 ( Ge Te ) 85 thermoelectric material

Journal of applied physics, 2007-03, Vol.101 (5), p.053715-053715-6

2007

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Analysis of Ce- and Yb-Doped TAGS-85 Materials with Enhanced Thermoelectric Figure of Merit

Advanced functional materials, 2011-02, Vol.21 (3), p.441-447

2011

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Coefficient of thermal expansion of AlMgB14

Scripta materialia, 2002-05, Vol.46 (9), p.629-633

2002

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Enhanced wear resistance in AlMgB14-TiB2 composites

Wear, 2011-06, Vol.271 (5-6), p.640-646

2011

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Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-free solder alloys

Journal of electronic materials, 2002-11, Vol.31 (11), p.1190-1194

2002

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Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

JOM (1989), 2007-07, Vol.59 (7), p.38-43

2007

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Al2MgO4, Fe3O4, and FeB impurities in AlMgB14

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2003-06, Vol.351 (1-2), p.117-122

2003

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Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

Journal of electronic materials, 2003-12, Vol.32 (12), p.1384-1391

2003

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Erosion resistance of TiB2-ZrB2 composites

Wear, 2009-06, Vol.267 (1), p.136-143

2009

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Phase changes induced in hexagonal boron nitride by high energy mechanical milling

Journal of materials science, 2004, Vol.39 (1), p.343-347

2004

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A new fracture-resistant binder phase for use with AlMgB14 and other ultra-hard ceramics

Journal of alloys and compounds, 2004-03, Vol.366 (1-2), p.145-151

2004

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Microstructure and wear resistance of low temperature hot pressed TiB2

Wear, 2009-05, Vol.266 (11-12), p.1171-1177

2009

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Application of an asymmetrical four point bend shear test to solder joints

Journal of electronic materials, 2001-09, Vol.30 (9), p.1206-1213

2001

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Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

Journal of electronic materials, 2001-09, Vol.30 (9), p.1214-1221

2001

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Electrical properties of some (1,1,1) intermetallic compounds

Journal of materials science, 1999-01, Vol.34 (2), p.323-327

1999

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Electrical properties of Ga and ZnS doped ZnO prepared by mechanical alloying

Journal of applied physics, 1998-06, Vol.83 (11), p.5858-5861

1998

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Magnetization study of the ultra-hard material MgAlB14

Journal of magnetism and magnetic materials, 2003-09, Vol.265 (1), p.23-32

2003

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Nature of the cubic to rhombohedral structural transformation in (AgSbTe[subscript 2])[subscript 15](GeTe)[subscript 85] thermoelectric material

Journal of applied physics, 2009-03, Vol.101 ((5) ; 05, 2007)

2009

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A high-strength, high-conductivity Al–Ti deformation processed metal metal matrix composite

Composites. Part A, Applied science and manufacturing, 1999-01, Vol.30 (3), p.239-247

1999

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Application of hot isostatic pressing for consolidation of n-type silicon–germanium alloys prepared by mechanical alloying

Materials science & engineering. B, Solid-state materials for advanced technology, 1999-06, Vol.60 (2), p.137-142

1999

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Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

JOM (1989), 2002-06, Vol.54 (6), p.26-29

2002

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Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Journal of electronic materials, 2012-07, Vol.41 (7), p.1868-1881

2012

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Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

A new class of ultra-hard materials based on AlMgB14

Nature of the cubic to rhombohedral structural transformation in ( Ag Sb Te 2 ) 15 ( Ge Te ) 85 thermoelectric material

Analysis of Ce- and Yb-Doped TAGS-85 Materials with Enhanced Thermoelectric Figure of Merit

Coefficient of thermal expansion of AlMgB14

Enhanced wear resistance in AlMgB14-TiB2 composites

Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-free solder alloys

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

Al2MgO4, Fe3O4, and FeB impurities in AlMgB14

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

Erosion resistance of TiB2-ZrB2 composites

Phase changes induced in hexagonal boron nitride by high energy mechanical milling

A new fracture-resistant binder phase for use with AlMgB14 and other ultra-hard ceramics

Microstructure and wear resistance of low temperature hot pressed TiB2

Application of an asymmetrical four point bend shear test to solder joints

Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

Electrical properties of some (1,1,1) intermetallic compounds

Electrical properties of Ga and ZnS doped ZnO prepared by mechanical alloying

Magnetization study of the ultra-hard material MgAlB14

Nature of the cubic to rhombohedral structural transformation in (AgSbTe[subscript 2])[subscript 15](GeTe)[subscript 85] thermoelectric material

A high-strength, high-conductivity Al–Ti deformation processed metal metal matrix composite

Application of hot isostatic pressing for consolidation of n-type silicon–germanium alloys prepared by mechanical alloying

Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

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