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Friction and wear mechanisms in AlMgB14-TiB2 nanocoatings

Wear, 2011-07, Vol.271 (9-10), p.2111-2115

2011

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Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Journal of electronic materials, 2004-12, Vol.33 (12), p.1485-1496

2004

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Analysis of Ce- and Yb-Doped TAGS-85 Materials with Enhanced Thermoelectric Figure of Merit

Advanced functional materials, 2011-02, Vol.21 (3), p.441-447

2011

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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Journal of electronic materials, 2006-01, Vol.35 (1), p.94-106

2006

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Enhanced wear resistance in AlMgB14-TiB2 composites

Wear, 2011-06, Vol.271 (5-6), p.640-646

2011

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Nature of the cubic to rhombohedral structural transformation in ( Ag Sb Te 2 ) 15 ( Ge Te ) 85 thermoelectric material

Journal of applied physics, 2007-03, Vol.101 (5), p.053715-053715-6

2007

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386 Prospective Comparison of Contrast-Enhanced Magnetic Resonance Imaging Versus Contrast-Enhanced Computed Tomography for Suspected Appendicitis in Children and Young Adults

Annals of emergency medicine, 2016-10, Vol.68 (4), p.S147-S148

2016

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A new class of ultra-hard materials based on AlMgB14

Scripta materialia, 2000-02, Vol.42 (6), p.597-602

2000

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Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

JOM (1989), 2007-07, Vol.59 (7), p.38-43

2007

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Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Journal of electronic materials, 2001-09, Vol.30 (9), p.1050-1059

2001

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Erosion resistance of TiB2-ZrB2 composites

Wear, 2009-06, Vol.267 (1), p.136-143

2009

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Microstructure and wear resistance of low temperature hot pressed TiB2

Wear, 2009-05, Vol.266 (11-12), p.1171-1177

2009

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Coefficient of thermal expansion of AlMgB14

Scripta materialia, 2002-05, Vol.46 (9), p.629-633

2002

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Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Journal of electronic materials, 2002-11, Vol.31 (11), p.1166-1174

2002

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Nature of the cubic to rhombohedral structural transformation in (AgSbTe[subscript 2])[subscript 15](GeTe)[subscript 85] thermoelectric material

Journal of applied physics, 2009-03, Vol.101 ((5) ; 05, 2007)

2009

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Al2MgO4, Fe3O4, and FeB impurities in AlMgB14

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2003-06, Vol.351 (1-2), p.117-122

2003

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Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-free solder alloys

Journal of electronic materials, 2002-11, Vol.31 (11), p.1190-1194

2002

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Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

Journal of electronic materials, 2003-12, Vol.32 (12), p.1384-1391

2003

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A new fracture-resistant binder phase for use with AlMgB14 and other ultra-hard ceramics

Journal of alloys and compounds, 2004-03, Vol.366 (1-2), p.145-151

2004

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Phase changes induced in hexagonal boron nitride by high energy mechanical milling

Journal of materials science, 2004, Vol.39 (1), p.343-347

2004

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Application of an asymmetrical four point bend shear test to solder joints

Journal of electronic materials, 2001-09, Vol.30 (9), p.1206-1213

2001

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Electrical properties of some (1,1,1) intermetallic compounds

Journal of materials science, 1999-01, Vol.34 (2), p.323-327

1999

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Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Journal of electronic materials, 2012-07, Vol.41 (7), p.1868-1881

2012

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Magnetization study of the ultra-hard material MgAlB14

Journal of magnetism and magnetic materials, 2003-09, Vol.265 (1), p.23-32

2003

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Electrical properties of Ga and ZnS doped ZnO prepared by mechanical alloying

Journal of applied physics, 1998-06, Vol.83 (11), p.5858-5861

1998

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Friction and wear mechanisms in AlMgB14-TiB2 nanocoatings

Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength

Analysis of Ce- and Yb-Doped TAGS-85 Materials with Enhanced Thermoelectric Figure of Merit

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Enhanced wear resistance in AlMgB14-TiB2 composites

Nature of the cubic to rhombohedral structural transformation in ( Ag Sb Te 2 ) 15 ( Ge Te ) 85 thermoelectric material

386 Prospective Comparison of Contrast-Enhanced Magnetic Resonance Imaging Versus Contrast-Enhanced Computed Tomography for Suspected Appendicitis in Children and Young Adults

A new class of ultra-hard materials based on AlMgB14

Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Erosion resistance of TiB2-ZrB2 composites

Microstructure and wear resistance of low temperature hot pressed TiB2

Coefficient of thermal expansion of AlMgB14

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Nature of the cubic to rhombohedral structural transformation in (AgSbTe[subscript 2])[subscript 15](GeTe)[subscript 85] thermoelectric material

Al2MgO4, Fe3O4, and FeB impurities in AlMgB14

Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-free solder alloys

Isothermal aging of near-eutectic Sn-Ag-Cu solder alloys and its effect on electrical resistivity

A new fracture-resistant binder phase for use with AlMgB14 and other ultra-hard ceramics

Phase changes induced in hexagonal boron nitride by high energy mechanical milling

Application of an asymmetrical four point bend shear test to solder joints

Electrical properties of some (1,1,1) intermetallic compounds

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

Magnetization study of the ultra-hard material MgAlB14

Electrical properties of Ga and ZnS doped ZnO prepared by mechanical alloying

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