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Topology Review and Derivation Methodology of Single-Phase Transformerless Photovoltaic Inverters for Leakage Current Suppression

IEEE transactions on industrial electronics (1982), 2015-07, Vol.62 (7), p.4537-4551

2015

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IEEE_Xplore

Junction Temperature Extraction Approach With Turn-Off Delay Time for High-Voltage High-Power IGBT Modules

IEEE transactions on power electronics, 2016-07, Vol.31 (7), p.5122-5132

2016

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IEEE_Xplore

A Short-Circuit Safe Operation Area Identification Criterion for SiC MOSFET Power Modules

IEEE transactions on industry applications, 2017-05, Vol.53 (3), p.2880-2887

2017

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IEEE_Xplore

Investigation and Classification of Short-Circuit Failure Modes Based on Three-Dimensional Safe Operating Area for High-Power IGBT Modules

IEEE transactions on power electronics, 2018-02, Vol.33 (2), p.1075-1086

2018

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IEEE_Xplore

Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum dI/dt During Turn-off for High Power Trench Gate/Field-Stop IGBT Modules

IEEE transactions on power electronics, 2017-08, Vol.32 (8), p.6394-6404

2017

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IEEE_Xplore

Asymmetrical Duty Cycle-Controlled LLC Resonant Converter With Equivalent Switching Frequency Doubler

IEEE transactions on power electronics, 2016-07, Vol.31 (7), p.4963-4973

2016

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IEEE_Xplore

Online High-Power p-i-n Diode Junction Temperature Extraction With Reverse Recovery Fall Storage Charge

IEEE transactions on power electronics, 2017-04, Vol.32 (4), p.2558-2567

2017

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IEEE_Xplore

Decoupling-Controlled Triport Composited DC/DC Converter for Multiple Energy Interface

IEEE transactions on industrial electronics (1982), 2015-07, Vol.62 (7), p.4504-4513

2015

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IEEE_Xplore

Online High-Power P-i-N Diode Chip Temperature Extraction and Prediction Method With Maximum Recovery Current di/dt

IEEE transactions on power electronics, 2015-05, Vol.30 (5), p.2395-2404

2015

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IEEE_Xplore

Theoretical Evaluation of Stability Improvement Brought by Resonant Current Loop for Paralleled LLC Converters

IEEE transactions on industrial electronics (1982), 2015-07, Vol.62 (7), p.4170-4180

2015

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IEEE_Xplore

Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules

IEEE journal of emerging and selected topics in power electronics, 2020-06, Vol.8 (2), p.1622-1632

2020

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IEEE_Xplore

Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

Energies (Basel), 2017-03, Vol.10 (3), p.384

2017

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Analytical Model and Design of Voltage Balancing Parameters of Series-Connected SiC MOSFETs Considering Non-Flat Miller Plateau of Gate Voltage

Energies (Basel), 2022-03, Vol.15 (5), p.1722

2022

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A highly efficient power block with series connection of power SiC MOSFETs‐design, characterization and assessment in MV converters

IET power electronics, 2022-05, Vol.15 (7), p.605-620

2022

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A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications

Energies (Basel), 2019-04, Vol.12 (7), p.1319

2019

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Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

Energies (Basel), 2020-05, Vol.13 (10), p.2613

2020

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Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined with Artificial Neural Network Model

IEEE open journal of power electronics, 2023-01, Vol.4, p.1-11

2023

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A Highly Precise On-State Voltage Measurement Circuit With Dual Current Sources for Online Operation of SiC MOSFETs

IEEE open journal of power electronics, 2023-01, Vol.4, p.1-5

2023

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A Statistical Submodule Open-Circuit Failure Diagnosis Method for Modular Multilevel Converters (MMCs) With Variance Measurement

IEEE open journal of power electronics, 2020, Vol.1, p.180-189

2020

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A Coupled Inductor Based Circuit for Voltage Balancing among Series Connected SiC MOSFETs

2020 IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, p.2588-2593

2020

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IEEE_Xplore

Implications of Ageing Through Power Cycling on the Short-Circuit Robustness of 1.2-kV SiC mosfets

IEEE transactions on power electronics, 2019-11, Vol.34 (11), p.11182-11190

2019

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IEEE_Xplore

Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules

IEEE journal of emerging and selected topics in power electronics, 2020-06, Vol.8 (2), p.1657-1667

2020

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IEEE_Xplore

Detection and Localization of Submodule Open-Circuit Failures for Modular Multilevel Converters With Single Ring Theorem

IEEE transactions on power electronics, 2019-04, Vol.34 (4), p.3729-3739

2019

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IEEE_Xplore

Enabling Junction Temperature Estimation via Collector-Side Thermo-Sensitive Electrical Parameters Through Emitter Stray Inductance in High-Power IGBT Modules

IEEE transactions on industrial electronics (1982), 2018-06, Vol.65 (6), p.4724-4738

2018

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IEEE_Xplore

Module Multilevel-Clamped Composited Multilevel Converter (M-MC²) with Dual T-Type Modules and One Diode Module

JOURNAL OF POWER ELECTRONICS, 2014-11, Vol.14 (6), p.1189-1196

2014

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Topology Review and Derivation Methodology of Single-Phase Transformerless Photovoltaic Inverters for Leakage Current Suppression

Junction Temperature Extraction Approach With Turn-Off Delay Time for High-Voltage High-Power IGBT Modules

A Short-Circuit Safe Operation Area Identification Criterion for SiC MOSFET Power Modules

Investigation and Classification of Short-Circuit Failure Modes Based on Three-Dimensional Safe Operating Area for High-Power IGBT Modules

Analytical and Experimental Investigation on A Dynamic Thermo-Sensitive Electrical Parameter With Maximum dI/dt During Turn-off for High Power Trench Gate/Field-Stop IGBT Modules

Asymmetrical Duty Cycle-Controlled LLC Resonant Converter With Equivalent Switching Frequency Doubler

Online High-Power p-i-n Diode Junction Temperature Extraction With Reverse Recovery Fall Storage Charge

Decoupling-Controlled Triport Composited DC/DC Converter for Multiple Energy Interface

Online High-Power P-i-N Diode Chip Temperature Extraction and Prediction Method With Maximum Recovery Current di/dt

Theoretical Evaluation of Stability Improvement Brought by Resonant Current Loop for Paralleled LLC Converters

Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules

Simultaneous On-State Voltage and Bond-Wire Resistance Monitoring of Silicon Carbide MOSFETs

Analytical Model and Design of Voltage Balancing Parameters of Series-Connected SiC MOSFETs Considering Non-Flat Miller Plateau of Gate Voltage

A highly efficient power block with series connection of power SiC MOSFETs‐design, characterization and assessment in MV converters

A 3D Thermal Network Model for Monitoring Imbalanced Thermal Distribution of Press-Pack IGBT Modules in MMC-HVDC Applications

Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined with Artificial Neural Network Model

A Highly Precise On-State Voltage Measurement Circuit With Dual Current Sources for Online Operation of SiC MOSFETs

A Statistical Submodule Open-Circuit Failure Diagnosis Method for Modular Multilevel Converters (MMCs) With Variance Measurement

A Coupled Inductor Based Circuit for Voltage Balancing among Series Connected SiC MOSFETs

Implications of Ageing Through Power Cycling on the Short-Circuit Robustness of 1.2-kV SiC mosfets

Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules

Detection and Localization of Submodule Open-Circuit Failures for Modular Multilevel Converters With Single Ring Theorem

Enabling Junction Temperature Estimation via Collector-Side Thermo-Sensitive Electrical Parameters Through Emitter Stray Inductance in High-Power IGBT Modules

Module Multilevel-Clamped Composited Multilevel Converter (M-MC²) with Dual T-Type Modules and One Diode Module

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