UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Effects of planting patterns on yield, quality, and defoliation in machine-harvested cotton

Journal of Integrative Agriculture, 2019-09, Vol.18 (9), p.2019-2028

2019

Volltextzugriff (PDF)

Organic Liquid Fertilizer Coupled With Single Application of Chemical Fertilization Improves Growth, Biomass, and Yield Components of Cotton Under Mulch Drip Irrigation

Frontiers in plant science, 2022-01, Vol.12, p.763525-763525

2022

Volltextzugriff (PDF)

Research of influence factors on spectral recognition for cotton leaf infected by Verticillium wilt

Guang pu xue yu guang pu fen xi, 2014-03, Vol.34 (3), p.795

2014

Volltextzugriff (PDF)

Effects of drought and re-watering on endogenous hormone contents of cotton roots and leaves under drip irrigation with mulch

Ying yong sheng tai xue bao, 2013-04, Vol.24 (4), p.1009-1016

2013

Volltextzugriff (PDF)

Monitoring Chlorophyll and Nitrogen Contents in Cotton Leaf Infected by Verticillium wilt with Spectra Red Edge Parameters

Zuo wu xue bao, 2013, Vol.39 (2), p.319

2013

Volltextzugriff (PDF)

AMIGO2 attenuates innate cisplatin sensitivity by suppression of GSDME‐conferred pyroptosis in non‐small cell lung cancer

Journal of cellular and molecular medicine, 2023-08, Vol.27 (16), p.2412-2423

2023

Volltextzugriff (PDF)

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2014-03, Vol.597, p.219-224

2014

Volltextzugriff (PDF)

Creep behavior of SnAgCu solders containing nano-Al particles

Journal of materials science. Materials in electronics, 2015-06, Vol.26 (6), p.3615-3620

2015

Volltextzugriff (PDF)

Properties and microstructures of SnAgCu–xEu alloys for concentrator silicon solar cells solder layer

Solar energy materials and solar cells, 2014-11, Vol.130, p.397-400

2014

Volltextzugriff (PDF)

18F-FDG and 68 Ga-FAPI PET/CT for the evaluation of periprosthetic joint infection and aseptic loosening in rabbit models

BMC musculoskeletal disorders, 2022-06, Vol.23 (1), p.1-592, Article 592

2022

Volltextzugriff (PDF)

Mechanically Robust Polylactide Fibers with Super Heat Resistance via Constructing in situ Nanofibrils

Chinese journal of polymer science, 2023-06, Vol.41 (6), p.962-971

2023

Volltextzugriff (PDF)

Reliability behavior of lead-free solder joints in electronic components

Journal of materials science. Materials in electronics, 2013, Vol.24 (1), p.172-190

2013

Volltextzugriff (PDF)

Development of SnAg-based lead free solders in electronics packaging

Microelectronics and reliability, 2012-03, Vol.52 (3), p.559-578

2012

Volltextzugriff (PDF)

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

IEEE transactions on electron devices, 2012-12, Vol.59 (12), p.3269-3272

2012

Volltextzugriff (PDF)

The model adaptive space shrinkage (MASS) approach: a new method for simultaneous variable selection and outlier detection based on model population analysis

Analyst (London), 2016-10, Vol.141 (19), p.5586-5597

2016

Volltextzugriff (PDF)

Absence of mutation in miR-34a gene in a Chinese longevity population

Dōngwùxué yánjiū, 2015-03, Vol.36 (2), p.112-114

2015

Volltextzugriff (PDF)

Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging

Journal of materials science. Materials in electronics, 2015-08, Vol.26 (8), p.6194-6197

2015

Volltextzugriff (PDF)

Wettability optimization analysis of lead-free solders with Taguchi method

Journal of materials science. Materials in electronics, 2015-04, Vol.26 (4), p.2605-2608

2015

Volltextzugriff (PDF)

Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging

Journal of materials science. Materials in electronics, 2014-10, Vol.25 (10), p.4489-4494

2014

Volltextzugriff (PDF)

Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method

International journal of nonlinear sciences and numerical simulation, 2014-10, Vol.15 (6), p.405-410

2014

Volltextzugriff (PDF)

Crystal structure of (μ2-2,2′-bipyridine-3,3′-dicarboxylato)-bis(5,5,7,12,12,14-hexamethyl-1,4,8,11-tetraazacyclotetradecane)-di-nickel(II) perchlorate N,N′-dimethylformamide solvate, C50H92Cl2N12Ni2O14

Zeitschrift für Kristallographie. New crystal structures, 2018-05, Vol.233 (3), p.379-381

2018

Volltextzugriff (PDF)

Effect of Zn on properties and microstructure of SnAgCu alloy

Journal of materials science. Materials in electronics, 2012-11, Vol.23 (11), p.1950-1956

2012

Volltextzugriff (PDF)

Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device

International journal of nonlinear sciences and numerical simulation, 2014-08, Vol.15 (5), p.329-335

2014

Volltextzugriff (PDF)

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

International journal of nonlinear sciences and numerical simulation, 2014-06, Vol.15 (3-4), p.197-206

2014

Volltextzugriff (PDF)

Effect of thermal cycles on the interface and property of SnAgCu(nano-Al)/Cu solder joints

Cai liao gong cheng = Journal of materials engineering, 2014-03 (3), p.55-59

2014

Volltextzugriff (PDF)

1 – 25 von 45

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(42)
Mit Volltextzugriff
(37)

Publikationsform

Artikel
(43)
Tagungsberichte
(2)

Sprache

Englisch
(39)
Chinesisch
(5)

Erscheinungsjahr

n.n

Thema

Science & Technology
(31)
Technology
(18)
Engineering
(15)
Physical Sciences
(14)
Materials Science
(13)
Physics
(13)
Life Sciences & Biomedicine
(12)
Materials Science, Multidisciplinary
(10)
Physics, Applied
(9)
Solders
(9)
Engineering, Electrical & Electronic
(8)
Characterization And Evaluation Of Materials
(7)
Chemistry And Materials Science
(7)
Applied Sciences
(6)
Exact Sciences And Technology
(6)
Humans
(6)
Optical And Electronic Materials
(6)
Physics, Condensed Matter
(6)
Alloys
(4)
Electronics
(4)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Effects of planting patterns on yield, quality, and defoliation in machine-harvested cotton

Organic Liquid Fertilizer Coupled With Single Application of Chemical Fertilization Improves Growth, Biomass, and Yield Components of Cotton Under Mulch Drip Irrigation

Research of influence factors on spectral recognition for cotton leaf infected by Verticillium wilt

Effects of drought and re-watering on endogenous hormone contents of cotton roots and leaves under drip irrigation with mulch

Monitoring Chlorophyll and Nitrogen Contents in Cotton Leaf Infected by Verticillium wilt with Spectra Red Edge Parameters

AMIGO2 attenuates innate cisplatin sensitivity by suppression of GSDME‐conferred pyroptosis in non‐small cell lung cancer

Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

Creep behavior of SnAgCu solders containing nano-Al particles

Properties and microstructures of SnAgCu–xEu alloys for concentrator silicon solar cells solder layer

18F-FDG and 68 Ga-FAPI PET/CT for the evaluation of periprosthetic joint infection and aseptic loosening in rabbit models

Mechanically Robust Polylactide Fibers with Super Heat Resistance via Constructing in situ Nanofibrils

Reliability behavior of lead-free solder joints in electronic components

Development of SnAg-based lead free solders in electronics packaging

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

The model adaptive space shrinkage (MASS) approach: a new method for simultaneous variable selection and outlier detection based on model population analysis

Absence of mutation in miR-34a gene in a Chinese longevity population

Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging

Wettability optimization analysis of lead-free solders with Taguchi method

Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging

Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method

Crystal structure of (μ2-2,2′-bipyridine-3,3′-dicarboxylato)-bis(5,5,7,12,12,14-hexamethyl-1,4,8,11-tetraazacyclotetradecane)-di-nickel(II) perchlorate N,N′-dimethylformamide solvate, C50H92Cl2N12Ni2O14

Effect of Zn on properties and microstructure of SnAgCu alloy

Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Effect of thermal cycles on the interface and property of SnAgCu(nano-Al)/Cu solder joints

Suchergebnisse filtern