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Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

IEEE transactions on power electronics, 2015-05, Vol.30 (5), p.2413-2426

2015

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Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium-Ion Cells

Energies (Basel), 2019-07, Vol.12 (15), p.2910

2019

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Volumetric effective cure shrinkage measurement of dual curable adhesives by fiber Bragg grating sensor

Journal of materials science, 2020-08, Vol.55 (22), p.9655-9664

2020

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Effect of junction temperature on heat dissipation of high power light emitting diodes

Journal of applied physics, 2016-03, Vol.119 (12)

2016

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Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.764-772

2018

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Measurements of true leak rates of MEMS packages

Sensors, 2012-03, Vol.12 (3), p.3082-3104

Han, Bongtae

2012

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Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-08, Vol.8 (8), p.1363-1372

2018

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Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables

Materials, 2021-08, Vol.14 (16), p.4619

2021

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In\ Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.750-763

2018

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Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Journal of Mechanical Science and Technology, 2014, 28(3), , pp.879-886

2014

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Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows

Applied sciences, 2021-11, Vol.11 (22), p.11071

2021

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Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire

Microelectronics and reliability, 2014-01, Vol.54 (1), p.131-137

2014

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Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse Approach

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-11, Vol.5 (11), p.1635-1643

2015

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Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

Microelectronics and reliability, 2022-03, Vol.130, p.114480, Article 114480

2022

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THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS

Journal of thermal stresses, 2003-06, Vol.26 (6), p.583-613

Han, Bongtae

2003

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Direct Submount Cooling of High-Power LEDs

IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.698-712

2010

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Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

Journal of microelectromechanical systems, 2009-06, Vol.18 (3), p.577-587

2009

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High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Polymer degradation and stability, 2021-06, Vol.188, p.109572, Article 109572

2021

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Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes in wind turbines

Mechanical systems and signal processing, 2016-03, Vol.70-71, p.161-175

2016

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Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

IEEE transactions on components and packaging technologies, 2010-06, Vol.33 (2), p.340-346

2010

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Life prediction of LED-based recess downlight cooled by synthetic jet

Microelectronics and reliability, 2012-05, Vol.52 (5), p.937-948

2012

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Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature

IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.809-818

2010

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Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire

IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.728-737

2010

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Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-04, Vol.14 (4), p.743-746

2024

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Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

IEEE transactions on industrial electronics (1982), 2022-03, Vol.69 (3), p.2996-3006

2022

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Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium-Ion Cells

Volumetric effective cure shrinkage measurement of dual curable adhesives by fiber Bragg grating sensor

Effect of junction temperature on heat dissipation of high power light emitting diodes

Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

Measurements of true leak rates of MEMS packages

Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables

In\ Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Thermal Performance of Cryogenic Micro-Pin Fin Coolers with Two-Phase Liquid Nitrogen Flows

Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire

Characterization of Die-Attach Thermal Interface of High-Power Light-Emitting Diodes: An Inverse Approach

Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

THERMAL STRESSES IN MICROELECTRONICS SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION USING PHOTOMECHANICS METHODS

Direct Submount Cooling of High-Power LEDs

Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes in wind turbines

Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

Life prediction of LED-based recess downlight cooled by synthetic jet

Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature

Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire

Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

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