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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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Electromigration Behavior of Cu Core Solder Joints Under High Current Density

Electronic Materials Letters, 2020, 16(6), , pp.513-519

2020

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Journal of electronic materials, 2020-10, Vol.49 (10), p.6073-6079

2020

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.6835-6842

2020

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Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Electronic Materials Letters, 2020, 16(4), , pp.332-339

2020

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Electronic Materials Letters, 2020, 16(4), , pp.347-354

2020

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Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-07, Vol.14 (7), p.1200-1206

2024

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Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board

Journal of materials science. Materials in electronics, 2024-03, Vol.35 (7), p.470, Article 470

2024

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Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics

Journal of alloys and compounds, 2019-07, Vol.794, p.341-346

2019

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The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

Journal of electronic materials, 2020-11, Vol.49 (11), p.6746-6753

2020

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Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Journal of nanoscience and nanotechnology, 2018-09, Vol.18 (9), p.6316-6320

2018

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Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Microelectronics and reliability, 2020-09, Vol.112, p.113918, Article 113918

2020

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Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions

Journal of nanoscience and nanotechnology, 2018-09, Vol.18 (9), p.6162-6166

2018

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Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

Advanced engineering materials, 2020-12, Vol.22 (12), p.n/a

2020

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Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)

Science of advanced materials, 2020-04, Vol.12 (4), p.556-563

2020

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Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint

Science of advanced materials, 2020-04, Vol.12 (4), p.538-543

2020

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Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

Science of advanced materials, 2020-04, Vol.12 (4), p.564-570

2020

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Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

Science of advanced materials, 2020-04, Vol.12 (4), p.525-530

2020

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Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Journal of electronic materials, 2018-07, Vol.47 (7), p.4165-4169

2018

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Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (20), p.18848-18857

2019

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Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-09, Vol.10 (9), p.1432-1437

2020

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Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.12869-12875

2019

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Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2121-2126

2018

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Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.2029-2033

2023

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RF Characterization in Range of 18GHz in Fan-out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.2002-2007

2022

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Electromigration Behavior of Cu Core Solder Joints Under High Current Density

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification

Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board

Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics

The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

Mechanical Properties and Microstructure of Cu Core Solder Ball (CCSB) Compared with SAC305 Solder for 2.5D and 3D Structure Package (PKG)

Electromigration Behavior of Sn58Bi and Sn58Bi Epoxy Solder Joint

Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness

Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP

RF Characterization in Range of 18GHz in Fan-out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property

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