UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 769

Sortiert nach

Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Sensors and actuators. A. Physical., 2018-08, Vol.279, p.671-679

2018

Volltextzugriff (PDF)

Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm

Journal of microelectromechanical systems, 2020-06, Vol.29 (3), p.418-426

2020

Volltextzugriff (PDF)

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

Journal of micromechanics and microengineering, 2017-01, Vol.27 (1), p.15029

2017

Volltextzugriff (PDF)

Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

IEEE sensors journal, 2020-09, Vol.20 (17), p.10159-10169

2020

Volltextzugriff (PDF)

Physiological Effects of Shinrin-yoku (Taking in the Atmosphere of the Forest)—Using Salivary Cortisol and Cerebral Activity as Indicators

Journal of PHYSIOLOGICAL ANTHROPOLOGY, 2007, Vol.26(2), pp.123-128

2007

Volltextzugriff (PDF)

Physiological Effects of Shinrin-yoku (Taking in the Atmosphere of the Forest) in an Old-Growth Broadleaf Forest in Yamagata Prefecture, Japan

Journal of PHYSIOLOGICAL ANTHROPOLOGY, 2007, Vol.26(2), pp.135-142

2007

Volltextzugriff (PDF)

Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots

Journal of robotics and mechatronics, 2020-04, Vol.32 (2), p.323-332

2020

Volltextzugriff (PDF)

Moment detection by integrated tactile sensors for partner robot applications

Electrical engineering in Japan, 2021-06, Vol.214 (2), p.n/a

2021

Volltextzugriff (PDF)

Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest) in a mixed forest in Shinano Town, Japan

Scandinavian journal of forest research, 2008-06, Vol.23 (3), p.278-283

2008

Volltextzugriff (PDF)

Metal‐bonding‐based hermetic wafer‐level MEMS packaging technology using in‐plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough

Electrical engineering in Japan, 2019-01, Vol.206 (2), p.44-53

2019

Volltextzugriff (PDF)

Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Micromachines (Basel), 2018-04, Vol.9 (4), p.181

2018

Volltextzugriff (PDF)

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

Micromachines (Basel), 2016-12, Vol.7 (12), p.234-234

2016

Volltextzugriff (PDF)

Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization

Sensors and actuators. A. Physical., 2017-07, Vol.261, p.210-218

2017

Volltextzugriff (PDF)

Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Sensors and actuators. A. Physical., 2018-04, Vol.273, p.30-41

2018

Volltextzugriff (PDF)

Environmentally Benign Single-Wafer Spin Cleaning Using Ultra-Diluted HF/Nitrogen Jet Spray Without Causing Structural Damage and Material Loss

IEEE transactions on semiconductor manufacturing, 2007-08, Vol.20 (3), p.252-258

2007

Volltextzugriff (PDF)

Sealed Cavity Pressure Evaluation from 1 Pa to Over 10 KPA Using Thin Diaphragm for MEMS Vacuum Packaging

2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS), 2019, p.1045-1048

2019

Volltextzugriff (PDF)

Bottom-Up Approach to Establish Coordination Mechanisms for Disaster Preparedness Among Largely Private Health-Care Providers in Central Tokyo

Disaster medicine and public health preparedness, 2023-01, Vol.17, p.e64-e64, Article e64

Minato Disaster Medical Care System Study Group

2023

Volltextzugriff (PDF)

Wafer-to-wafer transfer process of barium strontium titanate for frequency tuning applications using laser pre-irradiation

Journal of micromechanics and microengineering, 2015-03, Vol.25 (3), p.35015-8

2015

Volltextzugriff (PDF)

Integration of BST varactors with surface acoustic wave device by film transfer technology for tunable RF filters

Journal of micromechanics and microengineering, 2013-02, Vol.23 (2), p.25005-9

2013

Volltextzugriff (PDF)

Wideband tunable Love wave filter using electrostatically actuated MEMS variable capacitors integrated on lithium niobate

Sensors and actuators. A. Physical., 2012-12, Vol.188, p.456-462

2012

Volltextzugriff (PDF)

SMALL ORGAN SIZE 1 and SMALL ORGAN SIZE 2/DWARF AND LOW-TILLERING Form aComplex to Integrate Auxin and Brassinosteroid Signaling in Rice

分子植物：英文版, 2017, Vol.10 (4), p.590-604

Ko Hirano Hideki Yoshida Koichiro Aya Mayuko Kawamura Makoto Hayashi Tokunori Hobo Karma Sato-lzawa Hidemi Kitano Miyako Ueguchi-Tanaka Makoto Matsuoka

2017

Volltextzugriff (PDF)

ScAlN Lamb wave resonator in GHz range released by XeF2 etching

2013 IEEE International Ultrasonics Symposium (IUS), 2013, p.1378-1381

2013

Volltextzugriff (PDF)

Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps

2012 IEEE International Ultrasonics Symposium, 2012, p.295-298

2012

Volltextzugriff (PDF)

Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS), 2013, p.271-274

2013

Volltextzugriff (PDF)

A novel fabrication technique and new conjugated polymers for multilayer polymer light-emitting diodes

Polymers for advanced technologies, 1997-07, Vol.8 (7), p.459-464

1997

Volltextzugriff (PDF)

1 – 25 von 769

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(583)
Mit Volltextzugriff
(703)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

15 weitere anzeigen...

Weniger anzeigen...

Zeitschrift / Serie

5 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(5)

Menü

Weitere Dienste

Einstellungen

Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Zero-Balance Method for Evaluation of Sealed Cavity Pressure Down to Single Digit Pa Using Thin Silicon Diaphragm

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

Event-Driven Tactile Sensing System Including 100 CMOS-MEMS Integrated 3-Axis Force Sensors Based on Asynchronous Serial Bus Communication

Physiological Effects of Shinrin-yoku (Taking in the Atmosphere of the Forest)—Using Salivary Cortisol and Cerebral Activity as Indicators

Physiological Effects of Shinrin-yoku (Taking in the Atmosphere of the Forest) in an Old-Growth Broadleaf Forest in Yamagata Prefecture, Japan

Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots

Moment detection by integrated tactile sensors for partner robot applications

Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest) in a mixed forest in Shinano Town, Japan

Metal‐bonding‐based hermetic wafer‐level MEMS packaging technology using in‐plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough

Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization

Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias

Environmentally Benign Single-Wafer Spin Cleaning Using Ultra-Diluted HF/Nitrogen Jet Spray Without Causing Structural Damage and Material Loss

Sealed Cavity Pressure Evaluation from 1 Pa to Over 10 KPA Using Thin Diaphragm for MEMS Vacuum Packaging

Bottom-Up Approach to Establish Coordination Mechanisms for Disaster Preparedness Among Largely Private Health-Care Providers in Central Tokyo

Wafer-to-wafer transfer process of barium strontium titanate for frequency tuning applications using laser pre-irradiation

Integration of BST varactors with surface acoustic wave device by film transfer technology for tunable RF filters

Wideband tunable Love wave filter using electrostatically actuated MEMS variable capacitors integrated on lithium niobate

SMALL ORGAN SIZE 1 and SMALL ORGAN SIZE 2/DWARF AND LOW-TILLERING Form aComplex to Integrate Auxin and Brassinosteroid Signaling in Rice

ScAlN Lamb wave resonator in GHz range released by XeF2 etching

Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps

Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test

A novel fabrication technique and new conjugated polymers for multilayer polymer light-emitting diodes

Suchergebnisse filtern