UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

High-performance interconnects: an integration overview

Proceedings of the IEEE, 2001-05, Vol.89 (5), p.586-601

2001

Volltextzugriff (PDF)

Air-gap formation during IMD deposition to lower interconnect capacitance

IEEE electron device letters, 1998-01, Vol.19 (1), p.16-18

1998

Volltextzugriff (PDF)

Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals

Journal of electronic materials, 2002, Vol.31 (1), p.10-15

2002

Volltextzugriff (PDF)

Integrated CVD–PVD Al plug processing for sub-half micron features

Thin solid films, 1998-05, Vol.320 (1), p.52-57

1998

Volltextzugriff (PDF)

A Novel Process for Fabricating Conformal and Stable TiN‐Based Barrier Films

Journal of the Electrochemical Society, 1996-12, Vol.143 (12), p.L279-L280

1996

Volltextzugriff (PDF)

Effect of Ar Sputter Etch on the Texture of Ti and Al/TiN/Ti Metal Stack

Journal of the Electrochemical Society, 1997-09, Vol.144 (9), p.L248-L250

1997

Volltextzugriff (PDF)

Thermal stability of Al/barrier/TiSix multilayer structures

Thin solid films, 1998-05, Vol.320 (1), p.20-25

1998

Volltextzugriff (PDF)

Overview Of Process Integration Issues For Low K Dielectrics

MRS proceedings, 1998, Vol.511, Article 3

1998

Volltextzugriff (PDF)

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.341-349

2001

Volltextzugriff (PDF)

Reliability and early failure in Cu/oxide dual-damascene interconnects

Journal of electronic materials, 2002-10, Vol.31 (10), p.1052-1058

2002

Volltextzugriff (PDF)

An 8-ns 256K ECL SRAM with CMOS memory array and battery backup capability

IEEE journal of solid-state circuits, 1988-10, Vol.23 (5), p.1041-1047

1988

Volltextzugriff (PDF)

Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization

Thin solid films, 1998-05, Vol.320 (1), p.73-76

1998

Volltextzugriff (PDF)

Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects

Applied physics letters, 2001-04, Vol.78 (18), p.2652-2654

2001

Volltextzugriff (PDF)

Ti-based Barrier for Cu Interconnect Applications

2008 International Interconnect Technology Conference, 2008, p.202-204

2008

Volltextzugriff (PDF)

Novel Diffusion Barrier with Ultra-Thin Silicon Nitride Cap Layer

MRS proceedings, 1998, Vol.514, Article 507

1998

Volltextzugriff (PDF)

Texture-induced asymmetric reactions in TiN/Al–Cu/TiN

Journal of applied physics, 1995-12, Vol.78 (12), p.7419-7421

1995

Volltextzugriff (PDF)

Novel high pressure low temperature aluminum plug technology for sub-0.5 mu m contact/via geometries

Technical digest - International Electron Devices Meeting, 1994, p.105-108

1994

Volltextzugriff (PDF)

Photolithographic fabrication of thin-film metal–oxide–metal diodes with submicrometer-square junction areas

Journal of vacuum science & technology, 1978-03, Vol.15 (2), p.389-391

Havemann, R. H.

1978

Volltextzugriff (PDF)

Thermal stability of Al/barrier/TiSi sub(x) multilayer structures

Thin solid films, 1998-05, Vol.320 (1), p.20-25

1998

Volltextzugriff (PDF)

Annealing impact on damascene Cu resistivity and microstructures

2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443), 2001, Vol.1, p.400-404 vol.1

2001

Volltextzugriff (PDF)

Nonlinear correction to Ohm's law derived from Boltzmann's equation

Applied physics letters, 1974-01, Vol.24 (8), p.362-364

1974

Volltextzugriff (PDF)

Conductivity and the Microwave Properties of 81-Permalloy Thin Films (Correspondence)

IEEE transactions on microwave theory and techniques, 1971-01, Vol.19 (1), p.113-116

1971

Volltextzugriff (PDF)

Implication And Solutions For Joule Heating In High Performance Interconnects Incorporating Low-k Dielectrics

1997 Symposium on VLSI Technology, 1997, p.83-84

1997

Volltextzugriff (PDF)

Photolithographic fabrication of lead alloy Josephson junctions

Journal of vacuum science & technology, 1978-03, Vol.15 (2), p.392-395

1978

Volltextzugriff (PDF)

New e -beam-defined memory structures

Journal of vacuum science & technology, 1979-11, Vol.16 (6), p.1662-1664

1979

Volltextzugriff (PDF)

1 – 25 von 194

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(150)
Mit Volltextzugriff
(105)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(83)
Humans
(79)
Life Sciences & Biomedicine
(53)
Female
(34)
Biological And Medical Sciences
(33)
Medical Sciences
(32)
Male
(29)
Oncology
(29)
Middle Aged
(26)
Technology
(25)
Adult
(22)
Aged
(20)
Engineering
(19)
Physical Sciences
(19)
Engineering, Electrical & Electronic
(18)
Physics
(18)
Antineoplastic Combined Chemotherapy Protocols - Therapeutic Use
(16)
Hematology
(13)
Pharmacology. Drug Treatments
(13)
Physics, Applied
(13)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(1)

Menü

Weitere Dienste

Einstellungen

High-performance interconnects: an integration overview

Air-gap formation during IMD deposition to lower interconnect capacitance

Analysis of copper grains in damascene trenches after rapid thermal processing or furnace anneals

Integrated CVD–PVD Al plug processing for sub-half micron features

A Novel Process for Fabricating Conformal and Stable TiN‐Based Barrier Films

Effect of Ar Sputter Etch on the Texture of Ti and Al/TiN/Ti Metal Stack

Thermal stability of Al/barrier/TiSix multilayer structures

Overview Of Process Integration Issues For Low K Dielectrics

Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects

Reliability and early failure in Cu/oxide dual-damascene interconnects

An 8-ns 256K ECL SRAM with CMOS memory array and battery backup capability

Integrated barrier/plug fill schemes for high aspect ratio Gb DRAM contact metallization

Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects

Ti-based Barrier for Cu Interconnect Applications

Novel Diffusion Barrier with Ultra-Thin Silicon Nitride Cap Layer

Texture-induced asymmetric reactions in TiN/Al–Cu/TiN

Novel high pressure low temperature aluminum plug technology for sub-0.5 mu m contact/via geometries

Photolithographic fabrication of thin-film metal–oxide–metal diodes with submicrometer-square junction areas

Thermal stability of Al/barrier/TiSi sub(x) multilayer structures

Annealing impact on damascene Cu resistivity and microstructures

Nonlinear correction to Ohm's law derived from Boltzmann's equation

Conductivity and the Microwave Properties of 81-Permalloy Thin Films (Correspondence)

Implication And Solutions For Joule Heating In High Performance Interconnects Incorporating Low-k Dielectrics

Photolithographic fabrication of lead alloy Josephson junctions

New e -beam-defined memory structures

Suchergebnisse filtern