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Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Micromachines (Basel), 2022-03, Vol.13 (4), p.544

2022

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Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Polymers, 2021-05, Vol.13 (11), p.1734

2021

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Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations

Journal of membrane science, 2013-02, Vol.428, p.523-532

2013

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Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals

Journal of materials science, 2016-02, Vol.51 (3), p.1217-1233

2016

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Multiscale perspectives of interface delamination in microelectronic packaging applications

Molecular simulation, 2011-07, Vol.37 (8), p.710-717

2011

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Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers

Journal of polymer science. Part B, Polymer physics, 2008-01, Vol.46 (1), p.59-71

2008

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Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)

Journal of polymer science. Part B, Polymer physics, 2006-07, Vol.44 (13), p.1874-1897

2006

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CO2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Macromolecules, 2006-12, Vol.39 (26), p.9590-9604

2006

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Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Mechatronics (Oxford), 2016-12, Vol.40, p.270-280

2016

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Mechanics of CNT-palladium Interfaces for Sensor Applications Simulated with Molecular Dynamics

Procedia materials science, 2014, Vol.3, p.454-460

2014

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In-situ infrared spectroscopy for chemical analysis in electronic packaging processes

2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.336-342

2022

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Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-6

2014

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Pull-Out Testing of SWCNTs Simulated by Molecular Dynamics

International Journal of Theoretical and Applied Nanotechnology, 2012

2012

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Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1332-1338

2023

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Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation

Desalination, 2006-11, Vol.200 (1), p.166-168

2006

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A Closer Look to Fan-out Panel Level Packaging

2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2023, p.1-3

2023

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Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers

Desalination, 2006-11, Vol.199 (1-3), p.443-444

2006

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CO 2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Macromolecules, 2006-12, Vol.39 (26), p.9590-9604

2006

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Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2009-2015

2021

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Knowledge-based Approach to Gas Sorption in Glassy Polymers by Combining Experimental and Molecular Simulation Techniques

MRS proceedings, 2008, Vol.1130 (1), Article 1130-W06-10

2008

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Gas sorption and swelling in glassy polymers combining experiment, phenomenological models and detailed atomistic molecular modeling

Hölck, Ole

2008

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Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polysulfone and poly(ether sulfone)

Journal of polymer science. Part B, Polymer physics, 2006-07, Vol.44 (13), p.1874-1897

2006

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Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polymers

Desalination, 2006, Vol.199 (1), p.443-444

2006

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An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-9

2016

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Why Should We Share Material Data? The Positive Impact of Public/Private Databases Access Through Digital Twins Along the Product Value Chain

2024 Electronics Goes Green 2024+ (EGG), 2024, p.1-4

2024

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Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis

Gas sorption isotherms in swelling glassy polymers—Detailed atomistic simulations

Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals

Multiscale perspectives of interface delamination in microelectronic packaging applications

Simulation of experimentally observed dilation phenomena during integral gas sorption in glassy polymers

Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polysulfone and poly(ether sulfone)

CO2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: molecular dynamics simulations and in situ experiments using electron microscopy

Mechanics of CNT-palladium Interfaces for Sensor Applications Simulated with Molecular Dynamics

In-situ infrared spectroscopy for chemical analysis in electronic packaging processes

Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments

Pull-Out Testing of SWCNTs Simulated by Molecular Dynamics

Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology

Gas-induced structural changes in polymeric membrane materials combining experiment, phenomenological models and simulation

A Closer Look to Fan-out Panel Level Packaging

Atomistic packing models for experimentally investigated swelling states induced by CO2 in glassy polymers

CO 2 Sorption Induced Dilation in Polysulfone: Comparative Analysis of Experimental and Molecular Modeling Results

Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

Knowledge-based Approach to Gas Sorption in Glassy Polymers by Combining Experimental and Molecular Simulation Techniques

Gas sorption and swelling in glassy polymers combining experiment, phenomenological models and detailed atomistic molecular modeling

Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polysulfone and poly(ether sulfone)

Atomistic packing models for experimentally investigated swelling states induced by CO 2 in glassy polymers

An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals

Why Should We Share Material Data? The Positive Impact of Public/Private Databases Access Through Digital Twins Along the Product Value Chain

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