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Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum

Journal of biophotonics, 2020-04, Vol.13 (4), p.e201960176-n/a

2020

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Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects

Molecules (Basel, Switzerland), 2023-03, Vol.28 (6), p.2783

2023

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Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

ACS omega, 2020-03, Vol.5 (10), p.4868-4874

2020

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Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects

Journal of Industrial and Engineering Chemistry, 2023, 126(0), , pp.371-381

2023

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Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17143-17153

2021

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Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Reviews on advanced materials science, 2024-01, Vol.63 (1), p.pp. 1-15

2024

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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

Journal of materials science. Materials in electronics, 2021-09, Vol.32 (17), p.22372-22386

2021

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Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum, 2019-12, Vol.170, p.108967, Article 108967

2019

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Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package

Results in physics, 2024-05, Vol.60, p.107628, Article 107628

2024

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Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film

Journal of materials science. Materials in electronics, 2020-06, Vol.31 (11), p.8165-8173

2020

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Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery

Journal of materials research and technology, 2024-05, Vol.30, p.3831-3839

2024

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GIS-based probabilistic mapping of landslide hazard using a three-dimensional deterministic model

Natural hazards (Dordrecht), 2004-10, Vol.33 (2), p.265-282

2004

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Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence

Materials today communications, 2020-09, Vol.24, p.100973, Article 100973

2020

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Mechanism of TangGanJian on nonalcoholic fatty liver disease with type 2 diabetes mellitus

Pharmaceutical biology, 2018-01, Vol.56 (1), p.567-572

2018

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Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin

Journal of materials science. Materials in electronics, 2012-01, Vol.23 (1), p.108-114

2012

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Effect of 3-mercapto-1-propane sulfonate sulfonic acid and polyvinylpyrrolidone on the growth of cobalt pillar by electrodeposition

Nanotechnology reviews (Berlin), 2022-03, Vol.11 (1), p.1209-1218

2022

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Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

Polymer international, 2014-03, Vol.63 (3), p.546-551

2014

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Effect of MnSO4 on the Deposition of Electroless Nickel Phosphorus and its Mechanism

Electrochimica acta, 2014-05, Vol.127, p.276-282

2014

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Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks

Journal of materials science. Materials in electronics, 2012-11, Vol.23 (11), p.1980-1986

2012

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Geographic Information Systems-Based Three-Dimensional Critical Slope Stability Analysis and Landslide Hazard Assessment

Journal of geotechnical and geoenvironmental engineering, 2003-12, Vol.129 (12), p.1109-1118

2003

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Surface grafting of epoxy polymer on CB to improve its dispersion to be the filler of resistive ink for PCB

Results in physics, 2017, Vol.7, p.1870-1877

2017

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GIS-BASED SPATIAL ANALYSIS OF URBAN HEAT ISLAND IN FUKUOKA METROPOLITAN AREA

Journal of Japan Society of Civil Engineers, Ser. B1 (Hydraulic Engineering), 2018, Vol.74(5), pp.I_1189-I_1194

2018

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Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF

Sensors and actuators. A. Physical., 2022-04, Vol.337, p.113415, Article 113415

2022

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Optoplasmonic Hybrid Materials for Trace Detection of Methamphetamine in Biological Fluids through SERS

ACS applied materials & interfaces, 2020-05, Vol.12 (21), p.24192-24200

2020

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Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

Electrochimica acta, 2018-05, Vol.273, p.318-326

2018

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Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum

Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects

Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled

Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Organic package substrate embedded coupled magnetic core inductors using lithographic via technology for power supply in package

Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film

Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery

GIS-based probabilistic mapping of landslide hazard using a three-dimensional deterministic model

Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence

Mechanism of TangGanJian on nonalcoholic fatty liver disease with type 2 diabetes mellitus

Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin

Effect of 3-mercapto-1-propane sulfonate sulfonic acid and polyvinylpyrrolidone on the growth of cobalt pillar by electrodeposition

Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

Effect of MnSO4 on the Deposition of Electroless Nickel Phosphorus and its Mechanism

Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks

Geographic Information Systems-Based Three-Dimensional Critical Slope Stability Analysis and Landslide Hazard Assessment

Surface grafting of epoxy polymer on CB to improve its dispersion to be the filler of resistive ink for PCB

GIS-BASED SPATIAL ANALYSIS OF URBAN HEAT ISLAND IN FUKUOKA METROPOLITAN AREA

Highly sensitive, flexible and wearable piezoelectric motion sensor based on PT promoted β-phase PVDF

Optoplasmonic Hybrid Materials for Trace Detection of Methamphetamine in Biological Fluids through SERS

Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

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