UB Paderborn / Katalog / Suche / in CDI

Robust Simulation of Opto-Electronic Systems by Alternating Complex Envelope Representations

IEEE transactions on computer-aided design of integrated circuits and systems, 2012-07, Vol.31 (7), p.1139-1143

2012

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Passive parameterized time-domain macromodels for high-speed transmission-line networks

IEEE transactions on microwave theory and techniques, 2003-12, Vol.51 (12), p.2347-2354

2003

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Efficient sensitivity analysis of transmission-line networks using model-reduction techniques

IEEE transactions on microwave theory and techniques, 2000-12, Vol.48 (12), p.2345-2351

2000

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Simulation of high-speed distributed interconnects using Krylov-space techniques

IEEE transactions on computer-aided design of integrated circuits and systems, 2000-07, Vol.19 (7), p.799-808

2000

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Closed-form parameterized simulation of high-speed transmission line networks using model-reduction techniques

2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), 2004, Vol.2, p.711-714 Vol.2

2004

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Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction

IEEE transactions on components and packaging technologies, 2005-03, Vol.28 (1), p.70-79

2005

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Efficient sensitivity analysis of transmission-line networks using model reduction techniques

2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017), 2000, Vol.2, p.895-898 vol.2

2000

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Hierarchical thermal analysis of large IC modules

IEEE transactions on components and packaging technologies, 2005-06, Vol.28 (2), p.207-217

2005

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Addressing practical issues with banded-variables in an MNA-based optoelectronic simulation framework

2010 IEEE 14th Workshop on Signal Propagation on Interconnects, 2010, p.83-86

2010

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Multidimensional time-domain macromodels for microwave applications

IEEE MTT-S International Microwave Symposium Digest, 2003, 2003, Vol.1, p.13-16 vol.1

2003

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Nonlinear circuit-reduction of high-speed interconnect networks using congruent transformation techniques

IEEE transactions on advanced packaging, 2001-08, Vol.24 (3), p.317-325

2001

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The creation of compact thermal models of electronic components using model reduction

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545), 2004, p.104-110

2004

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Passive interconnect reduction algorithm for distributed/measured networks

IEEE transactions on circuits and systems. 2, Analog and digital signal processing, 2000-04, Vol.47 (4), p.287-301

2000

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Analysis of transmission line circuits using multidimensional model reduction techniques

IEEE transactions on advanced packaging, 2002-05, Vol.25 (2), p.174-180

2002

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Multi-dimensional model reduction of VLSI interconnects

Proceedings of the IEEE 2000 Custom Integrated Circuits Conference (Cat. No.00CH37044), 2000, p.499-502

2000

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The creation of compact thermal models of electronic components using model reduction

IEEE transactions on advanced packaging, 2005-05, Vol.28 (2), p.240-251

2005

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Efficient and accurate model order reduction of interconnect networks in the presence of incident fields

Electrical Performance of Electronic Packaging - 2004, 2004, p.71-74

2004

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Efficient generation of multiparameter closedform expressions for highspeed transmission line networks

IEEE MTT-S International Microwave Symposium Digest, 2005, 2005, p.1775-1778

2005

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Time domain reduced order macromodel for interconnects excited by incident fields

Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005, 2005, p.197-200

2005

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Analysis of transmission line circuits using multi-dimensional model reduction techniques

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565), 2001, p.43-46

2001

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Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation

IEEE transactions on advanced packaging, 2010-11, Vol.33 (4), p.979-993

2010

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Global multi-level reduction technique for nonlinear simulation of high-speed interconnect circuits

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565), 2001, p.259-262

2001

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The creation of thermal sub-models of electronic components using model reduction

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004, Vol.1, p.512-519 Vol.1

2004

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Modelling semiconductor junctions including nonlinear capacitive effects using neural networks

2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI), 2011, p.137-138

2011

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Defining a multi-channel infrastructure to enable MNA formulation of opto-electronic circuits

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, 2009, p.137-140

2009

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Robust Simulation of Opto-Electronic Systems by Alternating Complex Envelope Representations

Passive parameterized time-domain macromodels for high-speed transmission-line networks

Efficient sensitivity analysis of transmission-line networks using model-reduction techniques

Simulation of high-speed distributed interconnects using Krylov-space techniques

Closed-form parameterized simulation of high-speed transmission line networks using model-reduction techniques

Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction

Efficient sensitivity analysis of transmission-line networks using model reduction techniques

Hierarchical thermal analysis of large IC modules

Addressing practical issues with banded-variables in an MNA-based optoelectronic simulation framework

Multidimensional time-domain macromodels for microwave applications

Nonlinear circuit-reduction of high-speed interconnect networks using congruent transformation techniques

The creation of compact thermal models of electronic components using model reduction

Passive interconnect reduction algorithm for distributed/measured networks

Analysis of transmission line circuits using multidimensional model reduction techniques

Multi-dimensional model reduction of VLSI interconnects

The creation of compact thermal models of electronic components using model reduction

Efficient and accurate model order reduction of interconnect networks in the presence of incident fields

Efficient generation of multiparameter closedform expressions for highspeed transmission line networks

Time domain reduced order macromodel for interconnects excited by incident fields

Analysis of transmission line circuits using multi-dimensional model reduction techniques

Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation

Global multi-level reduction technique for nonlinear simulation of high-speed interconnect circuits

The creation of thermal sub-models of electronic components using model reduction

Modelling semiconductor junctions including nonlinear capacitive effects using neural networks

Defining a multi-channel infrastructure to enable MNA formulation of opto-electronic circuits

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