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Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Tribology international, 2015-07, Vol.87, p.145-150

2015

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Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

Surface & coatings technology, 2014-07, Vol.251, p.48-55

2014

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XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Applied surface science, 2014-10, Vol.316, p.643-648

2014

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Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Journal of materials science. Materials in electronics, 2013-12, Vol.24 (12), p.5040-5047

2013

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Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire

Applied surface science, 2015-07, Vol.343, p.115-120

2015

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Synthesis of dual-doped non-precious metal electrocatalysts and their electrocatalytic activity for oxygen reduction reaction

Journal of energy chemistry, 2014-07, Vol.23 (4), p.498-506

2014

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Achieving ultralow surface roughness and high material removal rate in fused silica via a novel acid SiO2 slurry and its chemical-mechanical polishing mechanism

Applied surface science, 2020-01, Vol.500, p.144041, Article 144041

2020

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Fe-N x /C assisted chemical-mechanical polishing for improving the removal rate of sapphire

Applied surface science, 2015-07, Vol.343, p.115-120

2015

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Chemical mechanical polishing of silicon carbide (SiC) based on coupling effect of ultrasonic vibration and catalysis

Journal of environmental chemical engineering, 2023-10, Vol.11 (5), p.111080, Article 111080

2023

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Study on Pitch Performance Deterioration in Chemical Mechanical Polishing of Fused Silica

ECS journal of solid state science and technology, 2021-08, Vol.10 (8), p.84005

2021

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Photocatalysis-Assisted Chemical Mechanical Polishing of SiC Wafer using a Novel SiO 2 @TiO 2 Core-Shell Composite Nanoparticles Slurry

ECS journal of solid state science and technology, 2023-10, Vol.12 (10), p.104001

2023

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Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing

SILICON, 2023-11, Vol.15 (16), p.6997-7004

2023

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Chemical Mechanical Polishing (CMP) of Fused Silica (FS) Using Ceria Slurry Recycling

ECS journal of solid state science and technology, 2020-04, Vol.9 (4), p.44002

2020

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Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Surface and interface analysis, 2019-05, Vol.51 (5), p.576-583

2019

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A non-noble material cathode catalyst dual-doped with sulfur and nitrogen as efficient electrocatalysts for oxygen reduction reaction

Electrochimica acta, 2015-09, Vol.177, p.57-64

2015

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Influence of colloidal silica dispersion on the decrease of roughness in silicon chemical mechanical polishing

Micro & nano letters, 2016-07, Vol.11 (7), p.382-385

2016

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Study on Pad Performance Deterioration in Chemical Mechanical Polishing (CMP) of Fused Silica

ECS journal of solid state science and technology, 2018, Vol.7 (6), p.P295-P298

2018

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Characteristics of Slurry Recycling in Chemical Mechanical Polishing (CMP) of Fused Silica (FS)

ECS journal of solid state science and technology, 2019, Vol.8 (3), p.P196-P201

2019

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Effects of mixed inhibitors in copper chemical mechanical polishing at a low down pressure

Proceedings of the Institution of Mechanical Engineers. Part J, Journal of engineering tribology, 2014-10, Vol.228 (10), p.1180-1186

2014

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Investigation of the Chemical Residuals on the Fused Silica during Chemical Mechanical Polishing

ChemistrySelect (Weinheim), 2018-08, Vol.3 (31), p.8930-8935

2018

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Control of Active Suspensions with Pump-Controlled Electro-Hydraulic Actuators under Uncertainties and Constraints using Adaptive Dynamic Programming

2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM), 2020, p.2054-2061

2020

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Optimal Preview Control with Uncertain Preview Information with Application to Active Suspension Systems

2021 IEEE Conference on Control Technology and Applications (CCTA), 2021, p.277-282

2021

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2-D maximum entropy spermatozoa image segmentation based on Canny operator

2010 International Conference on Intelligent Computing and Integrated Systems, 2010, p.243-246

2010

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Modeling and Adaptive Robust Force Control of a Pump-Controlled Electro-Hydraulic Actuator for an Active Suspension System

2019 IEEE Conference on Control Technology and Applications (CCTA), 2019, p.592-597

2019

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Tensor voting based method for image denoising

2010 International Conference on Intelligent Computing and Integrated Systems, 2010, p.209-212

2010

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Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire

Synthesis of dual-doped non-precious metal electrocatalysts and their electrocatalytic activity for oxygen reduction reaction

Achieving ultralow surface roughness and high material removal rate in fused silica via a novel acid SiO2 slurry and its chemical-mechanical polishing mechanism

Fe-N x /C assisted chemical-mechanical polishing for improving the removal rate of sapphire

Chemical mechanical polishing of silicon carbide (SiC) based on coupling effect of ultrasonic vibration and catalysis

Study on Pitch Performance Deterioration in Chemical Mechanical Polishing of Fused Silica

Photocatalysis-Assisted Chemical Mechanical Polishing of SiC Wafer using a Novel SiO 2 @TiO 2 Core-Shell Composite Nanoparticles Slurry

Particles Manipulation to Improve Removal Efficiency of Fused Silica in Chemical Mechanical Polishing

Chemical Mechanical Polishing (CMP) of Fused Silica (FS) Using Ceria Slurry Recycling

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

A non-noble material cathode catalyst dual-doped with sulfur and nitrogen as efficient electrocatalysts for oxygen reduction reaction

Influence of colloidal silica dispersion on the decrease of roughness in silicon chemical mechanical polishing

Study on Pad Performance Deterioration in Chemical Mechanical Polishing (CMP) of Fused Silica

Characteristics of Slurry Recycling in Chemical Mechanical Polishing (CMP) of Fused Silica (FS)

Effects of mixed inhibitors in copper chemical mechanical polishing at a low down pressure

Investigation of the Chemical Residuals on the Fused Silica during Chemical Mechanical Polishing

Control of Active Suspensions with Pump-Controlled Electro-Hydraulic Actuators under Uncertainties and Constraints using Adaptive Dynamic Programming

Optimal Preview Control with Uncertain Preview Information with Application to Active Suspension Systems

2-D maximum entropy spermatozoa image segmentation based on Canny operator

Modeling and Adaptive Robust Force Control of a Pump-Controlled Electro-Hydraulic Actuator for an Active Suspension System

Tensor voting based method for image denoising

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