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A High-Voltage-Isolated MEMS Quad-Solenoid Transformer with Specific Insulation Barriers for Miniaturized Galvanically Isolated Power Applications

Micromachines (Basel), 2024-01, Vol.15 (2), p.228

2024

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Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvester

Micromachines (Basel), 2021-01, Vol.12 (1), p.74

2021

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A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost

Micromachines (Basel), 2022-07, Vol.13 (7), p.1071

2022

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MEMS-Casting Fabricated Chip-Style 3D Metal Solenoidal Transformers towards Integrated Power Supply

Micromachines (Basel), 2022-02, Vol.13 (2), p.325

2022

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Design and Wafer-Level Fabrication of Stacked-Type Transformers for High-Density Power Converters

IEEE transactions on power electronics, 2024-04, Vol.39 (4), p.4503-4512

2024

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High-Performance 3-D Silicon-Embedded Coupled Solenoid Inductors With Inserted Magnetic Core

IEEE transactions on electron devices, 2024-05, Vol.71 (5), p.3169-3174

2024

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Solder Pump Technology for Through-Silicon via Fabrication

Journal of microelectromechanical systems, 2011-06, Vol.20 (3), p.561-563

2011

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Through-Glass-Via Based Microstrip Band-Pass Filters Fabricated With Wafer-Level Low-Melting-Point Alloy Micro-Casting

IEEE electron device letters, 2020-07, Vol.41 (7), p.1106-1109

2020

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Wafer-Level Fabricated Tight-Coupling Dual-Solenoid Transformer Chips With Watt-Scale Power Transfer

IEEE transactions on power electronics, 2023-04, Vol.38 (4), p.5118-5127

2023

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Silicon-chip based electromagnetic vibration energy harvesters fabricated using wafer-level micro-casting technique

Journal of micromechanics and microengineering, 2021-03, Vol.31 (3), p.35009

2021

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On-Wafer Microrectangular Coaxial Delay Line by Using MEMS-Casting Process

IEEE microwave and wireless components letters, 2021-05, Vol.31 (5), p.437-440

2021

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A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection

Journal of micromechanics and microengineering, 2009-07, Vol.19 (7), p.074005-074005 (7), Article 074005

2009

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Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Microwave and optical technology letters, 2020-12, Vol.62 (12), p.3695-3701

2020

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Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture

Journal of micromechanics and microengineering, 2016-07, Vol.26 (7), p.75009

2016

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A micro-casting method for solenoid coil fabrication

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017, p.1108-1111

2017

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A metal micro-casting method for through-silicon Via(TSV) fabrication

2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM), 2017, p.211-212

2017

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A fast and low-cost TSV/TGV filling method

2017 China Semiconductor Technology International Conference (CSTIC), 2017, p.1-3

2017

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A fast and CMP-free TSV process based on wafer-level liquid-metal injection for MEMS packaging

2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016, p.569-572

2016

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An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer

Microelectronics, 2020-07, Vol.101, p.104798, Article 104798

2020

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Capillary effect based TSV filling method

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS), 2014, p.1115-1118

2014

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High-Voltage-Isolated Mems Quad-Solenoid Transformers with S-Shape SIO2 Isolation Barriers for Compact Galvanically-Isolated Gate Driver Applications

2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), 2024, p.777-780

2024

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High-Inductance-Density MEMS 3D-solenoid Transformers with Inserted Thin-Film Ferrite Magnetic Core For On-Chip Integrated DC-DC Power Conversions

2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), 2023, p.49-52

2023

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A solder-pump through wafer interconnection technology for advanced packaging

Gu, Jiebin

2010

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Wafer-Level Fabricated Double-Helix Rf-Mems Transformers with Coupling-Factor of 0.93@100Mhz For High-Efficiency Isolated Power/Signal Transmission

2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), 2022, p.200-203

2022

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Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvesters

2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2021, p.1-3

2021

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A High-Voltage-Isolated MEMS Quad-Solenoid Transformer with Specific Insulation Barriers for Miniaturized Galvanically Isolated Power Applications

Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvester

A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost

MEMS-Casting Fabricated Chip-Style 3D Metal Solenoidal Transformers towards Integrated Power Supply

Design and Wafer-Level Fabrication of Stacked-Type Transformers for High-Density Power Converters

High-Performance 3-D Silicon-Embedded Coupled Solenoid Inductors With Inserted Magnetic Core

Solder Pump Technology for Through-Silicon via Fabrication

Through-Glass-Via Based Microstrip Band-Pass Filters Fabricated With Wafer-Level Low-Melting-Point Alloy Micro-Casting

Wafer-Level Fabricated Tight-Coupling Dual-Solenoid Transformer Chips With Watt-Scale Power Transfer

Silicon-chip based electromagnetic vibration energy harvesters fabricated using wafer-level micro-casting technique

On-Wafer Microrectangular Coaxial Delay Line by Using MEMS-Casting Process

A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection

Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss

Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture

A micro-casting method for solenoid coil fabrication

A metal micro-casting method for through-silicon Via(TSV) fabrication

A fast and low-cost TSV/TGV filling method

A fast and CMP-free TSV process based on wafer-level liquid-metal injection for MEMS packaging

An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer

Capillary effect based TSV filling method

High-Voltage-Isolated Mems Quad-Solenoid Transformers with S-Shape SIO2 Isolation Barriers for Compact Galvanically-Isolated Gate Driver Applications

High-Inductance-Density MEMS 3D-solenoid Transformers with Inserted Thin-Film Ferrite Magnetic Core For On-Chip Integrated DC-DC Power Conversions

A solder-pump through wafer interconnection technology for advanced packaging

Wafer-Level Fabricated Double-Helix Rf-Mems Transformers with Coupling-Factor of 0.93@100Mhz For High-Efficiency Isolated Power/Signal Transmission

Double-Deck Metal Solenoids 3D Integrated in Silicon Wafer for Kinetic Energy Harvesters

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