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PECVD low and ultralow dielectric constant materials: From invention and research to products

Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, 2016-03, Vol.34 (2)

Grill, Alfred

2016

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Porous pSiCOH Ultralow- k Dielectrics for Chip Interconnects Prepared by PECVD

Annual review of materials research, 2009-08, Vol.39 (1), p.49-69

Grill, Alfred

2009

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Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low- k to extreme low- k interconnect materials

Journal of applied physics, 2003-02, Vol.93 (3), p.1785-1790

Grill, Alfred

2003

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Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization

Journal of applied physics, 2003-11, Vol.94 (10), p.6697-6707

2003

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Wafer-Scale Graphene Integrated Circuit

Science (American Association for the Advancement of Science), 2011-06, Vol.332 (6035), p.1294-1297

2011

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Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

Applied physics reviews, 2014-03, Vol.1 (1)

2014

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Epitaxial Graphene Nanoribbon Array Fabrication Using BCP-Assisted Nanolithography

ACS nano, 2012-08, Vol.6 (8), p.6786-6792

2012

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Effect of SiC wafer miscut angle on the morphology and Hall mobility of epitaxially grown graphene

Applied physics letters, 2011-05, Vol.98 (22)

2011

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Wafer-scale epitaxial graphene growth on the Si-face of hexagonal SiC (0001) for high frequency transistors

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2010-09, Vol.28 (5), p.985-992

2010

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Multicarrier transport in epitaxial multilayer graphene

Applied physics letters, 2010-09, Vol.97 (11), p.112107-112107-3

2010

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Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

Journal of applied physics, 2008-11, Vol.104 (9)

2008

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How to restore superlow friction of DLC: the healing effect of hydrogen gas

Tribology international, 2004-11, Vol.37 (11), p.869-877

2004

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Diamond-like carbon: state of the art

Diamond and related materials, 1999-03, Vol.8 (2), p.428-434

Grill, Alfred

1999

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Multilayer epitaxial graphene formed by pyrolysis of polycrystalline silicon-carbide grown on c-plane sapphire substrates

Applied physics letters, 2011-03, Vol.98 (13)

2011

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Structural characterization of porous low- k thin films prepared by different techniques using x-ray porosimetry

Journal of applied physics, 2004-03, Vol.95 (5), p.2355-2359

2004

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Nanoindentation Analysis of Mechanical Properties of Low to Ultralow Dielectric Constant SiCOH Films

Journal of materials research, 2005-08, Vol.20 (8), p.2080-2093

2005

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SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH: Reactive ion etching and dielectric recovery

Applied physics letters, 2017-05, Vol.110 (18)

2017

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Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2017-03, Vol.35 (2)

2017

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SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH

Journal of applied physics, 2016-02, Vol.119 (8)

2016

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Extreme-low k porous pSiCOH dielectrics prepared by PECVD

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-01, Vol.36 (1)

2018

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Optimal Filler Sizes for Thermal Interface Materials

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.52-57

2019

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Picosecond optical studies of amorphous diamond and diamondlike carbon: Thermal conductivity and longitudinal sound velocity

Journal of applied physics, 1994-09, Vol.76 (5), p.2636-2640

1994

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Silane Decomposition on Cu Interconnects Inhibited by Ammonia

Journal of the Electrochemical Society, 2010, Vol.157 (1), p.H78

2010

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Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects

Journal of applied physics, 2014-04, Vol.115 (14)

2014

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Effect of SiC wafer miscut angle on the morphology and Hall mobilityof epitaxially grown graphene

Applied physics letters, 2011-06, Vol.98 (22), p.222105-222105-3

2011

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PECVD low and ultralow dielectric constant materials: From invention and research to products

Porous pSiCOH Ultralow- k Dielectrics for Chip Interconnects Prepared by PECVD

Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low- k to extreme low- k interconnect materials

Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization

Wafer-Scale Graphene Integrated Circuit

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

Epitaxial Graphene Nanoribbon Array Fabrication Using BCP-Assisted Nanolithography

Effect of SiC wafer miscut angle on the morphology and Hall mobility of epitaxially grown graphene

Wafer-scale epitaxial graphene growth on the Si-face of hexagonal SiC (0001) for high frequency transistors

Multicarrier transport in epitaxial multilayer graphene

Property modifications of nanoporous pSiCOH dielectrics to enhance resistance to plasma-induced damage

How to restore superlow friction of DLC: the healing effect of hydrogen gas

Diamond-like carbon: state of the art

Multilayer epitaxial graphene formed by pyrolysis of polycrystalline silicon-carbide grown on c-plane sapphire substrates

Structural characterization of porous low- k thin films prepared by different techniques using x-ray porosimetry

Nanoindentation Analysis of Mechanical Properties of Low to Ultralow Dielectric Constant SiCOH Films

SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH: Reactive ion etching and dielectric recovery

Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects

SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH

Extreme-low k porous pSiCOH dielectrics prepared by PECVD

Optimal Filler Sizes for Thermal Interface Materials

Picosecond optical studies of amorphous diamond and diamondlike carbon: Thermal conductivity and longitudinal sound velocity

Silane Decomposition on Cu Interconnects Inhibited by Ammonia

Effect of low-frequency radio frequency on plasma-enhanced chemical vapor deposited ultra low-κ dielectric films for very large-scale integrated interconnects

Effect of SiC wafer miscut angle on the morphology and Hall mobilityof epitaxially grown graphene

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