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Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

Nature communications, 2017-12, Vol.8 (1), p.1916-10, Article 1916

2017

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The role of microstructure in the thermal fatigue of solder joints

Nature communications, 2024-05, Vol.15 (1), p.4258-4258, Article 4258

2024

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On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls

Journal of electronic materials, 2021-03, Vol.50 (3), p.808-817

2021

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Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4

Acta materialia, 2014-06, Vol.71, p.56-68

2014

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Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints

Journal of electronic materials, 2021-03, Vol.50 (3), p.786-795

2021

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Dilatant shear bands in solidifying metals

Nature, 2007-01, Vol.445 (7123), p.70-73

2007

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Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2023-03, Vol.54 (3), p.909-927

2023

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Al8Mn5 Particle Settling and Interactions with Oxide Films in Liquid AZ91 Magnesium Alloys

JOM (1989), 2019-07, Vol.71 (7), p.2235-2244

2019

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Nucleation and Growth of Tin in Pb-Free Solder Joints

JOM (1989), 2015-10, Vol.67 (10), p.2383-2393

2015

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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

JOM (1989), 2009-06, Vol.61 (6), p.45-51

2009

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In situ imaging of microstructure formation in electronic interconnections

Scientific reports, 2017-01, Vol.7 (1), p.40010-40010, Article 40010

2017

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Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Journal of electronic materials, 2021-03, Vol.50 (3), p.825-841

2021

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Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

Journal of materials science. Materials in electronics, 2019-01, Vol.30 (1), p.378-390

2019

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Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2009-07, Vol.40 (7), p.1645-1659

2009

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The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints

Journal of electronic materials, 2018-01, Vol.47 (1), p.84-95

2018

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Eutectic Morphology of Al-7Si-0.3Mg Alloys with Scandium Additions

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2014-09, Vol.45 (10), p.4549-4560

2014

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Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2024-11, Vol.55 (11), p.4342-4353

2024

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Defect band characteristics in Mg-Al and Al-Si high-pressure die castings

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2007-08, Vol.38 (8), p.1833-1844

2007

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Shear mechanisms at 0–50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy

Acta materialia, 2008-08, Vol.56 (14), p.3403-3413

2008

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Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion

Materials letters, 2018-08, Vol.224, p.22-25

2018

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Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

Journal of electronic materials, 2010-01, Vol.39 (1), p.56-69

2010

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Nucleation of tin on the Cu6Sn5 layer in electronic interconnections

Acta materialia, 2017-01, Vol.123, p.404-415

2017

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Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography

Nature communications, 2014-07, Vol.5 (1), p.4464-4464, Article 4464

2014

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Feeding Mechanisms in High-Pressure Die Castings

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-07, Vol.41 (7), p.1836-1846

2010

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Growth twinning and morphology of Al45Cr7 and Al13Fe4

Journal of alloys and compounds, 2022-02, Vol.893, p.162318, Article 162318

2022

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Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

The role of microstructure in the thermal fatigue of solder joints

On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls

Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4

Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints

Dilatant shear bands in solidifying metals

Ag3Sn Morphology Transitions During Eutectic Growth in Sn–Ag Alloys

Al8Mn5 Particle Settling and Interactions with Oxide Films in Liquid AZ91 Magnesium Alloys

Nucleation and Growth of Tin in Pb-Free Solder Joints

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

In situ imaging of microstructure formation in electronic interconnections

Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony

Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints

Microstructure Formation in AlSi4MgMn and AlMg5Si2Mn High-Pressure Die Castings

The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints

Eutectic Morphology of Al-7Si-0.3Mg Alloys with Scandium Additions

Dendrite Growth in Single-Grain and Cyclic-Twinned Sn–3Ag–0.5Cu Solder Joints

Defect band characteristics in Mg-Al and Al-Si high-pressure die castings

Shear mechanisms at 0–50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy

Printability and microstructure of the CoCrFeMnNi high-entropy alloy fabricated by laser powder bed fusion

Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

Nucleation of tin on the Cu6Sn5 layer in electronic interconnections

Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography

Feeding Mechanisms in High-Pressure Die Castings

Growth twinning and morphology of Al45Cr7 and Al13Fe4

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