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IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-05, Vol.9 (5), p.854-863
2019

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-12, Vol.5 (12), p.1740-1746
2015

International journal of heat and mass transfer, 2010-06, Vol.53 (13), p.2722-2731
2010
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.50-57
2017

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-05, Vol.6 (5), p.729-739
2016

Electrophoresis, 2008-03, Vol.29 (5), p.1006-1012
2008
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-05, Vol.10 (5), p.786-794
2020

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.255-262
2020

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.930-934
2022
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-4
2017

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.152-158
2019
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.70-76
2019
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1493-1497
2024


2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.235-239
2023
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1956-1961
2018

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-6
2017

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.976-981
2019
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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.823-828
2016
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2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.508-512
2021
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-6
2017