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IOP conference series. Materials Science and Engineering, 2022-08, Vol.1246 (1), p.12017
2022
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IOP conference series. Materials Science and Engineering, 2020-08, Vol.903 (1), p.12039
2020
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IOP conference series. Materials Science and Engineering, 2014-08, Vol.63 (1), p.12136
2014
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IEEE journal of solid-state circuits, 2009-09, Vol.44 (9), p.2322-2338
2009
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Pediatric neurology, 2019-08, Vol.97, p.78-79
2019
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IOP conference series. Materials Science and Engineering, 2022-08, Vol.1246 (1), p.12010
2022
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Microelectronics and reliability, 2007-02, Vol.47 (2), p.248-251
2007
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Microelectronics and reliability, 2004-12, Vol.44 (12), p.2011-2017
2004
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Journal of electronic materials, 2011-11, Vol.40 (11), p.2187-2196
2011
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MRS proceedings, 2006, Vol.912, Article 0912-C05-02
2006
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2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.913-917 Vol.1
2004
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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003, 2003, p.288-294
2003
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2008 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 2008, p.33-40
2008
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Materials science forum, 2001-10, Vol.414-415, p.79-84
2001
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The American journal of psychiatry, 1957-12, Vol.114 (6), p.561-562
1957
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2012 4th IEEE International Symposium on Logistics and Industrial Informatics, 2012, p.261-264
2012
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Diseases of the nervous system, 1957-03, Vol.18 (3), p.87
1957
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Journal of neuropathology and experimental neurology, 1942-07, Vol.1 (3), p.344-347
1942
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Transactions of the American Neurological Association, 1954, Vol.13 (79th Meeting), p.192
1954
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2009 10th International Conference on Ultimate Integration of Silicon, 2009, p.181-184
2009
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2008 26th International Conference on Microelectronics, 2008, p.291-294
2008
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Neurology, 1958-03, Vol.8 (3), p.205
1958
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2007 15th International Conference on Advanced Thermal Processing of Semiconductors, 2007, p.257-261
2007
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Extended Abstracts - 2008 8th International Workshop on Junction Technology (IWJT '08), 2008, p.101-106
2008
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2005 13th International Conference on Advanced Thermal Processing of Semiconductors, 2005, p.7 pp.
2005
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