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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-6

2024

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Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.757-763

2023

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Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.5C.1.1-5C.1.10

2013

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CPI challenges to BEOL at 28nm node and beyond

2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.2E.1.1-2E.1.6

2012

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Nano-beam electron diffraction evaluation of strain behaviour in nano-scale patterned strained silicon-on-insulator

Physica status solidi. C, 2011-04, Vol.8 (4), p.1319-1324

2011

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Micromechanical robustness tests of 28nm BEOL layer stacks

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2015, p.488-491

2015

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IEEE_Xplore

Novel Carbon-Cage-Based Ultralow- k Materials: Modeling and First Experiments

IEEE transactions on semiconductor manufacturing, 2008-11, Vol.21 (4), p.646-660

2008

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Novel Carbon-Cage-Based Ultralow-κ Materials : Modeling and First Experiments

IEEE transactions on semiconductor manufacturing, 2008, Vol.21 (4), p.646-660

2008

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Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass

MRS proceedings, 2006, Vol.914, Article 0914-F11-03

2006

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Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

International Symposium on Microelectronics, 2018-10, Vol.2018 (1), p.173-179

2018

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A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.163-171

2017

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Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.430-436

2012

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Potential of total reflection and grazing incidence XRF for contamination and process control in semiconductor fabrication

Mikrochimica acta (1966), 2000-01, Vol.133 (1-4), p.65-68

2000

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Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures

2012 IEEE International Interconnect Technology Conference, 2012, p.1-3

2012

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Depth dependence of ultraviolet curing of organosilicate low- k thin films

Nanotwin formation and its physical properties and effect on reliability of copper interconnects

Improving Accuracy and Precision of Strain Analysis by Energy-Filtered Nanobeam Electron Diffraction

The Challenge of Measuring Strain in FDSOI Device Structures – HRXRD as a Potential Method of Resolution

Nanoindentation for reliability assessment of ULK films and interconnects structures

Tuning depth profiles of organosilicate films with ultraviolet curing

Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

Quantitative mapping of elastic properties of plasma-treated silica-based low-k films

Profiling of the Mechanical Properties of Ultralow-k Films Using Nanoindentation Techniques

Understanding the Fundamentals for Package Induced Failure in BEOL Interconnect at 20nm Node

Chip-Package Interaction: A Case Study Applied To A Mature Technology Node

Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modeling

Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element Modeling

Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading

CPI challenges to BEOL at 28nm node and beyond

Nano-beam electron diffraction evaluation of strain behaviour in nano-scale patterned strained silicon-on-insulator

Micromechanical robustness tests of 28nm BEOL layer stacks

Novel Carbon-Cage-Based Ultralow- k Materials: Modeling and First Experiments

Novel Carbon-Cage-Based Ultralow-κ Materials : Modeling and First Experiments

Chemical Bonding, Permittivity and Elastic Properties in Locally Modified Organosilicate Glass

Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process Improvements

A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line

Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

Potential of total reflection and grazing incidence XRF for contamination and process control in semiconductor fabrication

Microprobing the mechanical effects of varying dielectric porosity in advanced interconnect structures

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