UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

Journal of materials science. Materials in electronics, 2021-12, Vol.32 (23), p.27133-27147

2021

Volltextzugriff (PDF)

Influence of High Temperature on the Crystal Structure of SrFe12O19 Nanoparticle

Journal of nanomaterials, 2022-11, Vol.2022

2022

Volltextzugriff (PDF)

Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging

PloS one, 2013-11, Vol.8 (11), p.e78705-e78705

2013

Volltextzugriff (PDF)

Controlled Voltage of Hot Snare Polypectomy Device in Electrosurgical Device

Journal of engineering (Cairo, Egypt), 2023-12, Vol.2023, p.1-14

2023

Volltextzugriff (PDF)

Design Sustainability for Battery Packaging to Increase Customer Satisfaction

Journal of engineering (Cairo, Egypt), 2023, Vol.2023, p.1-12

2023

Volltextzugriff (PDF)

The Discriminants of Long and Short Duration Failures in Fulfillment Sortation Equipment: A Machine Learning Approach

Journal of engineering (Cairo, Egypt), 2023, Vol.2023, p.1-10

2023

Volltextzugriff (PDF)

Simulation of Separation of Salt Solution from Crude Oil in a Hydrocyclone

Journal of engineering (Cairo, Egypt), 2022, Vol.2022, p.1-13

2022

Volltextzugriff (PDF)

Magneto-Rotational Augmentation of Bioconvective Transport in Plasma-Nanofluid Flowing through a Penetrable Spinning Disc

Journal of engineering (Cairo, Egypt), 2022, Vol.2022, p.1-24

2022

Volltextzugriff (PDF)

Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes

Journal of engineering (Cairo, Egypt), 2022, Vol.2022, p.1-8

2022

Volltextzugriff (PDF)

Interconnect Reliability in Advanced Memory Device Packaging

1, 2023

Volltextzugriff (PDF)

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Microelectronics international, 2014-01, Vol.31 (2), p.121-128

2014

Volltextzugriff (PDF)

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

Microelectronics international, 2013-01, Vol.30 (3), p.169-175

2013

Volltextzugriff (PDF)

Guest editorial: Heterogeneous integration and chiplets interconnection

Microelectronics international, 2023-03, Vol.40 (2), p.69-69

2023

Volltextzugriff (PDF)

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

PloS one, 2014-01, Vol.9 (1)

2014

Volltextzugriff (PDF)

Study of robust package strength characterization of memory packages for handheld application

Memories - Materials, Devices, Circuits and Systems, 2022-12, Vol.3, p.100018, Article 100018

2022

Volltextzugriff (PDF)

Technological sustainable materials and enabling in semiconductor memory industry: A review

e-Prime, 2023-09, Vol.5, p.100245, Article 100245

2023

Volltextzugriff (PDF)

Influence of High Temperature on the Crystal Structure of SrFe 12 O 19 Nanoparticle

Journal of nanomaterials, 2022-01, Vol.2022 (1)

2022

Volltextzugriff (PDF)

Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2023, p.1-5

2023

Volltextzugriff (PDF)

Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement

2023 International Conference on Electronics Packaging (ICEP), 2023, p.211-212

2023

Volltextzugriff (PDF)

Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016, p.1-4

2016

Volltextzugriff (PDF)

Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016, p.1-4

2016

Volltextzugriff (PDF)

Interconnect Reliability in Advanced Memory Device Packaging: ISBN: 978-3-031-26707-9 (Print), 978-3-031-26708-6 (Online)

Journal of adhesion science and technology, 2024-06, p.1-3

2024

Volltextzugriff (PDF)

Single Factor Study of Solder Joint Reliability for MCP Packages

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2023, p.1-5

2023

Volltextzugriff (PDF)

Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging

2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2023, p.1-4

2023

Volltextzugriff (PDF)

Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement

2021 International Conference on Electronics Packaging (ICEP), 2021, p.131-132

2021

Volltextzugriff (PDF)

1 – 25 von 69

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(39)
Mit Volltextzugriff
(60)

Publikationsform

Sprache

Englisch
(69)

Erscheinungsjahr

n.n

Thema

Engineering
(24)
Science & Technology
(24)
Technology
(20)
Packaging
(15)
Engineering, Electrical & Electronic
(12)
Materials Science
(12)
Materials Science, Multidisciplinary
(11)
Reliability
(10)
Copper
(8)
Gold
(8)
Physical Sciences
(7)
Bonding
(6)
Chemistry And Materials Science
(6)
Electronic Packaging
(6)
Engineering, Multidisciplinary
(6)
Integrated Circuits
(6)
Wire
(6)
Characterization And Evaluation Of Materials
(5)
Failure Analysis
(5)
High Temperature
(5)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(2)

Menü

Weitere Dienste

Einstellungen

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

Influence of High Temperature on the Crystal Structure of SrFe12O19 Nanoparticle

Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging

Controlled Voltage of Hot Snare Polypectomy Device in Electrosurgical Device

Design Sustainability for Battery Packaging to Increase Customer Satisfaction

The Discriminants of Long and Short Duration Failures in Fulfillment Sortation Equipment: A Machine Learning Approach

Simulation of Separation of Salt Solution from Crude Oil in a Hydrocyclone

Magneto-Rotational Augmentation of Bioconvective Transport in Plasma-Nanofluid Flowing through a Penetrable Spinning Disc

Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes

Interconnect Reliability in Advanced Memory Device Packaging

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

Guest editorial: Heterogeneous integration and chiplets interconnection

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Study of robust package strength characterization of memory packages for handheld application

Technological sustainable materials and enabling in semiconductor memory industry: A review

Influence of High Temperature on the Crystal Structure of SrFe 12 O 19 Nanoparticle

Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products

Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement

Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

Interconnect Reliability in Advanced Memory Device Packaging: ISBN: 978-3-031-26707-9 (Print), 978-3-031-26708-6 (Online)

Single Factor Study of Solder Joint Reliability for MCP Packages

Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging

Effects of Epoxy Molding Compound on managed NAND(mNAND) package strain enhancement

Suchergebnisse filtern