UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 3.429

Sortiert nach

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

Journal of materials science. Materials in electronics, 2013-08, Vol.24 (8), p.2803-2811

2013

Volltextzugriff (PDF)

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Journal of electronic materials, 2014-04, Vol.43 (4), p.1017-1025

2014

Volltextzugriff (PDF)

Study on Cu Protrusion of Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-05, Vol.3 (5), p.732-739

2013

Volltextzugriff (PDF)

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

Journal of materials science. Materials in electronics, 2014-11, Vol.25 (11), p.4786-4792

2014

Volltextzugriff (PDF)

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Journal of nanomaterials, 2012-01, Vol.2012, p.1-7

2012

Volltextzugriff (PDF)

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Gold bulletin (World Gold Council), 2014-09, Vol.47 (3), p.141-151

2014

Volltextzugriff (PDF)

A review on future novel interconnect and polymeric materials for cryogenic memory packaging

Journal of materials science. Materials in electronics, 2023-10, Vol.34 (29), p.2003, Article 2003

2023

Volltextzugriff (PDF)

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Journal of nanomaterials, 2013-01, Vol.2013, p.1-9

2013

Volltextzugriff (PDF)

Effects of 3,5-bis(trifluoromethyl)benzeneboronic acid as an additive on electrochemical performance of propylene carbonate-based electrolytes for lithium ion batteries

Electrochimica acta, 2008-12, Vol.54 (2), p.816-820

2008

Volltextzugriff (PDF)

Self-aligned metal capping layers for copper interconnects using electroless plating

Microelectronic engineering, 2006-11, Vol.83 (11), p.2059-2067

2006

Volltextzugriff (PDF)

High resolution front-side visualization of charge stored in EEPROM with scanning nonlinear dielectric microscopy (SNDM)

Nanotechnology, 2021-11, Vol.32 (48), p.485201

2021

Volltextzugriff (PDF)

A single-centre experience and literature review of Flow Re-Directional Endoluminal Device (FRED) in endovascular treatment of intracranial aneurysms

Clinical radiology, 2021-03, Vol.76 (3), p.238.e1-238.e8

2021

Volltextzugriff (PDF)

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Journal of electronic materials, 2012-09, Vol.41 (9), p.2533-2542

2012

Volltextzugriff (PDF)

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1581-1586

2013

Volltextzugriff (PDF)

Association of imaging abnormalities of the subcallosal septal area with Alzheimer's disease and mild cognitive impairment

Clinical radiology, 2017-11, Vol.72 (11), p.915-922

2017

Volltextzugriff (PDF)

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Applied physics letters, 2016-06, Vol.108 (26)

2016

Volltextzugriff (PDF)

Bidirectional electromigration failure

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1261-1265

2013

Volltextzugriff (PDF)

Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

Applied physics letters, 2001-12, Vol.79 (27), p.4592-4594

2001

Volltextzugriff (PDF)

Vinyl-Tris-(methoxydiethoxy)silane as an effective and ecofriendly flame retardant for electrolytes in lithium ion batteries

Electrochemistry communications, 2009-03, Vol.11 (3), p.526-529

2009

Volltextzugriff (PDF)

Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1684-1688

2011

Volltextzugriff (PDF)

Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing

AIP advances, 2016-09, Vol.6 (9), p.095102-095102-6

2016

Volltextzugriff (PDF)

Impact of Homogeneous-Heterogeneous Reactions on Flow of Non-Newtonian Ferrofluid over a Stretching Sheet

Journal of nanomaterials, 2022-01, Vol.2022 (1)

2022

Volltextzugriff (PDF)

Room temperature tensile property and fracture behavior of CuNi10Fe1Mn alloy rods produced by OCC process

Materials science and technology, 2013-03, Vol.29 (3), p.374-377

2013

Volltextzugriff (PDF)

The effect of stress migration on electromigration in dual damascene copper interconnects

Journal of applied physics, 2011-01, Vol.109 (1), p.013716-013716-9

2011

Volltextzugriff (PDF)

Improving electrochemical performance of graphitic carbon in PC-based electrolytes by using N-vinyl-2-pyrrolidone as an additive

Electrochemistry communications, 2008-10, Vol.10 (10), p.1571-1574

2008

Volltextzugriff (PDF)

1 – 25 von 3.429

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(2.765)
Mit Volltextzugriff
(3.184)

Publikationsform

3 weitere anzeigen...

Weniger anzeigen...

Sprache

4 weitere anzeigen...

Weniger anzeigen...

Erscheinungsjahr

n.n

Thema

Science & Technology
(2.095)
Physical Sciences
(962)
Life Sciences & Biomedicine
(839)
Physics
(702)
Technology
(626)
Humans
(546)
Exact Sciences And Technology
(405)
Male
(307)
Materials Science
(303)
Female
(289)
Chemistry
(275)
Engineering
(274)
Biological And Medical Sciences
(252)
Materials Science, Multidisciplinary
(251)
Animals
(221)
Applied Sciences
(192)
Physics, Applied
(186)
Medical Sciences
(185)
Engineering, Electrical & Electronic
(180)
Middle Aged
(176)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

Menü

Weitere Dienste

Einstellungen

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

Study on Cu Protrusion of Through-Silicon Via

Influence of shear strength on long term biased humidity reliability of Cu ball bonds

Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

Evolution and investigation of copper and gold ball bonds in extended reliability stressing

A review on future novel interconnect and polymeric materials for cryogenic memory packaging

Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Effects of 3,5-bis(trifluoromethyl)benzeneboronic acid as an additive on electrochemical performance of propylene carbonate-based electrolytes for lithium ion batteries

Self-aligned metal capping layers for copper interconnects using electroless plating

High resolution front-side visualization of charge stored in EEPROM with scanning nonlinear dielectric microscopy (SNDM)

A single-centre experience and literature review of Flow Re-Directional Endoluminal Device (FRED) in endovascular treatment of intracranial aneurysms

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Association of imaging abnormalities of the subcallosal septal area with Alzheimer's disease and mild cognitive impairment

Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

Bidirectional electromigration failure

Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

Vinyl-Tris-(methoxydiethoxy)silane as an effective and ecofriendly flame retardant for electrolytes in lithium ion batteries

Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization

Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing

Impact of Homogeneous-Heterogeneous Reactions on Flow of Non-Newtonian Ferrofluid over a Stretching Sheet

Room temperature tensile property and fracture behavior of CuNi10Fe1Mn alloy rods produced by OCC process

The effect of stress migration on electromigration in dual damascene copper interconnects

Improving electrochemical performance of graphitic carbon in PC-based electrolytes by using N-vinyl-2-pyrrolidone as an additive

Suchergebnisse filtern