UB Paderborn / Katalog / Suche / in CDI

Issues related to the implementation of Pb-free electronic solders in consumer electronics

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.319-330

Frear, DR

2007

Link zum Volltext

Verfügbarkeit prüfen

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Journal of materials research, 2002-02, Vol.17 (2), p.291-301

2002

Link zum Volltext

Verfügbarkeit prüfen

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

Journal of applied physics, 2001-11, Vol.90 (9), p.4502-4508

2001

Link zum Volltext

Verfügbarkeit prüfen

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Journal of electronic materials, 2008-06, Vol.37 (6), p.829-836

2008

Link zum Volltext

Verfügbarkeit prüfen

Pb-free solders for flip-chip interconnects

JOM (1989), 2001-06, Vol.53 (6), p.28-33

2001

Link zum Volltext

Verfügbarkeit prüfen

Electromigration of eutectic SnPb solder interconnects for flip chip technology

Journal of applied physics, 2001-03, Vol.89 (6), p.3189-3194

2001

Link zum Volltext

Verfügbarkeit prüfen

Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of electronic materials, 2020-05, Vol.49 (5), p.3251-3258

2020

Link zum Volltext

Verfügbarkeit prüfen

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Journal of applied physics, 1999-06, Vol.85 (12), p.8456-8463

1999

Link zum Volltext

Verfügbarkeit prüfen

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Journal of electronic materials, 2020-07, Vol.49 (7), p.4466-4467

2020

Link zum Volltext

Verfügbarkeit prüfen

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Journal of electronic materials, 2005-10, Vol.34 (10), p.L43-L46

2005

Link zum Volltext

Verfügbarkeit prüfen

Wetting reaction versus solid state aging of eutectic SnPb on Cu

Journal of applied physics, 2001-05, Vol.89 (9), p.4843-4849

2001

Link zum Volltext

Verfügbarkeit prüfen

High-lead flip chip bump cracking on the thin organic substrate in a module package

Microelectronics and reliability, 2012-02, Vol.52 (2), p.455-460

2012

Link zum Volltext

Verfügbarkeit prüfen

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1994-07, Vol.25 (7), p.1509-1523

1994

Link zum Volltext

Verfügbarkeit prüfen

Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

Journal of electronic materials, 2008-02, Vol.37 (2), p.185-188

2008

Link zum Volltext

Verfügbarkeit prüfen

Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Journal of electronic materials, 2007-03, Vol.36 (3), p.207-213

2007

Link zum Volltext

Verfügbarkeit prüfen

Emerging Materials Challenges in Microelectronics Packaging

MRS bulletin, 2003-01, Vol.28 (1), p.68-74

2003

Link zum Volltext

Verfügbarkeit prüfen

The mechanical behavior of interconnect materials for electronic packaging

JOM (1989), 1996-05, Vol.48 (5), p.49-53

Frear, D. R.

1996

Link zum Volltext

Verfügbarkeit prüfen

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 1999-05, Vol.30 (5), p.1301-1313

1999

Link zum Volltext

Verfügbarkeit prüfen

Materials issues in area-array microelectronic packaging

JOM (1989), 1999-03, Vol.51 (3), p.22-27

Frear, D R

1999

Link zum Volltext

Verfügbarkeit prüfen

Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization

Journal of applied physics, 2008-06, Vol.103 (12), p.123506-123506-5

2008

Link zum Volltext

Verfügbarkeit prüfen

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Materials letters, 2008-06, Vol.62 (17), p.3031-3034

2008

Link zum Volltext

Verfügbarkeit prüfen

Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Journal of the Korean Physical Society, 2011, 59(21), , pp.402-407

2011

Link zum Volltext

Verfügbarkeit prüfen

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Journal of electronic materials, 1999-11, Vol.28 (11), p.1290-1298

1999

Link zum Volltext

Verfügbarkeit prüfen

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Journal of materials research, 2000-08, Vol.15 (8), p.1679-1687

2000

Link zum Volltext

Verfügbarkeit prüfen

Interfacial fracture toughness of Pb-free solders

Microelectronics and reliability, 2009-03, Vol.49 (3), p.269-287

2009

Link zum Volltext

Verfügbarkeit prüfen

Menü

Weitere Dienste

Einstellungen

Issues related to the implementation of Pb-free electronic solders in consumer electronics

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Pb-free solders for flip-chip interconnects

Electromigration of eutectic SnPb solder interconnects for flip chip technology

Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Wetting reaction versus solid state aging of eutectic SnPb on Cu

High-lead flip chip bump cracking on the thin organic substrate in a module package

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

Failure morphology after the drop impact test of the ball grid array package with lead-free Sn-3.8Ag-0.7Cu on Cu and Ni under-bump metallurgies

Emerging Materials Challenges in Microelectronics Packaging

The mechanical behavior of interconnect materials for electronic packaging

Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder

Materials issues in area-array microelectronic packaging

Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Drop Performance of Land Grid Array Packages as a Function of Cu Content in Lead-free Solder Alloys

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

Interfacial fracture toughness of Pb-free solders

Suchergebnisse filtern