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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-9

2024

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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-7

2024

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Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, p.1-8

2021

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Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.380-385

2020

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Influence of environmental factors like temperature and humidity on MEMS packaging materials

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-6

2018

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

2018 20th International Conference on Electronic Materials and Packaging (EMAP), 2018, p.1-4

2018

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A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1509-1514

2019

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IEEE_Xplore

Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-8

2017

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IEEE_Xplore

Electrophoretic karyotype of Dipodascus (Endomyces) magnusii: two main intraspecific chromosomal polymorphisms associated with the difference in total genome size

Current genetics, 1995-12, Vol.29 (1), p.81-87

1995

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Comparison and Impact of Different Fiber Debond Techniques on Fiber Reinforced Flexible Composites

Viscoelastic Behavior of Glass-Fiber-Reinforced Silicone Composites Exposed to Cyclic Loading

Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements

The Tension-Twist Coupling Mechanism in Flexible Composites: A Systematic Study Based on Tailored Laminate Structures Using a Novel Test Device

Latest Developments in Minimally Invasive Spinal Treatment in Slovakia and Its Comparison with an Open Approach for the Treatment of Lumbar Degenerative Diseases

Tailored Interfaces in Fiber-Reinforced Elastomers: A Surface Treatment Study on Optimized Load Coupling via the Modified Fiber Bundle Debond Technique

Asymmetric chiral and antichiral mechanical metamaterials with tunable Poisson’s ratio

Thermal and Moisture Dependent Material Characterization and Modeling of Glass Fiber Reinforced Epoxy Laminates

Local damage simulations of printed circuit boards based on in-plane cohesive zone parameters

Kritische Lebensereignisse und Lebenskrisen: Vom Umgang mit den Schattenseiten des Lebens

Investigation of adhesion properties in load coupling applications for flexible composites

MetamaterialFinder: A software framework for discovering and analyzing mechanical metamaterials based on simple closed curves

A black-box optimization strategy for customizable global elastic deformation behavior of unit cell-based tri-anti-chiral metamaterials

Chiral-based mechanical metamaterial with tunable normal-strain shear coupling effect

Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomers

Warpage Optimization of Package Substrates Using Metamodels - A Review

A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Influence of environmental factors like temperature and humidity on MEMS packaging materials

Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip

Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations

Electrophoretic karyotype of Dipodascus (Endomyces) magnusii: two main intraspecific chromosomal polymorphisms associated with the difference in total genome size

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