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Genetic diversity among clonal lineages within Escherichia coli O157:H7 stepwise evolutionary model

Emerging infectious diseases, 2007-11, Vol.13 (11), p.1701-1706

2007

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Identification of Shiga toxigenic Escherichia coli seropathotypes A and B by multiplex PCR

Molecular and cellular probes, 2007-08, Vol.21 (4), p.308-311

2007

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A 12-Base-Pair Deletion in the Flagellar Master Control Gene flhC Causes Nonmotility of the Pathogenic German Sorbitol-Fermenting Escherichia coli O157:H− Strains

Journal of Bacteriology, 2004-04, Vol.186 (8), p.2319-2327

2004

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Genetic and Evolutionary Analysis of Mutations in the gusA Gene That Cause the Absence of β-Glucuronidase Activity in Escherichia coli O157:H7

The Journal of infectious diseases, 2001-10, Vol.184 (7), p.918-921

2001

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A 12-Base-Pair Deletion in the Flagellar Master Control Gene flhC Causes Nonmotility of the Pathogenic German Sorbitol-Fermenting Escherichia coli O157:H super(-) Strains

Journal of bacteriology, 2004-04, Vol.186 (8), p.2319-2327

2004

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Relative Quantitation of Intact Proteins of Bacterial Cell Extracts Using Coextracted Proteins as Internal Standards

Analytical chemistry (Washington), 2004-02, Vol.76 (4), p.1002-1007

2004

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Comparative analysis of a modified rapid presence/absence test and the standard MPN method for detecting Escherichia coli in orange juice

Food microbiology, 2002-02, Vol.19 (1), p.111-115

2002

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A three-dimensional stacked fin-CMOS technology for high-density ULSI circuits

IEEE transactions on electron devices, 2005-09, Vol.52 (9), p.1998-2003

2005

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Monolithically integrated planar microfuel cell arrays

Sensors and actuators. B, Chemical, 2008-06, Vol.132 (2), p.576-586

2008

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Stacked 3-D Fin-CMOS technology

IEEE electron device letters, 2005-06, Vol.26 (6), p.416-418

2005

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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

IEEE transactions on components and packaging technologies, 2006-03, Vol.29 (1), p.164-172

2006

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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

IEEE transactions on components and packaging technologies, 2006-03, Vol.29 (1), p.164-172

2006

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Integrated fuel cell micro power system by microfabrication technique

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05, 2005, Vol.2, p.1856-1859 Vol. 2

2005

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Flip-chip based 3-D high-Q integrated inductors

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.1095-1100 Vol.1

2004

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High-performance microwave passive components on silicon substrate

2002 3rd International Conference on Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002, 2002, p.263-266

2002

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Three-dimensional stacked-Fin-CMOS integrated circuit using double layer SOI material

Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.81-85 vol.1

2004

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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.685-691

2003

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Optimization of stencil printing wafer bumping for fine pitch flip chip applications

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1724-1730

2003

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Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1850-1855

2003

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Genetic diversity among clonal lineages within Escherichia coli O157:H7 stepwise evolutionary model

Identification of Shiga toxigenic Escherichia coli seropathotypes A and B by multiplex PCR

A 12-Base-Pair Deletion in the Flagellar Master Control Gene flhC Causes Nonmotility of the Pathogenic German Sorbitol-Fermenting Escherichia coli O157:H− Strains

Genetic and Evolutionary Analysis of Mutations in the gusA Gene That Cause the Absence of β-Glucuronidase Activity in Escherichia coli O157:H7

A 12-Base-Pair Deletion in the Flagellar Master Control Gene flhC Causes Nonmotility of the Pathogenic German Sorbitol-Fermenting Escherichia coli O157:H super(-) Strains

Relative Quantitation of Intact Proteins of Bacterial Cell Extracts Using Coextracted Proteins as Internal Standards

Comparative analysis of a modified rapid presence/absence test and the standard MPN method for detecting Escherichia coli in orange juice

A three-dimensional stacked fin-CMOS technology for high-density ULSI circuits

Monolithically integrated planar microfuel cell arrays

Stacked 3-D Fin-CMOS technology

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

Integrated fuel cell micro power system by microfabrication technique

Flip-chip based 3-D high-Q integrated inductors

High-performance microwave passive components on silicon substrate

Three-dimensional stacked-Fin-CMOS integrated circuit using double layer SOI material

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties

Optimization of stencil printing wafer bumping for fine pitch flip chip applications

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

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