UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Heptacene: Characterization in Solution, in the Solid State, and in Films

Journal of the American Chemical Society, 2017-03, Vol.139 (12), p.4435-4442

2017

Volltextzugriff (PDF)

Polycyanate esters: Science and applications

Progress in polymer science, 1995, Vol.20 (1), p.61-118

1995

Volltextzugriff (PDF)

A New Permanganate-Free Slurry for GaN-SiC CMP Applications

Materials science forum, 2020-07, Vol.1004, p.199-205

2020

Volltextzugriff (PDF)

Determination of molecular weight of nonlinear polymers by NMR spectroscopy: application on a polymer of 2,2-bis(4-cyanatophenyl)propane

Macromolecules, 1990-10, Vol.23 (21), p.4553-4556

Fang, Treliant

1990

Volltextzugriff (PDF)

Ethylene glycol ether free solder paste development

Journal of electronic materials, 2001-08, Vol.30 (8), p.1035-1041

2001

Volltextzugriff (PDF)

Squeegee bump technology

IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.38-44

2002

Volltextzugriff (PDF)

Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors

2014 IEEE 60th Holm Conference on Electrical Contacts (Holm), 2014, p.1-5

2014

Volltextzugriff (PDF)

Anisotropic conductive adhesive films for flip chip on flex packages

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431), 2000, p.129-135

2000

Volltextzugriff (PDF)

Poly(3-phenylquinoxaline): a new thermally stable polymer

Macromolecules, 1991-03, Vol.24 (2), p.444-449

Fang, Treliant

1991

Volltextzugriff (PDF)

Characterization of a carboxyl-terminated butadiene-acrylonitrile copolymer by two-dimensional nuclear magnetic resonance

Macromolecules, 1990-04, Vol.23 (8), p.2145-2152

Fang, Treliant

1990

Volltextzugriff (PDF)

Redistribution and bumping of a high I/O device for flip chip assembly

IEEE transactions on advanced packaging, 2000-02, Vol.23 (1), p.3-8

2000

Volltextzugriff (PDF)

Physical design and assembly process development of a multichip package containing a light emitting diode (LED) array die

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1997-11, Vol.20 (4), p.389-395

1997

Volltextzugriff (PDF)

HEPTACENE, OCTACENE, NONACENE, SUPERCENE, AND RELATED POLYMERS (POLYACENES, TWO-DIMENSIONAL POLYMERS, ACENEQUINONES, TETRAHALOHEPTIPTYCENE, BENT ANTHRACENE)

FANG, TRELIANT

1986

Volltextzugriff (PDF)

Interactions of methane with ThO2/SiO2 surface at 1073 K

Journal of catalysis, 1981-01, Vol.69 (1), p.227-229

FANG, T

1981

Volltextzugriff (PDF)

Interactions of methane with [formula omitted] surface at 1073 K

Journal of catalysis, 1981, Vol.69 (1), p.227-229

1981

Volltextzugriff (PDF)

Evaluation of commercially available, thick, photosensitive films as a stress compensation layer for wafer level packaging

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.304-309

2001

Volltextzugriff (PDF)

Squeegee bump technology

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.46-53

2000

Volltextzugriff (PDF)

Catalytic Pyrolysis of Methane

Journal of the Chinese Chemical Society (Taipei), 1982-12, Vol.29 (4), p.265-273

1982

Volltextzugriff (PDF)

Physical design and assembly process development of a multi-chip package containing a light emitting diode (LED) array die

1996 Proceedings 46th Electronic Components and Technology Conference, 1996, p.1039-1046

1996

Volltextzugriff (PDF)

Development of fluxless flip chip bonding to a thin film multichip module substrate

1997 Proceedings 47th Electronic Components and Technology Conference, 1997, p.875-878

1997

Volltextzugriff (PDF)

1 – 20 von 20

Menü

Weitere Dienste

Einstellungen

Heptacene: Characterization in Solution, in the Solid State, and in Films

Polycyanate esters: Science and applications

A New Permanganate-Free Slurry for GaN-SiC CMP Applications

Determination of molecular weight of nonlinear polymers by NMR spectroscopy: application on a polymer of 2,2-bis(4-cyanatophenyl)propane

Ethylene glycol ether free solder paste development

Squeegee bump technology

Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors

Anisotropic conductive adhesive films for flip chip on flex packages

Poly(3-phenylquinoxaline): a new thermally stable polymer

Characterization of a carboxyl-terminated butadiene-acrylonitrile copolymer by two-dimensional nuclear magnetic resonance

Redistribution and bumping of a high I/O device for flip chip assembly

Physical design and assembly process development of a multichip package containing a light emitting diode (LED) array die

HEPTACENE, OCTACENE, NONACENE, SUPERCENE, AND RELATED POLYMERS (POLYACENES, TWO-DIMENSIONAL POLYMERS, ACENEQUINONES, TETRAHALOHEPTIPTYCENE, BENT ANTHRACENE)

Interactions of methane with ThO2/SiO2 surface at 1073 K

Interactions of methane with [formula omitted] surface at 1073 K

Evaluation of commercially available, thick, photosensitive films as a stress compensation layer for wafer level packaging

Squeegee bump technology

Catalytic Pyrolysis of Methane

Physical design and assembly process development of a multi-chip package containing a light emitting diode (LED) array die

Development of fluxless flip chip bonding to a thin film multichip module substrate

Suchergebnisse filtern