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Collaborative Construction Industry Integrated Management Service System Framework Based on Big Data

2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), 2019, p.1521-1525

2019

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Critical cooling rate and thermal stability of Fe–Co–Zr–Y–Cr–Mo–B amorphous alloy

Journal of alloys and compounds, 2006-01, Vol.407 (1), p.125-128

2006

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A new TiCuHfSi bulk metallic glass with potential for biomedical applications

Materials in engineering, 2014-02, Vol.54, p.251-255

2014

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ENRICHMENT EFFECT OF PHYTOHORMONES ON ARSENIC UPTAKE AND TOLERANCE MECHANISM OF LANDOLTIA PUNCTATA

Applied ecology and environmental research, 2024, Vol.22 (1), p.489-506

2024

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EFFECTS OF DIFFERENT EXOGENOUS SELENIUM ON ENZYME ACTIVITIES AND MICROORGANISMS IN ARSENICCONTAMINATED SOIL

Applied ecology and environmental research, 2022, Vol.20 (5), p.4237-4255

2022

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MITIGATING THE HARM CAUSED BY COPPER POLLUTION IN SEDIMENT TO SUBMERGED MACROPHYTES BY ADDING BIOCHAR TO WATER

Applied ecology and environmental research, 2022, Vol.20 (6), p.5433-5448

2022

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Mechanical performance and fracture behavior of Fe41Co7Cr15Mo14Y2C15B6 bulk metallic glass

Journal of materials research, 2007-02, Vol.22 (2), p.358-363

2007

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Enhanced glass forming ability of Fe–Co–Zr–Mo–W–B alloys with Ni addition

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2005-08, Vol.402 (1), p.188-192

2005

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Mechanical performance and fracture behavior of Fe 41 Co 7 Cr 15 Mo 14 Y 2 C 15 B 6 bulk metallic glass

Journal of materials research, 2007-02, Vol.22 (2), p.358-363

2007

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Effects of simulated acid rain on germination, foliar damage, chlorophyll contents and seedling growth of five hardwood species growing in China

Forest ecology and management, 2000-02, Vol.126 (3), p.321-329

2000

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A quantitative comparison and analysis on rewiring techniques

ASIC, 2003. Proceedings. 5th International Conference on, 2003, Vol.1, p.242-245 Vol.1

2003

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Effect of substrates on the properties of p-type ZnO films

Physica. E, Low-dimensional systems & nanostructures, 2007-09, Vol.39 (2), p.267-270

2007

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Acidity and chemistry of bulk precipitation, throughfall and stemflow in a Chinese fir plantation in Fujian, China

Forest ecology and management, 1999-09, Vol.122 (3), p.243-248

1999

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Mesenchymal Stem Cell Derived Osteogenic Cells Is Superior to Bone Marrow Aspirate Impregnated Biomaterial Complex in Posterior Spinal Fusion

Key engineering materials, 2007-01, Vol.330-332, p.1149-1152

2007

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Can Basic Fibroblast Growth Factor Pre-Treatment Enhance Mesenchymal Stem Cell Therapy in Undecorticated Posterior Spinal Fusion?

Key engineering materials, 2007-01, Vol.330-332, p.1137-1140

2007

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A multi-scale interfacial delamination model of Cu-SAM-epoxy systems

2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008, p.1-5

2008

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Thermal interface material with aligned CNT and its application in HB-LED packaging

56th Electronic Components and Technology Conference 2006, 2006, p.6 pp.

2006

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Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion

2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009, p.234-237

2009

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Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation

EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006, p.1-4

2006

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A new method to predict delamination in electronic packages

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.145-150 Vol. 1

2005

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The response of MOV and SiC arresters to steep-front longer duration current pulses

IEEE transactions on power delivery, 1991-04, Vol.6 (2), p.666-671

1991

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Moisture diffusion study in electronic packaging using molecular dynamic simulation

56th Electronic Components and Technology Conference 2006, 2006, p.4 pp.

2006

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Prediction of delamination in a Bi-material system based on free-edge energy evaluation

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1160-1164

2003

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Reliability prediction in electronic packages using molecular simulation

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1314-1317 Vol. 2

2005

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Delamination control in electronic packaging using the energy method

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.703-707

2003

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Collaborative Construction Industry Integrated Management Service System Framework Based on Big Data

Critical cooling rate and thermal stability of Fe–Co–Zr–Y–Cr–Mo–B amorphous alloy

A new TiCuHfSi bulk metallic glass with potential for biomedical applications

ENRICHMENT EFFECT OF PHYTOHORMONES ON ARSENIC UPTAKE AND TOLERANCE MECHANISM OF LANDOLTIA PUNCTATA

EFFECTS OF DIFFERENT EXOGENOUS SELENIUM ON ENZYME ACTIVITIES AND MICROORGANISMS IN ARSENICCONTAMINATED SOIL

MITIGATING THE HARM CAUSED BY COPPER POLLUTION IN SEDIMENT TO SUBMERGED MACROPHYTES BY ADDING BIOCHAR TO WATER

Mechanical performance and fracture behavior of Fe41Co7Cr15Mo14Y2C15B6 bulk metallic glass

Enhanced glass forming ability of Fe–Co–Zr–Mo–W–B alloys with Ni addition

Mechanical performance and fracture behavior of Fe 41 Co 7 Cr 15 Mo 14 Y 2 C 15 B 6 bulk metallic glass

Effects of simulated acid rain on germination, foliar damage, chlorophyll contents and seedling growth of five hardwood species growing in China

A quantitative comparison and analysis on rewiring techniques

Effect of substrates on the properties of p-type ZnO films

Acidity and chemistry of bulk precipitation, throughfall and stemflow in a Chinese fir plantation in Fujian, China

Mesenchymal Stem Cell Derived Osteogenic Cells Is Superior to Bone Marrow Aspirate Impregnated Biomaterial Complex in Posterior Spinal Fusion

Can Basic Fibroblast Growth Factor Pre-Treatment Enhance Mesenchymal Stem Cell Therapy in Undecorticated Posterior Spinal Fusion?

A multi-scale interfacial delamination model of Cu-SAM-epoxy systems

Thermal interface material with aligned CNT and its application in HB-LED packaging

Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion

Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation

A new method to predict delamination in electronic packages

The response of MOV and SiC arresters to steep-front longer duration current pulses

Moisture diffusion study in electronic packaging using molecular dynamic simulation

Prediction of delamination in a Bi-material system based on free-edge energy evaluation

Reliability prediction in electronic packages using molecular simulation

Delamination control in electronic packaging using the energy method

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