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Negative-tone Photodefinable Underfill Having High Resolution and Appropriate Thermal Fluidity

Journal of Photopolymer Science and Technology, 2017/06/26, Vol.30(2), pp.157-161

2017

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Omnidirectional Reflector based on Transparent Oxide Materials for Light Extraction Enhancement of Organic and Inorganic Solid-state Light Emitting Devices

Journal of Photopolymer Science and Technology, 2018/06/25, Vol.31(3), pp.363-368

2018

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Effects of Material Property and Structural Design on the Stress Reduction of the Joints in Electronics Devices

Materials science forum, 2014-05, Vol.783-786, p.2765-2770

2014

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Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer

Journal of Smart Processing, 2017, Vol.6(5), pp.188-194

2017

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Material and Process for Insulation Reliable Circuitry below 2/2 μm Line/Space

Journal of Smart Processing, 2018, Vol.7(4), pp.160-165

2018

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Assembly Technology for Fine Pitch Bumps Using Photodefinable Wafer-Level Underfill

Journal of Smart Processing, 2017, Vol.6(4), pp.149-155

2017

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金属表面状態がエポキシ樹脂―金属界面特性に与える影響

日本金属学会誌, 2017/03/01, Vol.81(3), pp.109-114

2017

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Omnidirectional Reflector with Total Internal Reflective Interface for Light Extraction Enhancement of Solid‐State Light Source

Physica status solidi. A, Applications and materials science, 2019-03, Vol.216 (5), p.n/a

2019

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Omnidirectional Reflector with Total Internal Reflective Interface for Light Extraction Enhancement of Solid‐State Light Source (Phys. Status Solidi A 5∕2019)

Physica status solidi. A, Applications and materials science, 2019-03, Vol.216 (5), p.n/a

2019

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Change in electrical conductivity of electrically conductive adhesives during curing process

Journal of materials science, 2022-06, Vol.57 (24), p.11189-11201

2022

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Effect of Stress Gradient on Heat Cycle Fatigue Life Prediction of Solder Joints by Repetitive Bending Test

Materials science forum, 2021-01, Vol.1016, p.875-881

2021

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Effects of Microstructural Changes of the Solder Joint Under Thermal Loading on the Life Under Vibrational Loading

Journal of Smart Processing, 2014/07/20, Vol.3(4), pp.225-231

2014

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Mechanism for Adhesion of Epoxy Resin to Copper Substrate through C-H-Si Amorphous Thin Film

Journal of Smart Processing, 2021, Vol.10(5), pp.308-315

2021

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Effect of Al Interlayer on Thermal Cycle Reliability for a Semiconductor Die-attached Joint with Ni-Sn Transient Liquid Phase Bonding

Journal of Smart Processing, 2021-01, Vol.10 (1), p.39-44

2021

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Effect of Al Interlayer on Thermal Cycle Reliability for a Semiconductor Die-attached Joint with Ni-Sn Transient Liquid Phase Bonding

Journal of Smart Processing, 2021, Vol.10(1), pp.39-44

2021

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Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection

Materials Science Forum, 2006-04, Vol.512, p.367-372

2006

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Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process

Journal of physics. Conference series, 2009-05, Vol.165, p.012047

2009

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Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices

Materials Science Forum, 2016-11, Vol.879, p.1258-1264

2016

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Influence of Thermal Fluctuation on Bonding Accuracy in Die-Attach Proces

Journal of Smart Processing, 2019, Vol.8(5), pp.169-176

2019

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Reliability Evaluation of Soldered Joints under Multiple Environments

JOURNAL OF THE JAPAN WELDING SOCIETY, 2011, Vol.80(4), pp.299-303

FUJIMOTO, Kozo

2011

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Evaluation of Stress-strain State in Power Module Sealed with Hard Resin Containing an Interlayer with Low Elastic Modulus

Journal of Smart Processing, 2019, Vol.8 (5), p.205-212

2019

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Evaluation of Stress-strain State in Power Module Sealed with Hard Resin Containing an Interlayer with Low Elastic Modulus

Journal of Smart Processing, 2019, Vol.8(5), pp.205-212

2019

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Metal Surface Condition Effect on Interfacial Property between Metal and Epoxy Resin

Journal of the Japan Institute of Metals and Materials, 2017/03/01, Vol.81(3), pp.109-114

2017

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Effect of Characteristic of Resin on Coalescence Behavior of Solder Fillers in Self-Organization Assembly Method

Journal of Smart Processing, 2018, Vol.7(5), pp.192-198

2018

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New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler

Japanese Journal of Applied Physics, 2004-04, Vol.43 (4S), p.2277

2004

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Negative-tone Photodefinable Underfill Having High Resolution and Appropriate Thermal Fluidity

Omnidirectional Reflector based on Transparent Oxide Materials for Light Extraction Enhancement of Organic and Inorganic Solid-state Light Emitting Devices

Effects of Material Property and Structural Design on the Stress Reduction of the Joints in Electronics Devices

Formation of Defects in Solid-Liquid Reaction-Diffusion Bonding of Copper Using a Tin Film Interlayer

Material and Process for Insulation Reliable Circuitry below 2/2 μm Line/Space

Assembly Technology for Fine Pitch Bumps Using Photodefinable Wafer-Level Underfill

金属表面状態がエポキシ樹脂―金属界面特性に与える影響

Omnidirectional Reflector with Total Internal Reflective Interface for Light Extraction Enhancement of Solid‐State Light Source

Omnidirectional Reflector with Total Internal Reflective Interface for Light Extraction Enhancement of Solid‐State Light Source (Phys. Status Solidi A 5∕2019)

Change in electrical conductivity of electrically conductive adhesives during curing process

Effect of Stress Gradient on Heat Cycle Fatigue Life Prediction of Solder Joints by Repetitive Bending Test

Effects of Microstructural Changes of the Solder Joint Under Thermal Loading on the Life Under Vibrational Loading

Mechanism for Adhesion of Epoxy Resin to Copper Substrate through C-H-Si Amorphous Thin Film

Effect of Al Interlayer on Thermal Cycle Reliability for a Semiconductor Die-attached Joint with Ni-Sn Transient Liquid Phase Bonding

Effect of Al Interlayer on Thermal Cycle Reliability for a Semiconductor Die-attached Joint with Ni-Sn Transient Liquid Phase Bonding

Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection

Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process

Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices

Influence of Thermal Fluctuation on Bonding Accuracy in Die-Attach Proces

Reliability Evaluation of Soldered Joints under Multiple Environments

Evaluation of Stress-strain State in Power Module Sealed with Hard Resin Containing an Interlayer with Low Elastic Modulus

Evaluation of Stress-strain State in Power Module Sealed with Hard Resin Containing an Interlayer with Low Elastic Modulus

Metal Surface Condition Effect on Interfacial Property between Metal and Epoxy Resin

Effect of Characteristic of Resin on Coalescence Behavior of Solder Fillers in Self-Organization Assembly Method

New Process of Self-Organized Interconnection in Packaging Using Conductive Adhesive with Low Melting Point Filler

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