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Intercomparison of permittivity measurement techniques for ferroelectric thin layers

Journal of applied physics, 2014-01, Vol.115 (2)

2014

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RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits

Microelectronic engineering, 2014-11, Vol.130, p.74-81

2014

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RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

Microelectronic engineering, 2010-03, Vol.87 (3), p.491-495

2010

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Ferroelectric properties of Pb ( Zr , Ti ) O 3 thin films until 40 GHz

Applied physics letters, 2009-02, Vol.94 (5), p.052901-052901-3

2009

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Performance predictions of interconnect networks for advanced technology nodes

Microelectronic engineering, 2010-03, Vol.87 (3), p.321-323

2010

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Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

Microelectronic engineering, 2011-05, Vol.88 (5), p.729-733

2011

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Wideband frequency and in situ characterization of aluminum nitride (AlN) in a metal/insulator/metal (MIM) configuration

Microelectronic engineering, 2011-05, Vol.88 (5), p.564-568

2011

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Quality factor and frequency bandwidth of 2D self-inductors in 3D integration stacks

Microelectronic engineering, 2011-05, Vol.88 (5), p.734-738

2011

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Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

Microelectronic engineering, 2010-03, Vol.87 (3), p.329-332

2010

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Impact of process parameters on circuit performance for the 32 nm technology node

Microelectronic engineering, 2007-11, Vol.84 (11), p.2738-2743

2007

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In situ microwave characterisation of medium-k HfO2 and high-k SrTiO3 dielectrics for metal-insulator-metal capacitors integrated in back-end of line of integrated circuits

IET microwaves, antennas & propagation, 2008-12, Vol.2 (8), p.781-788

2008

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Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45 nm node

Microelectronic engineering, 2007-11, Vol.84 (11), p.2744-2749

2007

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"Performance predictions of interconnect networks for advanced technology nodes"

Microelectronic engineering, 2010-03, Vol.87 (issue 3), p.321-323

2010

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Wide band frequency and in situ characterisation of high permittivity insulators (High- K) for H.F. integrated passives

Microelectronic engineering, 2006-11, Vol.83 (11), p.2184-2188

2006

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Characteristic impedance extraction of embedded and integrated interconnects

European physical journal. Applied physics, 2011-03, Vol.53 (3), p.33605

2011

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Refined Characterization Up to Millimeter Waves of Ferroelectric KTN Thin Film for Efficient Integrated Tunable Devices

ECS transactions, 2013-01, Vol.58 (7), p.237-242

2013

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Variation of MIM damascene capacitor HF performance evolving from 2D to 3D architectures

Electronics letters, 2008, Vol.44 (6), p.411-412

2008

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Impact of dummies on interconnects network HF propagation performances for the 65 nm node

Microelectronic engineering, 2006-11, Vol.83 (11), p.2292-2296

2006

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Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

Microelectronic engineering, 2010-03, Vol.87 (3), p.301-305

2010

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High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits

Microelectronic engineering, 2006-11, Vol.83 (11), p.2341-2345, Article 2341

2006

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Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

ECS transactions, 2010, Vol.33 (12), p.1-21

2010

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Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal–insulator–metal capacitors

Microelectronic engineering, 2005-12, Vol.82 (3), p.521-528

2005

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Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45nm node

Microelectronic engineering, 2007-11, Vol.84 (11), p.2744-2749

2007

Volltextzugriff (PDF)

Impact of process parameters on circuit performance for the 32nm technology node

Microelectronic engineering, 2007-11, Vol.84 (11), p.2738-2743

2007

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Interval training at VO2max : effects on aerobic performance and overtraining markers

Medicine and science in sports and exercise, 1999, Vol.31 (1), p.156-163

1999

Volltextzugriff (PDF)

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Intercomparison of permittivity measurement techniques for ferroelectric thin layers

RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

Ferroelectric properties of Pb ( Zr , Ti ) O 3 thin films until 40 GHz

Performance predictions of interconnect networks for advanced technology nodes

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

Wideband frequency and in situ characterization of aluminum nitride (AlN) in a metal/insulator/metal (MIM) configuration

Quality factor and frequency bandwidth of 2D self-inductors in 3D integration stacks

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

Impact of process parameters on circuit performance for the 32 nm technology node

In situ microwave characterisation of medium-k HfO2 and high-k SrTiO3 dielectrics for metal-insulator-metal capacitors integrated in back-end of line of integrated circuits

Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45 nm node

"Performance predictions of interconnect networks for advanced technology nodes"

Wide band frequency and in situ characterisation of high permittivity insulators (High- K) for H.F. integrated passives

Characteristic impedance extraction of embedded and integrated interconnects

Refined Characterization Up to Millimeter Waves of Ferroelectric KTN Thin Film for Efficient Integrated Tunable Devices

Variation of MIM damascene capacitor HF performance evolving from 2D to 3D architectures

Impact of dummies on interconnects network HF propagation performances for the 65 nm node

Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits

Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking

Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal–insulator–metal capacitors

Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45nm node

Impact of process parameters on circuit performance for the 32nm technology node

Interval training at VO2max : effects on aerobic performance and overtraining markers

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