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Sensors (Basel, Switzerland), 2015-08, Vol.15 (8), p.20305-20315
2015
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Micromachines (Basel), 2018-05, Vol.9 (6), p.266
2018
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Micromachines (Basel), 2016-10, Vol.7 (10), p.193-193
2016
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Sensors & transducers, 2016-12, Vol.207 (12), p.30-30
2016
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Journal of physics. Conference series, 2016-10, Vol.757 (1), p.12016
2016
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IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2013-07, Vol.60 (7), p.1356-1375
2013
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Applied Mechanics and Materials, 2014-02, Vol.530-531 (Advances in Measurements and Information Technologies), p.28-32
2014
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Applied Mechanics and Materials, 2014-02, Vol.530-531 (Advances in Measurements and Information Technologies), p.75-78
2014
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Modern Sensing Technologies, 2019, Vol.29, p.231-251
2019
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IEEE transactions on advanced packaging, 2007-08, Vol.30 (3), p.359-368
2007
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MRS proceedings, 2008, Vol.1112 (1), Article 1112-E01-01
2008
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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.565-572
2018
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Review of scientific instruments, 2000-05, Vol.71 (5), p.2224-2227
2000
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2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019, p.793-796
2019
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2017 Eleventh International Conference on Sensing Technology (ICST), 2017, p.1-6
2017
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-8
2017
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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.251-255
2018
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2016 6th Electronic System-Integration Technology Conference (ESTC), 2016, p.1-7
2016
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2008 58th Electronic Components and Technology Conference, 2008, p.563-570
2008
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2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-6
2017
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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.325-330
2016
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IEEE transactions on components and packaging technologies, 2003-03, Vol.26 (1), p.245-254
2003
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Praxis der Naturwissenschaften. Physik, 1985, Vol.34 (2), p.2-8
1985
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Praxis der Naturwissenschaften. Physik, 1985, Vol.34 (2), p.9-15
1985
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2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.501-505
2016
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- Ieee Transactions On Advanced Packaging
- Review Of Scientific Instruments
- Applied Mechanics And Materials
- Micromachines
- Praxis Der Naturwissenschaften. Physik
- 27th Micromechanics And Microsystems Europe Workshop
- Der Physikunterricht
- Ieee Transactions On Components And Packaging Technologies
- Ieee Transactions On Components, Packaging, And Manufacturing Technology. Part A
- Ieee Transactions On Electronics Packaging Manufacturing