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Formation and properties of Au-based nanograined metallic glasses

Acta materialia, 2011-09, Vol.59 (16), p.6433-6440

2011

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Energy dissipation in submicrometer thick single-crystal silicon cantilevers

Journal of microelectromechanical systems, 2002-12, Vol.11 (6), p.775-783

2002

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Biomedical microsystems for minimally invasive diagnosis and treatment

Proceedings of the IEEE, 2004-01, Vol.92 (1), p.98-114

2004

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Thermal radiation from two-dimensionally confined modes in microcavities

Applied physics letters, 2001-08, Vol.79 (9), p.1393-1395

2001

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Tactile display using shape memory alloy micro-coil actuator and magnetic latch mechanism

Displays, 2013-04, Vol.34 (2), p.89-94

2013

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Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Sensors and actuators. A. Physical., 2012-12, Vol.188, p.103-110

2012

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High-energy density miniature thermoelectric generator using catalytic combustion

Journal of microelectromechanical systems, 2006-02, Vol.15 (1), p.195-203

2006

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P–N junction and metal contact reliability of SiC diode in high temperature (873K) environment

Solid-state electronics, 2014-04, Vol.94, p.82-85

2014

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Multilayered receive coil produced using a non-planar photofabrication process for an intraluminal magnetic resonance imaging

Sensors and actuators. A. Physical., 2017-07, Vol.261, p.130-139

2017

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Glass-forming ability and thermoplastic formability of a Pd40Ni40Si4P16 glassy alloy

Journal of materials science, 2011-04, Vol.46 (7), p.2091-2096

2011

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Precise motion control of a nanopositioning PZT microstage using integrated capacitive displacement sensors

Journal of micromechanics and microengineering, 2006-12, Vol.16 (12), p.2747-2754

2006

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Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass

Journal of microelectromechanical systems, 2002-12, Vol.11 (6), p.625-630

2002

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Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber

Journal of physics. Conference series, 2013-01, Vol.476 (1), p.12019-5

2013

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Maximum accuracy evaluation scheme for wireless saw delay-line sensors

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2008-07, Vol.55 (7), p.1640-1652

2008

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Deposition of conductivity-switching polyimide film by molecular layer deposition and electrical modification using scanning probe microscope

Micro & nano letters, 2010-10, Vol.5 (5), p.321-321

2010

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Medical and welfare applications of shape memory alloy microcoil actuators

Smart materials and structures, 2005-10, Vol.14 (5), p.S266-S272

2005

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Fabrication of piezoresistive nanocantilevers for ultra-sensitive force detection

Measurement science & technology, 2008-08, Vol.19 (8), p.084011-084011 (5)

2008

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Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

Journal of micromechanics and microengineering, 2011-08, Vol.21 (8), p.085002-7

2011

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Batch fabricated flat meandering shape memory alloy actuator for active catheter

Sensors and actuators. A. Physical., 2001-02, Vol.88 (2), p.112-120

2001

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Trench filling characteristics of low stress TEOS/ozone oxide deposited by PECVD and SACVD

Microsystem technologies : sensors, actuators, systems integration, 2004, Vol.10 (2), p.97-102

2004

Volltextzugriff (PDF)

A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

Microsystem technologies : sensors, actuators, systems integration, 2012-04, Vol.18 (4), p.515-521

2012

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Microprobe array with electrical interconnection for thermal imaging and data storage

Journal of microelectromechanical systems, 2002-06, Vol.11 (3), p.215-221

2002

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Silicon-carbide microfabrication by silicon lost molding for glass-press molds

Journal of microelectromechanical systems, 2006-08, Vol.15 (4), p.859-863

2006

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Optical Near-Field Probe Integrated With Self-Aligned Bow-Tie Antenna and Electrostatic Actuator for Local Field Enhancement

Journal of microelectromechanical systems, 2006-10, Vol.15 (5), p.1201-1208

2006

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Vacuum-sealed silicon micromachined pressure sensors

Proceedings of the IEEE, 1998-08, Vol.86 (8), p.1627-1639

1998

Volltextzugriff (PDF)

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Formation and properties of Au-based nanograined metallic glasses

Energy dissipation in submicrometer thick single-crystal silicon cantilevers

Biomedical microsystems for minimally invasive diagnosis and treatment

Thermal radiation from two-dimensionally confined modes in microcavities

Tactile display using shape memory alloy micro-coil actuator and magnetic latch mechanism

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

High-energy density miniature thermoelectric generator using catalytic combustion

P–N junction and metal contact reliability of SiC diode in high temperature (873K) environment

Multilayered receive coil produced using a non-planar photofabrication process for an intraluminal magnetic resonance imaging

Glass-forming ability and thermoplastic formability of a Pd40Ni40Si4P16 glassy alloy

Precise motion control of a nanopositioning PZT microstage using integrated capacitive displacement sensors

Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glass

Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber

Maximum accuracy evaluation scheme for wireless saw delay-line sensors

Deposition of conductivity-switching polyimide film by molecular layer deposition and electrical modification using scanning probe microscope

Medical and welfare applications of shape memory alloy microcoil actuators

Fabrication of piezoresistive nanocantilevers for ultra-sensitive force detection

Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI

Batch fabricated flat meandering shape memory alloy actuator for active catheter

Trench filling characteristics of low stress TEOS/ozone oxide deposited by PECVD and SACVD

A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

Microprobe array with electrical interconnection for thermal imaging and data storage

Silicon-carbide microfabrication by silicon lost molding for glass-press molds

Optical Near-Field Probe Integrated With Self-Aligned Bow-Tie Antenna and Electrostatic Actuator for Local Field Enhancement

Vacuum-sealed silicon micromachined pressure sensors

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