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Plasma cryogenic etching of silicon: from the early days to today's advanced technologies

Journal of physics. D, Applied physics, 2014-03, Vol.47 (12), p.1-27

2014

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Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Scientific reports, 2021-01, Vol.11 (1), p.357-357, Article 357

2021

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Cryogenic etching of silicon compounds using a CHF3 based plasma

Journal of applied physics, 2023-03, Vol.133 (11)

2023

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Author Correction: Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Scientific reports, 2022-02, Vol.12 (1), p.1979-1979, Article 1979

2022

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Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above −50 °C

Scientific reports, 2018-01, Vol.8 (1), p.1886-12, Article 1886

2018

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Cryo atomic layer etching of SiO2 by C4F8 physisorption followed by Ar plasma

Applied physics letters, 2019-10, Vol.115 (15)

2019

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Measuring the energy flux at the substrate position during magnetron sputter deposition processes

Journal of applied physics, 2013-01, Vol.113 (1)

2013

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Direct current microhollow cathode discharges on silicon devices operating in argon and helium

Plasma sources science & technology, 2018-02, Vol.27 (2), p.25005

2018

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The role of physisorption in the cryogenic etching process of silicon

Japanese Journal of Applied Physics, 2019-06, Vol.58 (SE), p.SEEB03

2019

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Modification of poly(styrene) thin films and enhancement of cryogenic plasma etching resistance by ruthenium tetroxide vapor staining

Polymer (Guilford), 2015-10, Vol.76, p.123-130

2015

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On the validity of neutral gas temperature by emission spectroscopy in micro-discharges close to atmospheric pressure

Plasma sources science & technology, 2019-05, Vol.28 (6), p.65003

2019

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IR emission from the target during plasma magnetron sputter deposition

Thin solid films, 2013-10, Vol.545, p.44-49

2013

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Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

Journal of physics. D, Applied physics, 2015-11, Vol.48 (43)

2015

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The effect of SF6 addition in a Cl2/Ar inductively coupled plasma for deep titanium etching

Journal of micromechanics and microengineering, 2018-03, Vol.28 (5)

2018

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Titanium oxide thin film growth by magnetron sputtering: Total energy flux and its relationship with the phase constitution

Surface & coatings technology, 2014-09, Vol.254 (2014), p.291-297

2014

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Alternated process for the deep etching of titanium

Journal of micromechanics and microengineering, 2014-07, Vol.24 (7), p.75021-10

2014

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Single and multilayered materials processing by argon ion beam etching: study of ion angle incidence and defect formation

Journal of micromechanics and microengineering, 2015-09, Vol.25 (9), p.95011-14

2015

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Energy transferred to the substrate surface during reactive magnetron sputtering of aluminum in Ar/O2 atmosphere

Thin solid films, 2013-07, Vol.539, p.88-95

2013

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Ignition dynamics of dry-etched vertical cavity single-hole microdischarge reactors in ac regime operating in noble gases

Journal of physics. D, Applied physics, 2014-08, Vol.47 (33), p.1-11

2014

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Deep GaN etching by inductively coupled plasma and induced surface defects

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2010-09, Vol.28 (5), p.1226-1233

2010

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Study of dc micro-discharge arrays made in silicon using CMOS compatible technology

Journal of physics. D, Applied physics, 2012-07, Vol.45 (28), p.285202-1-10

2012

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Highly sensitive measurements of the energy transferred during plasma sputter deposition of metals

Journal of physics. D, Applied physics, 2010-02, Vol.43 (6), p.065202-065202

2010

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Width-dependent interaction of trench-like microdischarges arranged in sub-arrays on a single silicon-based chip

Plasma sources science & technology, 2014-08, Vol.23 (4), p.45012-11

2014

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Parametric study of STiGer etching process in order to reduce extended formation of scalloping defects on the sidewalls of silicon submicron trenches

Vacuum, 2016-11, Vol.133, p.90-97

2016

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Ignition and extinction phenomena in helium micro hollow cathode discharges

Journal of applied physics, 2013-12, Vol.114 (24)

2013

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Plasma cryogenic etching of silicon: from the early days to today's advanced technologies

Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Cryogenic etching of silicon compounds using a CHF3 based plasma

Author Correction: Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above −50 °C

Cryo atomic layer etching of SiO2 by C4F8 physisorption followed by Ar plasma

Measuring the energy flux at the substrate position during magnetron sputter deposition processes

Direct current microhollow cathode discharges on silicon devices operating in argon and helium

The role of physisorption in the cryogenic etching process of silicon

Modification of poly(styrene) thin films and enhancement of cryogenic plasma etching resistance by ruthenium tetroxide vapor staining

On the validity of neutral gas temperature by emission spectroscopy in micro-discharges close to atmospheric pressure

IR emission from the target during plasma magnetron sputter deposition

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

The effect of SF6 addition in a Cl2/Ar inductively coupled plasma for deep titanium etching

Titanium oxide thin film growth by magnetron sputtering: Total energy flux and its relationship with the phase constitution

Alternated process for the deep etching of titanium

Single and multilayered materials processing by argon ion beam etching: study of ion angle incidence and defect formation

Energy transferred to the substrate surface during reactive magnetron sputtering of aluminum in Ar/O2 atmosphere

Ignition dynamics of dry-etched vertical cavity single-hole microdischarge reactors in ac regime operating in noble gases

Deep GaN etching by inductively coupled plasma and induced surface defects

Study of dc micro-discharge arrays made in silicon using CMOS compatible technology

Highly sensitive measurements of the energy transferred during plasma sputter deposition of metals

Width-dependent interaction of trench-like microdischarges arranged in sub-arrays on a single silicon-based chip

Parametric study of STiGer etching process in order to reduce extended formation of scalloping defects on the sidewalls of silicon submicron trenches

Ignition and extinction phenomena in helium micro hollow cathode discharges

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