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Multi-component nitride coatings derived from Ti–Al–Cr–Si–V target in RF magnetron sputter

Surface & coatings technology, 2007-04, Vol.201 (14), p.6304-6308

2007

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Corrosion behavior of (Ti-Al-Cr-Si-V)xNy coatings on mild steels derived from RF magnetron sputtering

Surface & coatings technology, 2008-12, Vol.203 (5-7), p.558-561

2008

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Electrochemical impedance spectroscopy (EIS) study on corrosion performance of CrAlSiN coated steels in 3.5 wt.% NaCl solution

Surface & coatings technology, 2009-12, Vol.204 (6), p.784-787

2009

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Self-template fabrication of multi-scaled ZnFe2O4 microspheres and their excellent lithium-ion storage properties

Journal of alloys and compounds, 2021-05, Vol.862, p.158342, Article 158342

2021

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Hardness evolution of NiTi and NiTiAl thin films under various annealing temperatures

Surface & coatings technology, 2008-03, Vol.202 (12), p.2737-2742

2008

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The effects of repeated heat-pressing on properties of pressable glass-ceramics

Journal of oral rehabilitation, 2009-02, Vol.36 (2), p.132-141

2009

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Mechanical characteristics and corrosion behavior of (Ti,Al)N coatings on dental alloys

Surface & coatings technology, 2005-12, Vol.200 (7), p.2100-2105

2005

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Luminescent mechanisms of ZnS:Cu:Cl and ZnS:Cu:Al phosphors

Thin solid films, 2001-07, Vol.392 (1), p.50-55

2001

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LiMn2O4 cathode doped with excess lithium and synthesized by co-precipitation for Li-ion batteries

Journal of power sources, 2003-03, Vol.115 (1), p.110-118

2003

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Biocompatibility of a titanium–aluminum nitride film coating on a dental alloy

Surface & coatings technology, 2004-11, Vol.188, p.745-749

2004

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Compositionally modulated microstructure in nano-layered Ni-P metallic glass composite coating prepared by electrodeposition

Surface & coatings technology, 2020-05, Vol.389, p.125636, Article 125636

2020

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Effect of aluminum on the corrosion behavior of NiTiAl thin films

Applied surface science, 2007-04, Vol.253 (12), p.5268-5273

2007

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Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying

Journal of electronic materials, 2003-04, Vol.32 (4), p.215-220

2003

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Martensite nucleation site and grain refinement in duplex titanium alloy weldment by active flux with nanoparticle addition

Science and technology of welding and joining, 2011-08, Vol.16 (6), p.514-521

2011

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Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

Journal of electronic materials, 2008-06, Vol.37 (6), p.845-851

2008

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Microstructure evaluation and strengthening mechanism of Ni–P–W alloy coatings

Surface & coatings technology, 2004-01, Vol.177, p.312-316

2004

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Application of electroless Ni–Zn–P film for under-bump metallization on solder joint

Scripta materialia, 2009-10, Vol.61 (7), p.748-751

2009

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Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Journal of electronic materials, 2006-10, Vol.35 (10), p.1773-1780

2006

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Kinetics of the crystallization in amorphous NiTi thin films

Journal of non-crystalline solids, 2007-05, Vol.353 (11-12), p.1060-1064

2007

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Characterizing the formation and growth of intermetallic compound in the solder joint

Journal of materials science, 1998-12, Vol.33 (23), p.5569-5572

1998

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Effect of L12 ordering in antiferromagnetic Ir-Mn epitaxial layer on exchange bias of FePd films

Journal of applied physics, 2015-05, Vol.117 (17)

2015

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Low-Temperature Sintering and Microwave Dielectric Properties of Anorthite-Based Glass-Ceramics

Journal of the American Ceramic Society, 2002-09, Vol.85 (9), p.2230-2235

2002

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Crystallite Size and Microstrain of Thermally Aged Low-Ceria- and Low-Yttria-Doped Zirconia

Journal of the American Ceramic Society, 1998-04, Vol.81 (4), p.853-860

1998

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Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly

Journal of materials science. Materials in electronics, 1999-03, Vol.10 (1), p.33-43

1999

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Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42sn58Bi solder during annealing

Journal of electronic materials, 2001-07, Vol.30 (7), p.878-884

2001

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Multi-component nitride coatings derived from Ti–Al–Cr–Si–V target in RF magnetron sputter

Corrosion behavior of (Ti-Al-Cr-Si-V)xNy coatings on mild steels derived from RF magnetron sputtering

Electrochemical impedance spectroscopy (EIS) study on corrosion performance of CrAlSiN coated steels in 3.5 wt.% NaCl solution

Self-template fabrication of multi-scaled ZnFe2O4 microspheres and their excellent lithium-ion storage properties

Hardness evolution of NiTi and NiTiAl thin films under various annealing temperatures

The effects of repeated heat-pressing on properties of pressable glass-ceramics

Mechanical characteristics and corrosion behavior of (Ti,Al)N coatings on dental alloys

Luminescent mechanisms of ZnS:Cu:Cl and ZnS:Cu:Al phosphors

LiMn2O4 cathode doped with excess lithium and synthesized by co-precipitation for Li-ion batteries

Biocompatibility of a titanium–aluminum nitride film coating on a dental alloy

Compositionally modulated microstructure in nano-layered Ni-P metallic glass composite coating prepared by electrodeposition

Effect of aluminum on the corrosion behavior of NiTiAl thin films

Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying

Martensite nucleation site and grain refinement in duplex titanium alloy weldment by active flux with nanoparticle addition

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging

Microstructure evaluation and strengthening mechanism of Ni–P–W alloy coatings

Application of electroless Ni–Zn–P film for under-bump metallization on solder joint

Electrical characteristics for Sn-Ag-Cu solder bump with Ti/Ni/Cu under-bump metallization after temperature cycling tests

Kinetics of the crystallization in amorphous NiTi thin films

Characterizing the formation and growth of intermetallic compound in the solder joint

Effect of L12 ordering in antiferromagnetic Ir-Mn epitaxial layer on exchange bias of FePd films

Low-Temperature Sintering and Microwave Dielectric Properties of Anorthite-Based Glass-Ceramics

Crystallite Size and Microstrain of Thermally Aged Low-Ceria- and Low-Yttria-Doped Zirconia

Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly

Interfacial reaction and microstructural evolution for electroplated Ni and electroless Ni in the under bump metallurgy with 42sn58Bi solder during annealing

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