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EMI from cavity modes of shielding enclosures-FDTD modeling and measurements

IEEE transactions on electromagnetic compatibility, 2000-02, Vol.42 (1), p.29-38

2000

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Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

IEEE transactions on electromagnetic compatibility, 1996-11, Vol.38 (4), p.557-566

1996

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Crack detection of a full-scale reinforced concrete girder with a distributed cable sensor

Smart materials and structures, 2005-06, Vol.14 (3), p.S88-S97

2005

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Power bus decoupling on multilayer printed circuit boards

IEEE transactions on electromagnetic compatibility, 1995-05, Vol.37 (2), p.155-166

1995

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Numerical modeling of electrostatic discharge generators

IEEE transactions on electromagnetic compatibility, 2003-05, Vol.45 (2), p.258-271

2003

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Power-bus decoupling with embedded capacitance in printed circuit board design

IEEE transactions on electromagnetic compatibility, 2003-02, Vol.45 (1), p.22-30

2003

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Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

IEEE transactions on electromagnetic compatibility, 2001-11, Vol.43 (4), p.588-599

2001

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DC power-bus noise isolation with power-plane segmentation

IEEE transactions on electromagnetic compatibility, 2003-05, Vol.45 (2), p.436-443

2003

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Common-mode current due to a trace near a PCB edge and its suppression by a guard band

IEEE transactions on electromagnetic compatibility, 2004-02, Vol.46 (1), p.46-53

2004

Volltextzugriff (PDF)

Wide-bandwidth multi-resolutional analysis of a surface-mounted PM synchronous machine

IEEE transactions on energy conversion, 1999-12, Vol.14 (4), p.1011-1018

1999

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FDTD modeling of common-mode radiation from cables

IEEE transactions on electromagnetic compatibility, 1996-08, Vol.38 (3), p.376-387

1996

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A Three-Dimensional FDTD Subgridding Algorithm With Separated Temporal and Spatial Interfaces and Related Stability Analysis

IEEE transactions on antennas and propagation, 2007-07, Vol.55 (7), p.1981-1990

2007

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Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards

IEEE transactions on electromagnetic compatibility, 2012-04, Vol.54 (2), p.421-433

2012

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EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling

IEEE transactions on electromagnetic compatibility, 2000-08, Vol.42 (3), p.265-275

2000

Volltextzugriff (PDF)

FDTD modeling of lumped ferrites

IEEE transactions on electromagnetic compatibility, 2000-05, Vol.42 (2), p.142-151

2000

Volltextzugriff (PDF)

EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

IEEE transactions on electromagnetic compatibility, 2001-11, Vol.43 (4), p.538-548

2001

Volltextzugriff (PDF)

Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures

IEEE transactions on electromagnetic compatibility, 1997-08, Vol.39 (3), p.225-232

1997

Volltextzugriff (PDF)

DC power-bus design using FDTD modeling with dispersive media and surface mount technology components

IEEE transactions on electromagnetic compatibility, 2001-11, Vol.43 (4), p.579-587

2001

Volltextzugriff (PDF)

EMI reduction from airflow aperture arrays using dual-perforated screens and loss

IEEE transactions on electromagnetic compatibility, 2000-05, Vol.42 (2), p.135-141

2000

Volltextzugriff (PDF)

Lumped-circuit model extraction for vias in multilayer substrates

IEEE transactions on electromagnetic compatibility, 2003-05, Vol.45 (2), p.272-280

2003

Volltextzugriff (PDF)

Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction

IEEE transactions on electromagnetic compatibility, 2007-08, Vol.49 (3), p.708-718

2007

Volltextzugriff (PDF)

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

IEEE microwave and wireless components letters, 2011-02, Vol.21 (2), p.62-64

2011

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An EMI estimate for shielding-enclosure evaluation

IEEE transactions on electromagnetic compatibility, 2001-08, Vol.43 (3), p.295-304

2001

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Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling

IEEE transactions on microwave theory and techniques, 2002-07, Vol.50 (7), p.1807-1815

2002

Volltextzugriff (PDF)

An experimentally obtainable heat source due to absorption of ultrasound in biological media

The Journal of the Acoustical Society of America, 1996-08, Vol.100 (2 Pt 1), p.1250

1996

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EMI from cavity modes of shielding enclosures-FDTD modeling and measurements

Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

Crack detection of a full-scale reinforced concrete girder with a distributed cable sensor

Power bus decoupling on multilayer printed circuit boards

Numerical modeling of electrostatic discharge generators

Power-bus decoupling with embedded capacitance in printed circuit board design

Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

DC power-bus noise isolation with power-plane segmentation

Common-mode current due to a trace near a PCB edge and its suppression by a guard band

Wide-bandwidth multi-resolutional analysis of a surface-mounted PM synchronous machine

FDTD modeling of common-mode radiation from cables

A Three-Dimensional FDTD Subgridding Algorithm With Separated Temporal and Spatial Interfaces and Related Stability Analysis

Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards

EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling

FDTD modeling of lumped ferrites

EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures

DC power-bus design using FDTD modeling with dispersive media and surface mount technology components

EMI reduction from airflow aperture arrays using dual-perforated screens and loss

Lumped-circuit model extraction for vias in multilayer substrates

Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

An EMI estimate for shielding-enclosure evaluation

Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling

An experimentally obtainable heat source due to absorption of ultrasound in biological media

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