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Psychische Gesundheit Bei Storungen Der Intelligenzentwicklung

2023

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LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

Journal of microelectronics and electronic packaging, 2018-04, Vol.15 (2), p.86-94

2018

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Room temperature wedge–wedge ultrasonic bonding using aluminum coated copper wire

Microelectronics and reliability, 2011, Vol.51 (1), p.97-106

2011

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Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire: COPPER WIRE BONDING

Microelectronics and reliability, 2011, Vol.51 (1), p.97-106

2011

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Psychische Gesundheit bei Störungen der Intelligenzentwicklung: Ein Lehrbuch für die Praxis

2nd ed., 2023

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New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications

IMAPSource Proceedings, 2023-05, Vol.2022 (Issue 1)

2023

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New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1898-1904

2022

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IEEE_Xplore

New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-6

2019

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Small form-factor, liquid-cooled SiPM module for PET/MRI applications

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, p.1-7

2017

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Psychische Gesundheit bei intellektueller Entwicklungsstörung: Ein Lehrbuch für die Praxis

1st ed., 2018

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LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.398-405

2017

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Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates

International Symposium on Microelectronics, 2015-10, Vol.2015 (1), p.799-805

2015

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Investigation of electromigration behaviour in lead-free flip-chip solders connections

Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014, p.1-5

2014

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IEEE_Xplore

On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.2030-2035

2015

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IEEE_Xplore

A new cost effective packaging technique for optoelectronic devices

1996 Proceedings 46th Electronic Components and Technology Conference, 1996, p.1301-1307

1996

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IEEE_Xplore

Very compact, water-cooled SiPM module for PET/MRT applications

2015 European Microelectronics Packaging Conference (EMPC), 2015, p.1-6

2015

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A compact, water-cooled, 144-channel photo sensor module for γ detection in PET

2014 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2014, p.1-4

2014

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A new bonding technique for microwave devices

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1996-02, Vol.19 (1), p.57-63

1996

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IEEE_Xplore

Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

International Symposium on Microelectronics, 2011-01, Vol.2011 (1), p.985-996

2011

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Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

International Symposium on Microelectronics, 2011-01, Vol.2011 (1), p.953-960

2011

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Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side

International Symposium on Microelectronics, 2013-01, Vol.2013 (1), p.523-530

2013

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Reliability study of lead-free flip-chips with solder bumps down to 30 μm diameter

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.583-589

2012

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IEEE_Xplore

Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter

International Symposium on Microelectronics, 2012-01, Vol.2012 (1), p.891-905

2012

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Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter

3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-8

2010

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IEEE_Xplore

Alignable lift-off transfer of device arrays via a single polymeric carrier membrane

1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.1274-1277

1995

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IEEE_Xplore

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Psychische Gesundheit Bei Storungen Der Intelligenzentwicklung

LTCC-Based Highly Integrated SiPM Module with Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

Room temperature wedge–wedge ultrasonic bonding using aluminum coated copper wire

Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire: COPPER WIRE BONDING

Psychische Gesundheit bei Störungen der Intelligenzentwicklung: Ein Lehrbuch für die Praxis

New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications

New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications

New Assembly Technology for VCSEL arrays comprising ultra-thin diodes

Small form-factor, liquid-cooled SiPM module for PET/MRI applications

Psychische Gesundheit bei intellektueller Entwicklungsstörung: Ein Lehrbuch für die Praxis

LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular Imaging

Study on electromigration in flip chip lead-free solder connections with 40 μm or 30 μm diameter on thin film ceramic substrates

Investigation of electromigration behaviour in lead-free flip-chip solders connections

On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration

A new cost effective packaging technique for optoelectronic devices

Very compact, water-cooled SiPM module for PET/MRT applications

A compact, water-cooled, 144-channel photo sensor module for γ detection in PET

A new bonding technique for microwave devices

Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side

Reliability study of lead-free flip-chips with solder bumps down to 30 μm diameter

Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter

Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter

Alignable lift-off transfer of device arrays via a single polymeric carrier membrane

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