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Microstructural Evolution and Mechanical Behavior of Cu/Nb Multilayer Composites Processed by Accumulative Roll Bonding

Advanced engineering materials, 2020-01, Vol.22 (1), p.n/a

2020

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Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Materials & design, 2023-05, Vol.229, p.111873, Article 111873

2023

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Ultra-High Strength in FCC+BCC High-Entropy Alloy via Different Gradual Morphology

Materials, 2024-09, Vol.17 (18), p.4535

2024

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Microstructure Evolution and Mechanical Properties of AlCoCrFeNi2.1 Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

Materials, 2024-06, Vol.17 (12), p.2954

2024

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A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag2Se-Based Ink

Materials, 2024-08, Vol.17 (15), p.3784

2024

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Characterization of stress drop and strain localization for titanium alloy subjected to electrically-assisted tension

Journal of materials research and technology, 2024-01, Vol.28, p.4600-4614

2024

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Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites

Heliyon, 2023-05, Vol.9 (5), p.e16231-e16231, Article e16231

2023

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Effects of current density on the mechanical properties and microstructures of CoCrFeNiMn high-entropy alloy

Journal of materials research and technology, 2024-03, Vol.29, p.1630-1641

2024

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Microhardness and Microstructural Evolution of Pure Nickel Processed by High-Pressure Torsion

Crystals (Basel), 2023-06, Vol.13 (6), p.887

2023

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Sustainable fabrication of Cu/Nb composites with continuous laminated structure to achieve ultrahigh strength and excellent electrical conductivity

Composites. Part B, Engineering, 2021-04, Vol.211, p.108662, Article 108662

2021

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Multiresponse Liquid Metal Bionic Flexible Actuator

Langmuir, 2024-07, Vol.40 (30), p.15710-15720

2024

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Bottom-up design of micro-/nano hierarchical surface for the enhancement of boiling heat transfer performance: A review

International journal of heat and mass transfer, 2024-12, Vol.234, p.126131, Article 126131

2024

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A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance

International journal of heat and mass transfer, 2024-10, Vol.231, p.125814, Article 125814

2024

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Poly(vinyl alcohol) hydrogels integrated with cuprous oxide–tannic acid submicroparticles for enhanced mechanical properties and synergetic antibiofouling

Journal of colloid and interface science, 2019-02, Vol.535, p.491-498

2019

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Fracture mechanism of electrically-assisted micro-tension in nanostructured titanium using synchrotron radiation X-ray tomography

Scripta materialia, 2023-01, Vol.222, p.114997, Article 114997

2023

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A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag[sub.2]Se-Based Ink

Materials, 2024-08, Vol.17 (15)

2024

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A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag 2 Se-Based Ink

Materials, 2024-08, Vol.17 (15)

2024

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The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites

Journal of materials science & technology, 2023-09, Vol.157, p.163-173

2023

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Electroplasticity in the Al0.6CoCrFeNiMn high entropy alloy subjected to electrically-assisted uniaxial tension

Journal of materials science & technology, 2023-06, Vol.148, p.209-221

2023

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Microstructure Evolution and Mechanical Properties of AlCoCrFeNi 2.1 Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

Materials, 2024-06, Vol.17 (12)

2024

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Microstructure Evolution and Mechanical Properties of AlCoCrFeNi[sub.2.1] Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

Materials, 2024-06, Vol.17 (12)

2024

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In situ TEM observations of thickness effect on grain growth in pure titanium thin films

Materials characterization, 2021-03, Vol.173, p.110929, Article 110929

2021

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Fabricating different patterns of flexible inorganic semiconductor films via colloidal ink printing on textiles

Materials letters, 2022-01, Vol.307, p.131079, Article 131079

2022

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Fabricating flexible wafer-size inorganic semiconductor devices

Journal of materials chemistry. C, Materials for optical and electronic devices, 2020-02, Vol.8 (6), p.1915-1922

2020

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Effect of the individual layer thickness and relative blanking clearance on micro-blanking for Cu/Nb multilayer composite sheets

MATEC web of conferences, 2024-01, Vol.401, p.04008

2024

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Microstructural Evolution and Mechanical Behavior of Cu/Nb Multilayer Composites Processed by Accumulative Roll Bonding

Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Ultra-High Strength in FCC+BCC High-Entropy Alloy via Different Gradual Morphology

Microstructure Evolution and Mechanical Properties of AlCoCrFeNi2.1 Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag2Se-Based Ink

Characterization of stress drop and strain localization for titanium alloy subjected to electrically-assisted tension

Influence of bimetal interface confinement on the Hall-petch slope of multiscale Cu/Nb multilayer composites

Effects of current density on the mechanical properties and microstructures of CoCrFeNiMn high-entropy alloy

Microhardness and Microstructural Evolution of Pure Nickel Processed by High-Pressure Torsion

Sustainable fabrication of Cu/Nb composites with continuous laminated structure to achieve ultrahigh strength and excellent electrical conductivity

Multiresponse Liquid Metal Bionic Flexible Actuator

Bottom-up design of micro-/nano hierarchical surface for the enhancement of boiling heat transfer performance: A review

A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance

Poly(vinyl alcohol) hydrogels integrated with cuprous oxide–tannic acid submicroparticles for enhanced mechanical properties and synergetic antibiofouling

Fracture mechanism of electrically-assisted micro-tension in nanostructured titanium using synchrotron radiation X-ray tomography

A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag[sub.2]Se-Based Ink

A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag 2 Se-Based Ink

The thermal instability mechanism and annealed deformation behavior of Cu/Nb nanolaminate composites

Electroplasticity in the Al0.6CoCrFeNiMn high entropy alloy subjected to electrically-assisted uniaxial tension

Microstructure Evolution and Mechanical Properties of AlCoCrFeNi 2.1 Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

Microstructure Evolution and Mechanical Properties of AlCoCrFeNi[sub.2.1] Eutectic High-Entropy Alloys Processed by High-Pressure Torsion

In situ TEM observations of thickness effect on grain growth in pure titanium thin films

Fabricating different patterns of flexible inorganic semiconductor films via colloidal ink printing on textiles

Fabricating flexible wafer-size inorganic semiconductor devices

Effect of the individual layer thickness and relative blanking clearance on micro-blanking for Cu/Nb multilayer composite sheets

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