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Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applications

Science and technology of advanced materials, 2022-12, Vol.23 (1), p.735-751

2022

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Skin electroporation for transdermal drug delivery: Electrical measurements, numerical model and molecule delivery

Journal of controlled release, 2024-03, Vol.367, p.235-247

2024

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Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging

IEEE transactions on power electronics, 2014-05, Vol.29 (5), p.2281-2288

2014

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Non-symmetrical electric response in CaCu 3 Ti 4 O 12 and La 0.05 Ba 0.95 TiO 3−δ -SPS materials

Journal of physics. D, Applied physics, 2010-09, Vol.43 (38), p.385401

2010

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Non-symmetrical electric response in CaCu3Ti4O12 and La0.05Ba0.95TiO3- Delta d-SPS materials

Journal of physics. D, Applied physics, 2010-09, Vol.43 (38), p.385401-385401

2010

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Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging: SPECIAL ISSUE ON WIDE BANDGAP DEVICES AND THEIR APPLICATIONS

IEEE transactions on power electronics, 2014, Vol.29 (5), p.2281-2288

2014

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Non-symmetrical electric response in CaCu3Ti4O12 and La0.05Ba0.95TiO3−δ-SPS materials

Journal of physics. D, Applied physics, 2010-09, Vol.43 (38), p.385401

2010

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Additive Manufactured Dielectrics for Aerospace Electrical Insulation Applications

2022 IEEE Electrical Insulation Conference (EIC), 2022, p.58-62

2022

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Partial discharges monitoring in twisted pair fed with PWM inverter using non-intrusive sensors

2013 IEEE International Conference on Solid Dielectrics (ICSD), 2013, p.314-317

2013

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Dielectric Breakdown of Polyimide Films: Area, Thickness and Temperature Dependence Study

IEEE transactions on dielectrics and electrical insulation, 2010, Vol.17 (1), p.18-27

2010

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Partial Discharges and AC Breakdown Voltage Tests on Thick Metallized Aluminum Nitride Substrates for High Voltage Power Modules

2023 IEEE Electrical Insulation Conference (EIC), 2023, p.1-5

2023

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Thermal Degradation Kinetics of High Temperature Polymers for Aeronautic Cables Insulation

2021 IEEE International Conference on the Properties and Applications of Dielectric Materials (ICPADM), 2021, p.294-297

2021

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On-line non intrusive PDs' measurements on aeronautical systems

2017 International Symposium on Electrical Insulating Materials (ISEIM), 2017, Vol.1, p.99-103

2017

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Temperature measurement method for dielectric layer characterization in a high voltage vacuum prober

2017 International Symposium on Electrical Insulating Materials (ISEIM), 2017, Vol.2, p.765-767

2017

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Methodology for Analysis of Electrical Breakdown In Micrometer gaps in Tip-To-Plane Configuration

2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), 2018, p.1-4

2018

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Partial discharge inception voltage of pressurized gas insulation encapsulation used for high-temperature and high-voltage power module

2015 IEEE 11th International Conference on Power Electronics and Drive Systems, 2015, p.118-121

2015

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Using non-intrusive sensors to detect partial discharges in a PWM inverter environment: A twisted pair example

2013 IEEE Electrical Insulation Conference (EIC), 2013, p.329-332

2013

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Fundamental investigation of dielectric phenomena in epoxy composites during curing process under a uniform electric field

2012 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2012, p.574-550

2012

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Packaging of SiC-SBD for high temperature operation

2012 14th International Conference on Electronic Materials and Packaging (EMAP), 2012, p.1-4

2012

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Evaluation of partial discharge inception voltage of bonding-less gas insulation packaging for high temperature and high voltage power module

Proceedings of 2014 International Symposium on Electrical Insulating Materials, 2014, p.425-428

2014

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Development of a new package for next generation power semiconductor devices: Toward high temperature and high voltage applications

2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS), 2013, p.512-516

2013

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Reducing Loneliness and Social Isolation of Older Adults Through Voice Assistants: Literature Review and Bibliometric Analysis

Journal of medical Internet research, 2024-03, Vol.26 (4), p.e50534-e50534

2024

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Innovative ceramic-matrix composite substrates with tunable electrical conductivity for high-power applications

Skin electroporation for transdermal drug delivery: Electrical measurements, numerical model and molecule delivery

Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging

Non-symmetrical electric response in CaCu 3 Ti 4 O 12 and La 0.05 Ba 0.95 TiO 3−δ -SPS materials

Non-symmetrical electric response in CaCu3Ti4O12 and La0.05Ba0.95TiO3- Delta d-SPS materials

Evaluation of Encapsulation Materials for High-Temperature Power Device Packaging: SPECIAL ISSUE ON WIDE BANDGAP DEVICES AND THEIR APPLICATIONS

Non-symmetrical electric response in CaCu3Ti4O12 and La0.05Ba0.95TiO3−δ-SPS materials

Additive Manufactured Dielectrics for Aerospace Electrical Insulation Applications

Partial discharges monitoring in twisted pair fed with PWM inverter using non-intrusive sensors

Dielectric Breakdown of Polyimide Films: Area, Thickness and Temperature Dependence Study

Partial Discharges and AC Breakdown Voltage Tests on Thick Metallized Aluminum Nitride Substrates for High Voltage Power Modules

Thermal Degradation Kinetics of High Temperature Polymers for Aeronautic Cables Insulation

On-line non intrusive PDs' measurements on aeronautical systems

Temperature measurement method for dielectric layer characterization in a high voltage vacuum prober

Methodology for Analysis of Electrical Breakdown In Micrometer gaps in Tip-To-Plane Configuration

Partial discharge inception voltage of pressurized gas insulation encapsulation used for high-temperature and high-voltage power module

Using non-intrusive sensors to detect partial discharges in a PWM inverter environment: A twisted pair example

Fundamental investigation of dielectric phenomena in epoxy composites during curing process under a uniform electric field

Packaging of SiC-SBD for high temperature operation

Evaluation of partial discharge inception voltage of bonding-less gas insulation packaging for high temperature and high voltage power module

Development of a new package for next generation power semiconductor devices: Toward high temperature and high voltage applications

Reducing Loneliness and Social Isolation of Older Adults Through Voice Assistants: Literature Review and Bibliometric Analysis

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